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公开(公告)号：EP3239244A4
公开(公告)日：2018-08-01
申请号：EP15871611
申请日：2015-06-01
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： YE SUWEN , TANG GUOFANG
CPC classification number: C08L83/06 , B32B27/04 , B32B38/08 , B32B2307/304 , B32B2307/3065 , C08G77/08 , C08G77/16 , C08G77/18 , C08G77/80 , C08J5/24 , C08K3/013 , C08K3/36 , C08K5/098 , C08L83/04 , C09D183/06 , H05K1/036 , H05K1/0373 , H05K2201/0162 , H05K2201/0358 , H05K2201/068 , C08K5/5415
Abstract: The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufaturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.
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2.发明公开ORGANIC SILICONE RESIN COMPOSITION AND PRE-PREG, LAMINATE, COPPER-CLAD LAMINATE, AND ALUMINUM SUBSTRATE THAT USE THE COMPOSITION 审中-公开有机硅树脂组合物和使用该组合物的预浸渍，层压，铜层合层合物和铝基底
公开(公告)号：EP3239244A1
公开(公告)日：2017-11-01
申请号：EP15871611.8
申请日：2015-06-01
Applicant: Shengyi Technology Co. Ltd.
Inventor： YE, Suwen , TANG, Guofang
CPC classification number: C08L83/06 , B32B27/04 , B32B38/08 , B32B2307/304 , B32B2307/3065 , C08G77/08 , C08G77/16 , C08G77/18 , C08G77/80 , C08J5/24 , C08K3/013 , C08K3/36 , C08K5/098 , C08L83/04 , C09D183/06 , H05K1/036 , H05K1/0373 , H05K2201/0162 , H05K2201/0358 , H05K2201/068 , C08K5/5415
Abstract: The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufaturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.
Abstract translation: 有机硅树脂组合物和使用该组合物的预浸料坯，层叠体和铝基板技术领域本发明涉 有机硅树脂组合物按重量份数包含：100份缩合型有机硅树脂，0.0001-2份催化剂和0.001-10份添加剂。 有机硅树脂组合物具有高耐热性，无卤素和无磷阻燃性，与铜箔的剥离强度提高和低膨胀系数的优点，并且可用于制造预浸料，层压板和 用于高性能印刷电路的铝基板。
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公开(公告)号：EP2792483A4
公开(公告)日：2015-08-19
申请号：EP12865468
申请日：2012-01-13
Applicant: JX NIPPON MINING & METALS CORP
Inventor： TANAKA KOICHIRO , KAMMURI KAZUKI
CPC classification number: H05K1/0393 , B32B7/02 , B32B15/08 , B32B15/20 , B32B2307/712 , B32B2457/08 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/022 , H05K2201/0145 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2201/05 , H05K2201/06 , Y10T29/302 , Y10T428/12438 , Y10T428/273
Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1
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公开(公告)号：EP2439063B1
公开(公告)日：2015-02-25
申请号：EP10796975.0
申请日：2010-06-03
Applicant: JX Nippon Mining & Metals Corporation
Inventor： KANMURI Kazuki
CPC classification number: H05K9/0084 , B32B7/02 , B32B15/08 , B32B15/09 , B32B15/20 , B32B2307/212 , B32B2307/50 , B32B2307/54 , B32B2307/70 , B32B2457/08 , H05K1/09 , H05K3/022 , H05K2201/0355 , H05K2201/0358 , Y10T428/31678
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5.发明公开COPPER FOIL COMPLEX, COPPER FOIL USED IN COPPER FOIL COMPLEX, MOLDED BODY, AND METHOD FOR PRODUCING MOLDED BODY 审中-公开铝箔铜复合所用覆铜箔这部影片铜配合物，赋型体和制造方法的体形
公开(公告)号：EP2695733A4
公开(公告)日：2014-11-19
申请号：EP12786287
申请日：2012-05-08
Applicant: JX NIPPON MINING & METALS CORP
Inventor： KAMMURI KAZUKI
IPC: B32B15/08 , B32B15/20 , B32B27/28 , B32B27/32 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H05K1/03 , H05K1/09 , H05K9/00
CPC classification number: H05K9/0084 , B21D33/00 , B32B7/12 , B32B15/01 , B32B15/08 , B32B15/20 , B32B27/281 , B32B27/32 , B32B2255/06 , B32B2307/208 , B32B2307/212 , B32B2307/546 , B32B2457/00 , B32B2457/20 , C22C9/00 , C22C9/02 , C22C9/04 , C22F1/08 , H05K1/09 , H05K2201/0355 , H05K2201/0358 , Y10T29/30 , Y10T428/12431 , Y10T428/31678
Abstract: A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I 0 200 of a (100) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 10 to 400 µm.
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Patent Agency Ranking6.发明公开COPPER FOIL COMPLEX, COPPER FOIL USED IN COPPER FOIL COMPLEX, MOLDED BODY, AND METHOD FOR PRODUCING MOLDED BODY 审中-公开铝箔铜复合所用覆铜箔这部影片铜配合物，赋型体和制造方法的体形
公开(公告)号：EP2695733A1
公开(公告)日：2014-02-12
申请号：EP12786287.8
申请日：2012-05-08
Applicant: JX Nippon Mining & Metals Corp.
Inventor： KAMMURI Kazuki
IPC: B32B15/08 , B32B15/20 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22C9/06 , C22C9/10 , H05K1/03 , H05K1/09 , H05K9/00 , C22F1/00 , C22F1/08
CPC classification number: H05K9/0084 , B21D33/00 , B32B7/12 , B32B15/01 , B32B15/08 , B32B15/20 , B32B27/281 , B32B27/32 , B32B2255/06 , B32B2307/208 , B32B2307/212 , B32B2307/546 , B32B2457/00 , B32B2457/20 , C22C9/00 , C22C9/02 , C22C9/04 , C22F1/08 , H05K1/09 , H05K2201/0355 , H05K2201/0358 , Y10T29/30 , Y10T428/12431 , Y10T428/31678
Abstract: A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I 0 200 of a (100) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 10 to 400 µm.
Abstract translation: 铜箔复合材料，包括铜箔和树脂层的层叠时，铜箔含有至少一个在一个共计30〜选自锡，锰，铬，锌，锆，镁，镍，硅和Ag中选择的 500质量ppm，从所观看的具有100至180兆帕，一定程度的聚集I200的/ I铜箔的一个（100）面的0200的铜箔30个或更多，并且在平均晶粒尺寸的拉伸强度 铜箔为10至400微米的板表面上。
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公开(公告)号：EP2581220A1
公开(公告)日：2013-04-17
申请号：EP11806591.1
申请日：2011-06-16
Applicant: JX Nippon Mining & Metals Corporation
Inventor： KAMMURI Kazuki
CPC classification number: H05K3/022 , B32B15/08 , B32B15/085 , B32B15/09 , B32B15/20 , B32B2457/08 , H05K1/0393 , H05K2201/0145 , H05K2201/0154 , H05K2201/0358 , Y10T428/31678
Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1:(f 3 x t 3 )/(f 2 x t 2 ) => 1 is satisfied when t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2:1 1 /(F x T) is satisfied when f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite.
Abstract translation: 包含铜箔和层叠在其上的树脂层的铜箔复合体，当t 2（mm）为铜箔的厚度时，满足式1：（f 3×t 3）/（f 2×t 2）=> 1 ，f 2（MPa）是铜箔在拉伸应变为4％时的应力，t 3（mm）是树脂层的厚度，f 3（MPa）是树脂层在拉伸应变下的应力 ％，方程2：当f 1（N / mm）为铜箔与树脂层之间的180°剥离强度时，满足1 <= 33f 1 /（F×T），F（MPa）为铜 箔复合材料的拉伸应变为30％，T（mm）为铜箔复合材料的厚度。
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公开(公告)号：EP1762582B1
公开(公告)日：2012-05-09
申请号：EP05730444.6
申请日：2005-04-14
Applicant: Namics Corporation
Inventor： YAMADA, Toshiaki c/o Namics Corporation , FUJINO, Taku c/o Namics Corporation , TERAKI, Shin c/o Namics Corporation , YOSHIDA, Masaki c/o Namics Corporation , SUZUKI, Kenichi c/o Namics Corporation
CPC classification number: H05K1/0326 , C08G59/621 , H01L23/49894 , H01L2924/0002 , H05K2201/0358 , Y10T428/12569 , H01L2924/00
Abstract: Disclosed is an epoxy resin composition which is capable of forming a cured product having a low dielectric constant and a dielectric loss tangent in a high frequency range. Also disclosed is a film obtained by using such an epoxy resin composition. The epoxy resin composition contains (A) one or more epoxy resins selected from the group consisting of novolac epoxy resins having a phenol skeleton and a biphenyl skeleton and bifunctional linear epoxy resins having a hydroxyl group with a weight average molecular weight of 10,000-200,000, and (B) a modified phenol novolac wherein at least a part of a phenolic hydroxyl group is esterified with a fatty acid.
Abstract translation: 公开了一种环氧树脂组合物，其能够形成在高频范围内具有低介电常数和介电损耗角正切的固化产物。 还公开了通过使用这种环氧树脂组合物获得的膜。 该环氧树脂组合物含有（A）选自具有酚骨架和联苯骨架的酚醛环氧树脂和具有重均分子量为10,000〜200,000的具有羟基的双官能团线型环氧树脂的一种或多种环氧树脂， 和（B）其中至少一部分酚羟基被脂肪酸酯化的改性苯酚酚醛清漆树脂。
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9.发明授权METHOD FOR PRODUCING A CIRCUIT BOARD AND MATERIAL FOR PRODUCING A CIRCUIT BOARD 有权生产电路板的方法和生产电路板的材料
公开(公告)号：EP1599079B1
公开(公告)日：2012-05-09
申请号：EP05703984.4
申请日：2005-01-21
Applicant: Panasonic Corporation
Inventor： NISHII, Toshihiro
CPC classification number: H05K3/4069 , H05K3/382 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2201/0358 , H05K2201/0382 , H05K2201/091 , H05K2203/1461 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
Abstract: A hole formed in a material sheet is provided with a conductive portion. A metal foil is arranged on the surface of the material sheet, thereby obtaining a laminate sheet. A circuit-forming board is obtained by hot pressing the laminate sheet. The surface of the metal foil has a pressure absorbing portion whose thickness is changed by the applied pressure and a hard portion arranged adjacent to the pressure absorbing portion. By using this circuit-forming board, there can be obtained a high-density, excellent-quality circuit board having improved reliability in electrical connection.
Abstract translation: 形成在材料片中的孔设置有导电部分。 金属箔布置在材料片的表面上，从而获得层压片。 通过热压层压板获得电路形成板。 金属箔的表面具有厚度随着施加的压力而变化的压力吸收部分和邻近压力吸收部分布置的硬质部分。 通过使用这种电路形成板，可以获得具有改进的电连接可靠性的高密度，优质电路板。
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10.发明公开
公开(公告)号：EP1905133A4
公开(公告)日：2009-12-02
申请号：EP06766113
申请日：2006-07-03
Applicant: OSTROVSKY VALERY , C L P INDUSTRIES LTD
Inventor： OSTROVSKY VALERY , C L P INDUSTRIES LTD
CPC classification number: H05K3/386 , B32B15/085 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/32 , B32B37/153 , B32B2250/40 , B32B2264/102 , B32B2311/12 , B32B2323/10 , B32B2457/08 , H05K1/032 , H05K3/022 , H05K2201/0158 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358 , H05K2203/0143 , H05K2203/0759 , H05K2203/1545 , Y10T428/264 , Y10T428/265 , Y10T428/269 , Y10T428/31692
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