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1.发明公开SIMULTANEOUS AND SELECTIVE PARTITIONING OF VIA STRUCTURES USING PLATING RESIST 有权同时和选择性触点断开用孔结构采用抵制
公开(公告)号：EP1856723A4
公开(公告)日：2010-08-04
申请号：EP06737501
申请日：2006-03-06
Applicant: SANMINA SCI CORP
Inventor： DUDNIKOV GEORGE JR
CPC classification number: H05K3/429 , H05K1/0257 , H05K1/0259 , H05K1/116 , H05K1/167 , H05K3/184 , H05K3/422 , H05K2201/0187 , H05K2201/0738 , H05K2201/096 , H05K2201/09645 , H05K2201/09718 , H05K2201/09881 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49139 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
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