公开(公告)号：EP3255962A1

公开(公告)日：2017-12-13

申请号：EP16746502.0

申请日：2016-01-28

Applicant: Fujikura Ltd.

Inventor： OGURA, Shingo

IPC: H05K1/02 ,  H01B5/14 ,  H05K3/24

CPC classification number: H01B5/14 ,  H05K1/02 ,  H05K1/0283 ,  H05K1/0393 ,  H05K3/24 ,  H05K3/285 ,  H05K3/287 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/09227

Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.

Abstract translation: 一种可拉伸的接线板包括：一个可拉伸的底座; 至少一个设置在所述可伸展基部上的可拉伸布线; 以及在俯视观察上述伸缩性基体时在与伸缩性配线的厚度方向上的至少一部分重叠的位置设置的伸缩性较差的部件。 该不良伸缩构件抑制伴随伸缩性基体的伸缩变形的伸缩性布线的电阻值的变化。 结果，可以确保稳定的可操作性而不影响电子部件的操作电压。

公开(公告)号：EP2621256A4

公开(公告)日：2017-04-26

申请号：EP11845874

申请日：2011-01-05

Applicant: RAYBEN TECH (ZHU HAI) LTD

Inventor： WANG ZHENG

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H05K2201/0187 ,  H05K2201/10106

公开(公告)号：EP3149769A1

公开(公告)日：2017-04-05

申请号：EP14893556.2

申请日：2014-05-28

Applicant: Intel Corporation

Inventor： HU, Chuan ,  ELSHERBINI, Adel A. ,  TOMITA, Yoshihiro ,  LIFF, Shawna

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/60

CPC classification number: H05K1/0283 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/1515 ,  H01L2924/181 ,  H05K1/036 ,  H05K1/185 ,  H05K3/1275 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/10151 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了用于可弯曲和可拉伸装置的波浪互连以及相关联的技术和构造。 在一个实施例中，互连组件包括限定平面的柔性衬底和设置在柔性衬底上的波纹互连，并且被配置为沿与平面共面的第一方向布置集成电路（IC）器件的电信号， 互连件具有从垂直于第一方向并与该平面共面的第二方向的波状轮廓。 可以描述和/或要求保护其他实施例。

公开(公告)号：EP3126851A1

公开(公告)日：2017-02-08

申请号：EP15713895.9

申请日：2015-04-02

Applicant: Feinmetall GmbH

Inventor： EKIN, Cetin

IPC: G01R1/04 ,  G01R31/28 ,  G01R1/073 ,  H01R12/71 ,  H01R12/91 ,  H05K3/12 ,  H05K3/46 ,  H05K1/16 ,  H05K1/11 ,  G01R1/067

CPC classification number: G01R1/07371 ,  G01R1/0491 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2889 ,  H01L21/67288 ,  H01R12/714 ,  H01R12/91 ,  H05K1/0296 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/1241 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4664 ,  H05K3/4673 ,  H05K2201/0187 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/0126 ,  H05K2203/159

Abstract: The invention relates to a contact-distance transformer (4) of an electrical testing device (1) for testing an electrical test item (7), in particular wafers (8), said contact-distance transformer (4) being suitable for reducing the distance between electrical contacts (16, 19) arranged next to one another, and having a non-electrically conductive carrier structure (28) occupying a first side (17) and a second side (18), wherein first electrical contacts (16) are arranged on the first side (17) at a contact distance (a) to one another, and second electrical contacts (19) are arranged on the second side (18) at a smaller contact distance (b) to one another in relation to the first contacts (16) of the first side (17), wherein the first contacts (16) are connected to the second contacts (19) via electrical connections (20) which are passing through the carrier structure (28) and/or which are arranged on the carrier structure (28). According to the invention, both the carrier structure (28) and the electrical connections (20) are formed as 3D-printed components (27). The invention also relates to an electrical testing device (1), and a method for producing a contact-distance transformer (4).

Abstract translation: 电检测装置的电检体的检测的接触距离变压器：诸如晶片，用于降低邻近电触头之间的距离，具有带有第一侧与第一电接触的非导电性的支撑结构的变压器定位开的 第一距离和与第二电触点的第二侧面定位开的第二，较小的距离。 所述第一触点连接到通过穿过支撑结构和/或其中的电连接的第二触点在所述支撑结构被定位。

公开(公告)号：EP2732680A1

公开(公告)日：2014-05-21

申请号：EP12748378.2

申请日：2012-07-12

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： SEBANZ, Simon ,  VORABERGER, Hannes

IPC: H05K3/46 ,  H05K1/14

CPC classification number: H05K1/02 ,  H05K3/0055 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/2072 ,  H05K2203/1461 ,  Y10T29/49155

Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: - providing at least two elements (1, 3) of insulating material - coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface - covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface - building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

Abstract translation: 一种制造印刷电路板或一的方法，子组件及其包括以下步骤： - 提供至少两个元件（1,3）的绝缘材料 - 耦合或连接元件（1,3）上的绝缘材料中的至少 一个相邻的侧表面 - 覆盖所述元件（1,3）的绝缘材料与导电材料的至少一个表面上的层（4） - 建立至少一个Furtherwirt层（5，6，7，8）的印刷 电路板（10）至少部分地在绝缘材料中的元素（1,3）。 更多另外的印刷电路板（10）或子组件及其设置。

公开(公告)号：EP2672789A2

公开(公告)日：2013-12-11

申请号：EP13161463.8

申请日：2013-03-27

Applicant: General Electric Company

Inventor： McConnelee, Paul Alan ,  Burke, Elizabeth Ann ,  Smith, Scott

IPC: H05K1/18 ,  H01L25/10 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H01L21/60 ,  H01L23/538

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L25/105 ,  H01L2021/60 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/467 ,  H05K3/4673 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09136 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A method of forming a buried die module includes providing an initial laminate flex layer 18 and forming a die opening 28 through the initial laminate flex layer. A first uncut laminate flex layer 32 is secured to the first surface 14 of the initial laminate flex layer 18 by way of an adhesive material and a die 30 is positioned within the die opening of the initial laminate flex layer and onto the adhesive material. A second uncut laminate flex layer 38 is secured to the second surface 26 of the initial laminate flex layer 18 by way of an adhesive material and the adhesive material between the first uncut laminate flex layer 32 and the initial laminate flex layer and between the second uncut laminate flex layer 38 and the initial laminate flex layer 18 is cured. A plurality of vias 20 and metal interconnects 22 are formed in and on the first and second uncut laminate flex layers 32,38 with each of the metal interconnects extending through a respective via and being directly metalized to a metal interconnect on the initial laminate flex layer 18 or a die pad on the die 30.

Abstract translation: 形成埋入模具模块的方法包括提供初始层压柔性层18并通过初始层叠柔性层形成模具开口28。 第一未切割层压柔性层32通过粘合剂材料固定到初始层压柔性层18的第一表面14，并且模具30定位在初始层压柔性层的模具开口内并粘附到粘合剂材料上。 第二未切割层压板柔性层38通过粘合剂材料固定到初始层叠柔性层18的第二表面26上，并且第一未切割层压板柔性层32和初始层压板柔性层之间以及第二未切割层之间的粘合材料 层压柔性层38和初始层压柔性层18固化。 多个通孔20和金属互连22形成在第一和第二未切割层压柔性层32,38内和第二未切割层压柔性层32,38之间，其中每个金属互连件延伸通过相应的通孔并直接金属化到初始层压柔性层上的金属互连 18或管芯30上的管芯焊盘。

公开(公告)号：EP2658356A1

公开(公告)日：2013-10-30

申请号：EP11850812.6

申请日：2011-01-06

Applicant: Rayben Technologies (Zhu Hai) Ltd

Inventor： WANG, Zheng

IPC: H05K3/46

CPC classification number: H05K1/0204 ,  H01L33/642 ,  H05K3/4623 ,  H05K2201/0187 ,  H05K2201/10106 ,  H05K2203/063

Abstract: The invention relates to a manufacturing method for a printed circuit board (PCB) with an insulated micro radiator. Comparing with the manufacturing method for a conventional PCB, the method adds a step that: one or more one high thermal conductivity insulated micro radiators in cylindrical shape is embedded into the PCB, and heating component is provided on the top copper pattern of one or a number of insulated micro radiators. The invention combines the high thermal conductivity insulated micro radiator with a conventional rigid PCB. The PCB has the advantages of high thermal conductivity and heat transfer stability of the insulated micro radiator as well as the advantages of flexible routing and reliable electrical connection of the conventional PCB. Moreover, it can transmit the heat generated by the heating components such as LED components and so on out of the PCB during operation, timely and effectively. Therefore, it is an ideal carrier board for the heating component and an array thereof. The manufacturing method has the advantages of simple, convenience for operation and high productivity.

Abstract translation: 本发明涉及一种具有绝缘微型散热器的印刷电路板（PCB）的制造方法。 与传统PCB的制造方法相比，该方法增加了一个步骤：将一个或多个圆柱形的高导热绝缘微型散热器嵌入PCB中，并且在一个或多个PCB的顶部铜图案上提供加热部件 绝缘微型散热器数量。 本发明将高导热绝缘微型散热器与传统的刚性PCB组合在一起。 该PCB具有绝缘微型散热器的高导热性和传热稳定性以及传统PCB柔性布线和可靠电连接的优点。 此外，可以及时有效地将由LED部件等发热部件产生的热量传送出PCB。 因此，它是用于加热部件的理想载体板及其阵列。 该制造方法具有操作简便，生产效率高等优点。

公开(公告)号：EP2656704A1

公开(公告)日：2013-10-30

申请号：EP11850910.8

申请日：2011-06-16

Applicant: Anomax SDN BHD

Inventor： ONG, Ling Ping

IPC: H05K7/20 ,  H05K1/03

CPC classification number: H05K3/46 ,  C23C18/1605 ,  C23C18/1651 ,  C25D5/022 ,  C25D5/12 ,  C25D11/246 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/053 ,  H05K2201/0187

Abstract: A method of preparing a non-ferrous metal substrate for plating includes providing an anodized layer on an aluminum substrate and electrically isolating the anodized layer from the non-ferrous metal substrate by applying an electrically non-conductive micro-filler to the anodized layer to form a filled region of the anodized layer electrically isolating the anodized layer from the non-ferrous metal substrate.

公开(公告)号：EP2081419B1

公开(公告)日：2013-08-07

申请号：EP09156903.8

申请日：2000-09-01

Applicant: Ibiden Co., Ltd.

Inventor： Inagaki, Yasushi c/o Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Asai, Motoo c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Wang, Dongdong c/o Ogaki-kita-kojou, Ibiden Co., Ltd., ,  Yabashi, Hideo c/o Ogaki-kita-kojou Ibiden Co., Ltd., ,  Shirai, Seiji c/o Ogaki-kita-kojou, Ibiden Co., Ltd.,

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

公开(公告)号：EP1951016B1

公开(公告)日：2013-05-29

申请号：EP06822610.9

申请日：2006-10-30

Applicant: Ibiden Co., Ltd.

Inventor： TAKAHASHI, Michimasa ,  AOYAMA, Masakazu

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096