公开(公告)号：EP3244445A1

公开(公告)日：2017-11-15

申请号：EP17166195.2

申请日：2017-04-12

Applicant: Rosemount Aerospace Inc.

Inventor： Golden, Jim ,  Barwig, David

IPC: H01L21/58

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/562 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/45099 ,  H01L2924/0715 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20105 ,  H01L2224/05599

Abstract: An integrated circuit (36) is attached to a substrate (30) with a controlled stand-off height, by mounting a plurality of stud bumps (32) of the controlled stand-off height to the substrate (30) at predetermined locations, placing adhesive dots (34) over the stud bumps (32), placing the integrated circuit (36) on the substrate (30) over the adhesive dots (34), and applying downward pressure on the integrated circuit (36) until the integrated circuit is in mechanical contact with the stud bumps (32).

Abstract translation: 通过在预定位置处将具有受控脱离高度的多个柱形凸块（32）安装到基板（30），将集成电路（36）附接到具有受控制的脱离高度的基板（30） （32）上方的粘合剂点（34），将集成电路（36）放置在衬底（30）上粘合剂点（34）上方，并向集成电路（36）施加向下的压力，直到集成电路 与柱形凸块（32）机械接触。