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公开(公告)号：EP3166741B1
公开(公告)日：2019-03-06
申请号：EP15745359.8
申请日：2015-06-30
申请人： Plansee SE
CPC分类号： B22F3/1055 , B22F1/0003 , B22F1/0011 , B22F1/025 , B22F3/1035 , B22F3/24 , B22F9/30 , B22F2003/248 , B22F2301/15 , B22F2301/20 , B22F2998/10 , B23K15/0086 , B23K15/0093 , B23K26/0006 , B23K26/342 , B23K2103/08 , B33Y10/00 , B33Y70/00 , C22C1/045 , C22C27/04 , Y02P10/295 , B22F9/20
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公开(公告)号：EP3067151B1
公开(公告)日：2018-08-08
申请号：EP14860167.7
申请日：2014-11-04
发明人： HATTORI Takahiro , SOMA Daisuke , ROPPONGI Takahiro , SATO Isamu
IPC分类号： B23K35/14 , B22F1/00 , B22F1/02 , B23K35/22 , B23K35/26 , C22C13/00 , H01L21/60 , C22F1/00 , C22F1/08 , B23K35/30 , B23K35/02 , C25D3/60 , C25D7/00 , C22C1/04 , C22C9/00 , H01L23/00 , H05K3/34 , H01L23/556
CPC分类号： B23K35/302 , B22F1/00 , B22F1/0048 , B22F1/025 , B23K35/0222 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/262 , C22C1/0483 , C22C9/00 , C22C13/00 , C23C28/021 , C25D3/60 , C25D7/00 , H01L23/556 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05647 , H01L2224/11825 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13016 , H01L2224/13017 , H01L2224/13147 , H01L2224/13294 , H01L2224/13311 , H01L2224/13347 , H01L2224/13411 , H01L2224/13455 , H01L2224/13457 , H01L2224/13561 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/16227 , H01L2224/81024 , H01L2224/81048 , H01L2224/81075 , H01L2224/81211 , H01L2224/81395 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2924/15311 , H01L2924/351 , H05K3/3463 , H05K2201/0218 , H01L2924/01029 , H01L2924/00014 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/0103 , H01L2924/01026 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01048 , H01L2924/01028 , H01L2924/01082 , H01L2924/01044 , H01L2924/01015 , H01L2924/01016 , H01L2924/01092 , H01L2924/0109 , H01L2924/01203 , H01L2924/01204 , H01L2924/00012 , H01L2924/013
摘要： Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1 % through not more than 3.0 % of Cu and the remainder is composed of Sn and impurities.
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公开(公告)号：EP3192597A4
公开(公告)日：2018-06-06
申请号：EP15840059
申请日：2015-03-26
发明人： OKADA HIROSHI , YAMASHITA HIDEYUKI
IPC分类号： B22F1/00 , B22F1/02 , C09C1/02 , C09C3/06 , C09D5/24 , C09D201/00 , C23C18/42 , C25C5/02 , H01B1/00 , H01B1/22 , H01B5/00
CPC分类号： C09D5/32 , B22F1/0007 , B22F1/0014 , B22F1/0055 , B22F1/0059 , B22F1/025 , B22F9/24 , B22F2001/0066 , B22F2301/10 , B22F2301/255 , B22F2302/45 , B22F2304/10 , C09C1/02 , C09C1/66 , C09C3/06 , C09D5/24 , C09D7/1283 , C09D7/69 , C09D201/00 , C23C18/42 , C25C5/02 , H01B1/00 , H01B1/22 , H01B5/00 , H05K9/0081
摘要： Provided is a dendritic silver-coated copper powder which is prevented from agglomeration, while ensuring excellent electrical conductivity by increasing contact points in cases where silver-coated dendritic copper powder particles are in contact with each other. This dendritic silver-coated copper powder is suitable for use in conductive pastes, electromagnetic shielding materials and the like. A dendritic silver-coated copper powder 1 according to the present invention has a dendritic form which comprises a linearly grown main trunk 2 and a plurality of branches 3 arising from the main trunk 2. The main trunk 2 and the branches 3 are configured of copper particles which have plate-like shapes having an average cross-sectional thickness of 0.2-1.0 µm, and the surfaces of which are coated with silver. This dendritic silver-coated copper powder 1 has an average particle diameter (D50) of 5.0-30 µm as determined by a laser diffraction/scattering particle size distribution measuring method.
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公开(公告)号：EP3012350B1
公开(公告)日：2018-05-16
申请号：EP15190847.2
申请日：2015-10-21
发明人： AMINI, Shahram , STROCK, Christopher W. , SHARON, John A. , KLECKA, Michael A. , NARDI, Aaron T.
CPC分类号： C23C24/04 , B22F1/025 , B22F7/008 , B22F2301/052 , B22F2301/15 , B22F2302/10 , F01D5/288 , F05D2300/6032 , F16C33/043 , F23R2900/00018
摘要： A process of forming a MAXMET composite coating or component on an article, that in the case of components can be removed, comprising providing an article having a substrate (30). The process includes providing at least one powder containing the MAXMET composite, wherein the MAXMET composite comprises a mixture of MAX phase particles and metal, cold spraying the at least one powder on the substrate at a critical velocity, and forming a layer (32) of the MAXMET composite on the substrate (30).
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5.发明公开
公开(公告)号：EP3296042A1
公开(公告)日：2018-03-21
申请号：EP15892627.9
申请日：2015-10-27
发明人： OKADA, Hiroshi
CPC分类号： B22F1/025 , B22F1/0007 , B22F1/0055 , B22F1/0062 , B22F9/24 , B22F2301/255 , B22F2304/10 , C23C18/42 , C23C18/54 , C25C1/12 , C25C5/02 , C25D3/38 , H01B1/22 , Y02P10/236
摘要： Provided is a silver-coated copper powder which can be suitably utilized in applications such as an electrically conductive paste and an electromagnetic wave shield while securing excellent electrical conductivity by increasing the number of contact points between the copper powders. A silver-coated copper powder 1 according to the present invention has a dendritic shape having a linearly grown main stem 2 and a plurality of branches 3 separated from the main stem 2, the main stem 2 and the branches 3 are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 µm to 5.0 µm to be determined by scanning electron microscopic (SEM) observation gather, the surface of the copper particles is coated with silver, the average particle diameter (D50) of the silver-coated copper powder 1 is from 1.0 µm to 100 µm, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.
摘要翻译： 本发明提供一种银涂布铜粉，其通过增加铜粉之间的接触点的数量，确保良好的导电性，并且适合用于导电性糊剂，电磁波屏蔽等用途。 根据本发明的镀银铜粉1具有树枝状形状，其具有线性生长的主干2和与主干2分离的多个分支3，主干2和分支3构成为平板状的， 通过扫描型电子显微镜（SEM）观察集合确定截面平均厚度为0.02μm〜5.0μm的平均粒径（D50） 镀银铜粉1的厚度为1.0μm〜100μm，相对于铜粒子的平板状表面的铅直方向的最大高度相对于水平方向的最大长度为1/10以下 铜粒子的平板状表面的方向。
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6.发明公开SILVER-COATED COPPER POWDER AND CONDUCTIVE PASTE, CONDUCTIVE MATERIAL, AND CONDUCTIVE SHEET USING SAME 审中-公开镀银铜粉和导电膏，导电材料和导电片使用相同
公开(公告)号：EP3275571A1
公开(公告)日：2018-01-31
申请号：EP15886411.6
申请日：2015-03-26
IPC分类号： B22F1/00 , B22F1/02 , C09C1/62 , C09C3/06 , C09D5/24 , C09D201/00 , C23C18/42 , C25C5/02 , H01B1/00 , H01B1/22 , H01B5/00
CPC分类号： B22F1/0014 , B22F1/00 , B22F1/0007 , B22F1/0055 , B22F1/0059 , B22F1/0074 , B22F1/02 , B22F1/025 , B22F9/24 , B22F2001/0066 , B22F2301/10 , B22F2301/255 , B22F2304/10 , C01P2004/03 , C01P2006/40 , C01P2006/42 , C08K9/02 , C08K2003/085 , C09C1/62 , C09C1/66 , C09C3/06 , C09C3/066 , C09D5/24 , C09D5/32 , C09D7/70 , C09D201/00 , C23C18/1635 , C23C18/1834 , C23C18/42 , C23C18/44 , C23C18/54 , C25C5/02 , H01B1/026 , H01B1/22 , H01B5/00 , H01J37/28 , H05K9/0083
摘要： Provided is a silver-coated copper powder that has a dendritic shape, that ensures excellent conductivity as a result of having an increased number of points of contact when silver-coated dendritic copper particles are in contact, that prevents aggregation, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The silver-coated copper powder comprises amassed dendritic copper particles 1 having a linearly grown main trunk 2 and a plurality of branches 3 branching from the main trunk 2. The surface of the copper particles 1 is coated with silver. The main trunk 2 and the branches 3 of the copper particles 1 have a flat plate shape in which the average cross-sectional thickness is more than 1.0 µm but no more than 5.0 µm. The silver-coated copper powder has a flat plate shape configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 µm.
摘要翻译： 本发明提供一种具有树枝状形状的银包覆铜粉，该树脂包覆树枝状铜粒子接触时的接触点的数量增多，可以确保良好的导电性，防止凝集， 用于导电胶，电磁波屏蔽等。 镀银铜粉包含具有线性生长主干2和从主干2分支的多个分支3的积聚树枝状铜粒子1.铜粒子1的表面涂布有银。 铜颗粒1的主干2和分支3具有平均横截面厚度大于1.0μm但不大于5.0μm的平板形状。 镀银铜粉具有由一层或多层叠层的层状结构构成的平板形状。 平均粒径（D50）为1.0〜100μm。
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公开(公告)号：EP3144083A4
公开(公告)日：2018-01-03
申请号：EP15792389
申请日：2015-05-18
发明人： YANG JI-BIN , KITA KOICHI , SAIWAI TOSHIHIKO , HOSHINO KOJI , KATOH JUN
CPC分类号： B22F3/11 , B22F1/025 , B22F3/1109 , B22F2998/10 , C22C1/0416 , C22C1/08 , C22C21/00 , C22C32/0036 , C22C47/14 , C22C2001/1089 , B22F3/1021 , B22F3/1039
摘要： A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact (10) that includes aluminum substrates (11) sintered each other. The junction (15), in which the aluminum substrates (11) are bonded each other, includes the Ti-Al compound (16) and the Mg oxide (17). It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates (11), and the pillar-shaped protrusions include the junction (15).
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8.发明授权
公开(公告)号：EP2963655B1
公开(公告)日：2017-12-27
申请号：EP14756789.5
申请日：2014-02-28
发明人： ISHIDA, Hiroya , MATSUSHITA, Kiyoto
CPC分类号： H01B1/22 , B22F1/025 , B23K35/0244 , B23K35/262 , C22C13/00 , C23C18/1635 , C23C18/1651 , C23C18/1653 , C25D5/12 , H01B1/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29481 , H01L2224/29487 , H01L2224/32227 , H01L2224/83191 , H01L2224/834 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2924/3512 , H01L2924/3651 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2203/0425 , H01L2924/00014 , H01L2924/04941 , H01L2924/05342 , H01L2924/01015 , H01L2924/01005 , H01L2924/014 , H01L2924/01047 , H01L2924/01051 , H01L2924/01083 , H01L2924/01049 , H01L2924/01032 , H01L2924/01013 , H01L2924/0103 , H01L2924/01028 , H01L2924/01027 , H01L2924/01029
摘要： The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5 % by weight relative to tin contained in the solder layer.
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9.发明授权
公开(公告)号：EP2101940B1
公开(公告)日：2017-11-22
申请号：EP07861181.1
申请日：2007-12-28
申请人： Höganäs AB (publ)
发明人： LARSSON, Mats
CPC分类号： B22F1/025 , B22F1/0085 , B22F2998/00 , B22F2998/10 , B22F2999/00 , F16C33/12 , F16C33/121 , F16C2204/60 , B22F3/10 , B22F2201/013 , B22F2201/02 , B22F2201/016 , B22F2207/01 , B22F3/02 , B22F1/0003 , B22F9/04
摘要： A powder for use in the powder metallurgical manufacture of components is provided. Particularly the subject matter concerns an iron or iron based powder intended for the powder metallurgical manufacturing of components. It is especially suitable for manufacturing of components wherein self-lubricating properties are desired. The subject matter further relates to a method of manufacturing a component from said powder and an accordingly produced component. A diffusion-bonded powder comprising iron or iron-based particles, and particles diffusion-bonded to the iron or iron-based particles is provided. The said particles diffusion-bonded to the iron or iron-based particles may comprise an alloy of Cu and 5% to 15% by weight of Sn. A component is provided which is at least partly formed from such a diffusion-bonded powder.
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10.发明公开JOINING MEMBER, SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL, AND SOLDER JOINT 审中-公开连接部件，焊接材料，焊膏，发泡焊剂，助焊剂涂层材料和焊接接头
公开(公告)号：EP3238861A1
公开(公告)日：2017-11-01
申请号：EP15873226.3
申请日：2015-12-24
发明人： KAWASAKI, Hiroyoshi , KONDO, Shigeki , IKEDA, Atsushi , ROPPONGI, Takahiro , HAGIWARA, Takashi , SOMA, Daisuke , TSURUTA, Kaichi , SATO, Isamu , KAWAMATA, Yuji
CPC分类号： B23K35/262 , B22F1/025 , B22F9/08 , B22F2301/10 , B22F2301/15 , B23K1/00 , B23K3/06 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/3033 , C22C9/00 , C22C13/00 , C23C18/32 , C25D3/18 , C25D3/32 , C25D3/562 , C25D3/60 , C25D5/10 , C25D5/12 , C25D5/18 , C25D7/00
摘要： Provided are a joining member and a solder material that have a high sphericity, a solder paste, formed solder, a flux coated material and a solder joint. An Ni-plated Cu ball 10 according to this invention includes a cu ball 12 and an Ni plated layer 14 that coats the Cu ball 12. The Ni plated layer 14 contains brightener and has an average grain diameter of crystal grains of 1 µm or less. The Ni-plated Cu ball 10 has a spherical diameter of 1 to 230 µm and a sphericity of 0.95 or more. By containing the brightener in the Ni plated layer 14, a surface of the Ni-plated Cu ball 10 can be smoothed and the sphericity of 0.95 or more can be achieved. This makes it possible to prevent misalignment of Cu core ball 10 when the Cu core ball is mounted on electrode and to prevent any deterioration of the self-alignment property of the Cu core ball.
摘要翻译： 本发明提供具有高球形度的接合构件和焊接材料，焊膏，成形焊料，焊剂涂覆材料和焊接接头。 根据本发明的镀Ni铜球10包括Cu球12和涂覆Cu球12的镀Ni层14.镀Ni层14含有光亮剂并具有1μm或更小的晶粒平均粒径 。 镀Ni球Cu球10具有1至230μm的球形直径和0.95或更大的球形度。 通过在该镀镍层14中含有该光亮剂，能够使镀Ni球Cu球10的表面平滑化，能够实现0.95以上的球形度。 这可以防止当将Cu芯球安装在电极上时Cu芯球10的未对准并且防止Cu芯球的自对准特性的任何恶化。
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