公开(公告)号：EP2100690A4

公开(公告)日：2012-07-18

申请号：EP07850477

申请日：2007-12-12

申请人： SENJU METAL INDUSTRY CO

发明人： KAWAMATA YUJI ,  HAGIWARA TAKASHI ,  YAMADA HIROYUKI ,  HAMAMOTO KAZUYUKI

IPC分类号： B23K35/363 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  B23K35/38 ,  B23K101/42 ,  H05K3/34

CPC分类号： B23K35/362 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/383 ,  B23K2203/12 ,  H05K3/3489

公开(公告)号：EP3238861A4

公开(公告)日：2018-08-01

申请号：EP15873226

申请日：2015-12-24

申请人： SENJU METAL INDUSTRY CO

发明人： KAWASAKI HIROYOSHI ,  KONDO SHIGEKI ,  IKEDA ATSUSHI ,  ROPPONGI TAKAHIRO ,  HAGIWARA TAKASHI ,  SOMA DAISUKE ,  TSURUTA KAICHI ,  SATO ISAMU ,  KAWAMATA YUJI

IPC分类号： B22F1/02 ,  B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/22 ,  B23K35/26 ,  B23K101/40 ,  C22C9/00 ,  C22C13/00 ,  C25D3/18 ,  C25D3/32 ,  C25D3/56 ,  C25D3/60 ,  C25D5/10 ,  C25D5/12 ,  C25D5/18 ,  C25D7/00

CPC分类号： B23K35/262 ,  B22F1/025 ,  B22F9/08 ,  B22F2301/10 ,  B22F2301/15 ,  B23K1/00 ,  B23K3/06 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/3033 ,  C22C9/00 ,  C22C13/00 ,  C23C18/32 ,  C25D3/18 ,  C25D3/32 ,  C25D3/562 ,  C25D3/60 ,  C25D5/10 ,  C25D5/12 ,  C25D5/18 ,  C25D7/00

摘要： Provided are a joining member and a solder material that have a high sphericity, a solder paste, formed solder, a flux coated material and a solder joint. An Ni-plated Cu ball 10 according to this invention includes a cu ball 12 and an Ni plated layer 14 that coats the Cu ball 12. The Ni plated layer 14 contains brightener and has an average grain diameter of crystal grains of 1 µm or less. The Ni-plated Cu ball 10 has a spherical diameter of 1 to 230 µm and a sphericity of 0.95 or more. By containing the brightener in the Ni plated layer 14, a surface of the Ni-plated Cu ball 10 can be smoothed and the sphericity of 0.95 or more can be achieved. This makes it possible to prevent misalignment of Cu core ball 10 when the Cu core ball is mounted on electrode and to prevent any deterioration of the self-alignment property of the Cu core ball.

公开(公告)号：EP1795296A4

公开(公告)日：2009-08-19

申请号：EP05772603

申请日：2005-08-22

申请人： SENJU METAL INDUSTRY CO

发明人： HAGIWARA TAKASHI

IPC分类号： B23K35/363 ,  H05K3/34

CPC分类号： B23K35/362 ,  H05K3/3489 ,  H05K2203/124

摘要： [PROBLEMS] Addition of an organic acid, e.g., a dicarboxylic acid, to a flux for soldering in order to heighten wetting ability results in reaction with copper oxide to generate a copper metal soap which has a green color. This copper soap appears to be completely the same as and undistinguishable from verdigris, which is a symbol of corrosion, although it neither is corrosive nor brings about a decrease in reliability. Therefore, a flux for soldering is necessary which generates no copper soap. [MEANS FOR SOLVING PROBLEMS] Addition of tetrazole or a tetrazole derivative to a flux for soldering prevents carboxy groups from reacting only with copper ions, whereby the generation of a copper metal soap having a green color can be inhibited. In particular, 5-phenyl-1H-tetrazole, which has hydrogen as a 1-position substituent and a phenyl group in the 5-position as a strongly electron-attracting group, and derivatives thereof are preferred among tetrazole and tetrazole derivatives, because they enhance polarity in the solvent and facilitate soldering.

公开(公告)号：EP2862667A4

公开(公告)日：2015-12-30

申请号：EP13804256

申请日：2013-06-10

申请人： SENJU METAL INDUSTRY CO

发明人： HAGIWARA TAKASHI ,  YAMASAKI HIROYUKI

IPC分类号： B23K35/363 ,  H05K3/34

CPC分类号： B23K35/362 ,  B23K35/025 ,  B23K35/3605 ,  B23K35/3613 ,  H05K3/3463 ,  H05K3/3489