SCHICHTSTOFF
    6.
    发明公开

    公开(公告)号:EP2176064A1

    公开(公告)日:2010-04-21

    申请号:EP08802947.5

    申请日:2008-07-31

    申请人: SGL Carbon SE

    IPC分类号: B32B9/00 H01M8/00 C04B37/00

    摘要: The invention relates to a layered material which consists of at least one ply of a graphite-filled polymer material or a ply of a ceramic material and in which a non-detachable connection is present between the materials, and the materials are connected by means of an interface-active, adhesion-promoting substance from the group consisting of organosilicon compounds, metal soaps or perfluorinated compounds.

    摘要翻译: 本发明涉及一种层状材料,其由至少一层石墨填充的聚合物材料或陶瓷材料层组成,并且其中在材料之间存在不可拆卸的连接,并且材料通过 来自由有机硅化合物,金属皂或全氟化合物组成的组中的界面活性粘合促进物质。

    LATENT HEAT STORAGE DEVICE WITH PHASE CHANGE MATERIAL AND GRAPHITE MATRIX
    8.
    发明公开
    LATENT HEAT STORAGE DEVICE WITH PHASE CHANGE MATERIAL AND GRAPHITE MATRIX 审中-公开
    LATENTERWÄRMESPEICHERMIT SPEICHERSTOFF UND GRAPHITMATRIX

    公开(公告)号:EP2836784A1

    公开(公告)日:2015-02-18

    申请号:EP13715213.8

    申请日:2013-04-09

    申请人: SGL Carbon SE

    IPC分类号: F28F21/02 F28D20/02 C09K5/06

    摘要: A latent heat storage device is formed with a carrier substrate formed of expanded graphite material. Phase change material is infiltrated in the graphite material. A thin graphite sheet provides for the functional heat conductivity into and out of the carrier substrate. After the phase change material (PCM) is infiltrated in the carrier substrate, a density of the infiltrated carrier substrate exceeds its starting density by a ratio of at least 3:1 or 4:1 or more. The volume dimensions of the infiltrated the carrier substrate remain substantially unchanged. In the alternative, the latent heat storage device may also have a PCM coating layer on a thin carrier substrate, wherein the phase change material is interspersed in a carrier matrix forming the PCM coating layer. The composite device may be very thin.

    摘要翻译: 潜热蓄电装置由膨胀石墨材料形成的载体基板形成。 相变材料渗入石墨材料。 薄的石墨片提供进入和离开载体衬底的功能性热导率。 在相变材料(PCM)渗入载体衬底之后,渗透的载体衬底的密度超过其起始密度至少3:1或4:1或更高的比率。 渗透的载体衬底的体积尺寸基本上保持不变。 或者,潜热蓄热装置也可以在薄载体基板上具有PCM涂层,其中相变材料散布在形成PCM涂层的载体基体中。 复合器件​​可能非常薄。