公开(公告)号：EP2915848A4

公开(公告)日：2016-05-25

申请号：EP12887673

申请日：2012-10-31

申请人： SHENGYI TECHNOLOGY CO LTD

发明人： SU MINSHE ,  CHEN YONG ,  TANG GUOFANG ,  YANG ZHONGQIANG

IPC分类号： C08L63/00 ,  C08G59/42 ,  C08L25/08 ,  C09D163/00

CPC分类号： C08G59/3218 ,  C08G59/4261 ,  C08K5/0066 ,  C08L25/08 ,  C08L35/06 ,  C08L63/00

摘要： The present invention discloses a thermosetting resin composition, comprising: an epoxy resin other than brominated epoxy resin, a styrene maleic anhydride copolymer and an additive flame retardant. The thermosetting resin composition also comprises active ester. The thermosetting resin composition is used to prepare resin sheets, resin clad metal foils, prepregs, laminates, metal-clad laminates and printed wiring boards, etc. The thermosetting resin composition can significantly reduce the probability of delamination explosion of PCB baseboards, and overcome the deterioration of dielectric performances caused by introducing tetrabromobisphenol A. The obtained resin composition has good thermal stability and thermal and moisture resistance, dielectric constant and low dielectric dissipation tangent, and good flame retardancy.

公开(公告)号：EP3239244A4

公开(公告)日：2018-08-01

申请号：EP15871611

申请日：2015-06-01

申请人： SHENGYI TECHNOLOGY CO LTD

发明人： YE SUWEN ,  TANG GUOFANG

IPC分类号： C08L83/04 ,  B32B27/04 ,  C08G77/16 ,  C08G77/18 ,  C08K3/36 ,  C08K5/098 ,  C09D183/06

CPC分类号： C08L83/06 ,  B32B27/04 ,  B32B38/08 ,  B32B2307/304 ,  B32B2307/3065 ,  C08G77/08 ,  C08G77/16 ,  C08G77/18 ,  C08G77/80 ,  C08J5/24 ,  C08K3/013 ,  C08K3/36 ,  C08K5/098 ,  C08L83/04 ,  C09D183/06 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0358 ,  H05K2201/068 ,  C08K5/5415

摘要： The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufaturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.