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1.发明授权
公开(公告)号：EP1214174B1
公开(公告)日：2004-02-11
申请号：EP00954098.0
申请日：2000-08-16
CPC分类号： B24B37/205 , B24B49/04 , B24B49/12 , B24D11/008
摘要： A belt (12) for polishing a workpiece (11) such as a semiconductor wafer in a chemical mechanical polishing system (10) includes an endless belt. The belt (12) has an aperture (40). The aperture is unobstructed, such as using no window. The system (10) includes a belt (12), a first roller (14), a second roller (13), a platen (25), a polishing head (18), a slurry dispenser (21), a conditioner (20), a monitor (28) and a controller (30). One or more apertures (40) may be provided through the belt (12). Preferably, three apertures (40) are evenly spaced apart along the length of the belt (12). The apertures are positioned in the belt (12) between the edges (19). The monitor (28) uses the aperture (40) to measure a property of the wafer (11). The monitor (28) comprises a light emitting and reception device for determining the type of film and/or film thickness of the surface of the wafer (11).
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2.发明公开
公开(公告)号：EP1214174A1
公开(公告)日：2002-06-19
申请号：EP00954098.0
申请日：2000-08-16
CPC分类号： B24B37/205 , B24B49/04 , B24B49/12 , B24D11/008
摘要： A belt (12) for polishing a workpiece (11) such as a semiconductor wafer in a chemical mechanical polishing system (10) includes an endless belt. The belt (12) has an aperture (40). The aperture is unobstructed, such as using no window. The system (10) includes a belt (12), a first roller (14), a second roller (13), a platen (25), a polishing head (18), a slurry dispenser (21), a conditioner (20), a monitor (28) and a controller (30). One or more apertures (40) may be provided through the belt (12). Preferably, three apertures (40) are evenly spaced apart along the length of the belt (12). The apertures are positioned in the belt (12) between the edges (19). The monitor (28) uses the aperture (40) to measure a property of the wafer (11). The monitor (28) comprises a light emitting and reception device for determining the type of film and/or film thickness of the surface of the wafer (11).
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公开(公告)号：EP1214175A1
公开(公告)日：2002-06-19
申请号：EP00959821.0
申请日：2000-08-31
发明人： XU, Cangshan , LOMBARDO, Brian, S.
CPC分类号： B24B37/205 , B24B37/26 , B24D11/001 , B24D18/0009
摘要： A belt (102) for polishing a workpiece such as a semiconductor wafer (116) in a chemical mechanical polishing system (100) includes a polymeric layer forming an endless loop and having a polishing surface (140) on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
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公开(公告)号：EP1214175B1
公开(公告)日：2005-01-05
申请号：EP00959821.0
申请日：2000-08-31
发明人： XU, Cangshan , LOMBARDO, Brian, S.
CPC分类号： B24B37/205 , B24B37/26 , B24D11/001 , B24D18/0009
摘要： A belt (102) for polishing a workpiece such as a semiconductor wafer (116) in a chemical mechanical polishing system (100) includes a polymeric layer forming an endless loop and having a polishing surface (140) on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
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