公开(公告)号：EP1010781A4

公开(公告)日：2007-04-25

申请号：EP98914059

申请日：1998-04-17

申请人： SEKISUI CHEMICAL CO LTD

发明人： TANAKA YOSHIAKI ,  KODERA YOSHIAKI ,  MATSUBARA MANABU ,  KANKI KAZUHIKO ,  SUZUKI TATSUO ,  UKAI KAZUO

IPC分类号： C25D7/00 ,  C25D17/22 ,  H01L21/00 ,  H01L21/60

CPC分类号： C23C18/1619 ,  C23C18/1653 ,  C23C18/31 ,  C25D5/10 ,  C25D7/00 ,  C25D17/22 ,  H01L21/6715 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0518 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13034 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2924/013

摘要： A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of all particles without aggregating the particles in a plating liquid. The conductive particle making apparatus comprises: a disk-shaped bottom plate secured to the top part of a vertical drive shaft; a porous body arranged on the upper surface of the outer periphery of the bottom plate and allowing only the plating liquid to pass there through; a contact ring arranged on the upper surface of the porous body to conduct electricity; a hollow cover including a truncated cone cover with an opening at its upper central portion and a hollow cylinder of the same diameter as that of the opening attached to the upper end of the truncated cone cover, the upper end portion of the hollow cylinder being folded back on the inner wall side thereof; a rotatable processing chamber formed so as to hold the porous body and the contact ring between the outer periphery of the hollow cover and the bottom plate; a supply pipe to supply the plating liquid from the opening into the processing chamber; a container to receive the plating liquid scattered from the pores of the porous body; a discharge pipe to discharge the plating liquid collected in the container; and an electrode inserted from the opening to contact the plating liquid.