-
1.发明公开
公开(公告)号：EP1863079A2
公开(公告)日：2007-12-05
申请号：EP07010855.0
申请日：2007-06-01
IPC分类号： H01L21/673
CPC分类号： H01L21/67303
摘要： A wafer holding apparatus including a plurality of rods joined at opposite ends to endplates by joints having flanges with a fillet radius. The joints which join the component parts of the apparatus provide a stable wafer holding apparatus for manual handling as well as for the harsh processing conditions of semiconductor wafer processing chambers.
摘要翻译： 一种晶片保持装置，包括通过具有圆角半径的凸缘的接头在相对端连接到端板的多个杆。 连接装置的部件的接头提供用于手动操作的稳定的晶片保持装置以及半导体晶片处理室的恶劣处理条件。
-
公开(公告)号：EP1530065A1
公开(公告)日：2005-05-11
申请号：EP04256842.8
申请日：2004-11-04
发明人： Goela, Jitendra S. , Pickering, Michael A. , Triba, Jamie L. , Lefebvre, Mark J. , Chirafisi, Angelo , Brown, Neil
CPC分类号： G02B1/10 , G02B5/00 , H05B2203/013
摘要： An optical article and method of making the same are provided. The optical article has optical multi-aperture operation. The optical article has one or more electrically conductive and selectively passivated patterns.
摘要翻译： 提供了一种光学制品及其制造方法。 光学制品具有光学多孔径操作。 光学制品具有一个或多个导电和选择性钝化图案。
-
公开(公告)号：EP1772901A3
公开(公告)日：2009-04-01
申请号：EP06255157.7
申请日：2006-10-05
IPC分类号： H01L21/687
CPC分类号： H01L21/68735 , C23C16/345 , C23C16/4581 , C30B25/12 , H01L21/67306 , H01L21/67309 , H01L21/68757 , H01L21/68785
摘要： The present invention is directed to semiconductor wafer processing to provide semiconductor wafers having reduced defects. More specifically, the present invention is directed to semiconductor wafer processing to provide semicondutor wafers having reduced defects processed in wafer holding articles with reduced surface roughness.
-
公开(公告)号：EP1530065B1
公开(公告)日：2008-09-10
申请号：EP04256842.8
申请日：2004-11-04
发明人： Goela, Jitendra S. , Pickering, Michael A. , Triba, Jamie L. , Lefebvre, Mark J. , Chirafisi, Angelo , Brown, Neil
CPC分类号： G02B1/10 , G02B5/00 , H05B2203/013
摘要： An optical article and method of making the same are provided. The optical article has optical multi-aperture operation. The optical article has one or more electrically conductive and selectively passivated patterns.
-
5.发明公开Wafer holding article and method for semiconductor processing 有权Waferhalter und Verfahren zur Halbleiterverarbeitung
公开(公告)号：EP1772901A2
公开(公告)日：2007-04-11
申请号：EP06255157.7
申请日：2006-10-05
IPC分类号： H01L21/687
CPC分类号： H01L21/68735 , C23C16/345 , C23C16/4581 , C30B25/12 , H01L21/67306 , H01L21/67309 , H01L21/68757 , H01L21/68785
摘要： The present invention is directed to semiconductor wafer processing to provide semiconductor wafers having reduced defects. More specifically, the present invention is directed to semiconductor wafer processing to provide semicondutor wafers having reduced defects processed in wafer holding articles with reduced surface roughness.
摘要翻译： 本发明涉及提供具有减少的缺陷的半导体晶片的半导体晶片处理。 更具体地，本发明涉及半导体晶片处理，以提供具有减小的表面粗糙度的晶片保持制品中处理的具有减少的缺陷的半导体晶片。
-
公开(公告)号：EP1863079A3
公开(公告)日：2009-06-03
申请号：EP07010855.0
申请日：2007-06-01
IPC分类号： H01L21/673
CPC分类号： H01L21/67303
摘要： A wafer holding apparatus including a plurality of rods joined at opposite ends to endplates by joints having flanges with a fillet radius. The joints which join the component parts of the apparatus provide a stable wafer holding apparatus for manual handling as well as for the harsh processing conditions of semiconductor wafer processing chambers.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.013 秒)
