公开(公告)号：EP2182097B1

公开(公告)日：2014-04-23

申请号：EP09155461.8

申请日：2009-03-18

申请人： Rohm and Haas Electronic Materials LLC

发明人： Morii, Yutaka

IPC分类号： C23C18/48 ,  H05K3/34 ,  H05K3/24

CPC分类号： C09D7/1233 ,  C09D7/63 ,  C23C18/48 ,  C23C22/58 ,  C25D3/32 ,  C25D3/60 ,  H01L21/4835 ,  H05K3/22 ,  H05K3/244 ,  H05K3/3473 ,  H05K2201/0769 ,  H05K2203/0789 ,  H05K2203/122

摘要： A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.

公开(公告)号：EP2182097A1

公开(公告)日：2010-05-05

申请号：EP09155461.8

申请日：2009-03-18

申请人： Rohm and Haas Electronic Materials LLC

发明人： Morii, Yutaka

IPC分类号： C25D3/32 ,  C25D3/60 ,  C23C18/48 ,  H05K3/24 ,  H05K3/34

CPC分类号： C09D7/1233 ,  C09D7/63 ,  C23C18/48 ,  C23C22/58 ,  C25D3/32 ,  C25D3/60 ,  H01L21/4835 ,  H05K3/22 ,  H05K3/244 ,  H05K3/3473 ,  H05K2201/0769 ,  H05K2203/0789 ,  H05K2203/122

摘要： A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.

摘要翻译： 锡或锡合金镀膜表面处理wässrige溶液也可减少锡或锡合金镀膜，电影的表面上的晶须，并且可以提供良好的锡或锡合金镀膜，使用锡或锡合金镀膜的简单方法做 上的电子部件被使用。