公开(公告)号：EP1091831A1

公开(公告)日：2001-04-18

申请号：EP99955238.3

申请日：1999-06-01

申请人： SCAPA GROUP PLC ,  LAM RESEARCH CORPORATION

发明人： LOMBARDO, Brian ,  BAJAJ, Rajeev

IPC分类号： B24D3/26 ,  B24D3/34 ,  B24D11/00 ,  B24B37/04

CPC分类号： B24B37/24 ,  B24D3/26 ,  B24D3/34 ,  B24D11/001

摘要： A polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency. The relatively moisture resistant polishing pad contains additives to improve wetting of the pad surface for good slurry distribution.

公开(公告)号：EP1214174B1

公开(公告)日：2004-02-11

申请号：EP00954098.0

申请日：2000-08-16

申请人： LAM RESEARCH CORPORATION ,  SCAPA GROUP PLC

发明人： XU, Cangshan ,  LOMBARDO, Brian, S. ,  BAJAJ, Rajeev ,  SURANA, Rahul, K.

IPC分类号： B24B37/04 ,  B24D11/00 ,  B24B49/04 ,  B24B49/12

CPC分类号： B24B37/205 ,  B24B49/04 ,  B24B49/12 ,  B24D11/008

摘要： A belt (12) for polishing a workpiece (11) such as a semiconductor wafer in a chemical mechanical polishing system (10) includes an endless belt. The belt (12) has an aperture (40). The aperture is unobstructed, such as using no window. The system (10) includes a belt (12), a first roller (14), a second roller (13), a platen (25), a polishing head (18), a slurry dispenser (21), a conditioner (20), a monitor (28) and a controller (30). One or more apertures (40) may be provided through the belt (12). Preferably, three apertures (40) are evenly spaced apart along the length of the belt (12). The apertures are positioned in the belt (12) between the edges (19). The monitor (28) uses the aperture (40) to measure a property of the wafer (11). The monitor (28) comprises a light emitting and reception device for determining the type of film and/or film thickness of the surface of the wafer (11).

公开(公告)号：EP1214174A1

公开(公告)日：2002-06-19

申请号：EP00954098.0

申请日：2000-08-16

申请人： LAM RESEARCH CORPORATION ,  SCAPA GROUP PLC

发明人： XU, Cangshan ,  LOMBARDO, Brian, S. ,  BAJAJ, Rajeev ,  SURANA, Rahul, K.

IPC分类号： B24B37/04 ,  B24D11/00 ,  B24B49/04 ,  B24B49/12

CPC分类号： B24B37/205 ,  B24B49/04 ,  B24B49/12 ,  B24D11/008

摘要： A belt (12) for polishing a workpiece (11) such as a semiconductor wafer in a chemical mechanical polishing system (10) includes an endless belt. The belt (12) has an aperture (40). The aperture is unobstructed, such as using no window. The system (10) includes a belt (12), a first roller (14), a second roller (13), a platen (25), a polishing head (18), a slurry dispenser (21), a conditioner (20), a monitor (28) and a controller (30). One or more apertures (40) may be provided through the belt (12). Preferably, three apertures (40) are evenly spaced apart along the length of the belt (12). The apertures are positioned in the belt (12) between the edges (19). The monitor (28) uses the aperture (40) to measure a property of the wafer (11). The monitor (28) comprises a light emitting and reception device for determining the type of film and/or film thickness of the surface of the wafer (11).