摘要:
New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials having a water contact angle that can be changed by treatment with base and/or one or more materials that comprise fluorinated photoacid-labile groups and/or one or more materials that comprise acidic groups spaced from a polymer backbone. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
摘要:
A polymer comprises the polymerized product of monomers comprising a nitrogen-containing monomer comprising formula (Ia), formula (Ib), or a combination of formulas (Ia) and (Ib), and an acid-deprotectable monomer having the formula (II):
wherein a is 0 or 1, each R a is independently H, F, C 1-10 alkyl, or C 1-10 fluoroalkyl, L 1 is a straight chain or branched C 1-20 alkylene group, or a monocyclic, polycyclic, or fused polycyclic C 3-20 cycloalkylene group, each R b is independently H, C 1-10 alkyl, C 3-20 cycloalkyl, C 3-20 heterocycloalkyl, an aliphatic C 5-20 oxycarbonyl, or a C 1-30 acyl group optionally including a heteroatom substituent group, where each R b is separate or at least one R b is attached to an adjacent R b ; LN is a nitrogen-containing monocyclic, polycyclic, or fused polycyclic C 3-20 heterocycloalkylene group, and X is H, C 1-10 alkyl, aliphatic C 5-20 oxycarbonyl, or a C 1-30 acyl group optionally including a heteroatom substituent group; and each R c is independently C 1-10 alkyl, C 3-20 cycloalkyl, or C 3-20 heterocycloalkyl, wherein each R c is separate or at least one R c is attached to an adjacent R c .
摘要:
New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials having a water contact angle that can be changed by treatment with base and/or one or more materials that comprise fluorinated photoacid-labile groups and/or one or more materials that comprise acidic groups spaced from a polymer backbone. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
摘要:
New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials having a water contact angle that can be changed by treatment with base and/or one or more materials that comprise fluorinated photoacid-labile groups and/or one or more materials that comprise acidic groups spaced from a polymer backbone. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
摘要:
New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials having a water contact angle that can be changed by treatment with base and/or one or more materials that comprise fluorinated photoacid-labile groups and/or one or more materials that comprise acidic groups spaced from a polymer backbone. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
摘要:
New methods are provided for synthesis of photoacid generator compounds ("PAGs"), new photoacid generator compounds and photoresist compositions that comprise such PAG compounds. In a particular aspect, sulfonium-containing (S+) photoacid generators and methods of synthesis of sulfonium photoacid generators are provided.
摘要:
New methods are provided for synthesis of photoacid generator compounds ("PAGs"), new photoacid generator compounds and photoresist compositions that comprise such PAG compounds. In a particular aspect, sulfonium-containing (S+) photoacid generators and methods of synthesis of sulfonium photoacid generators are provided.