公开(公告)号：EP1243672A4

公开(公告)日：2003-04-09

申请号：EP00985819

申请日：2000-12-21

申请人： SHIMADA RIKA KOGYO KK

发明人： NOBATA HIROTAKA ,  SONODA HARUKI ,  TATEHABA YOSHIHITO ,  OHTSUBO TETSUROU ,  MORITO YASUOMI ,  SHIMADA KIYOSHI ,  ABE YUSUKE ,  ANDO EI ICHI ,  ISHI TETSUJI

IPC分类号： C23G3/00 ,  C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  C25D19/00 ,  C25D21/00 ,  C25D21/08 ,  H01L21/288 ,  H01L23/12 ,  H05K3/18 ,  H05K3/24 ,  H01L21/00

CPC分类号： C25D17/02 ,  C25D7/123 ,  C25D17/001 ,  C25D21/08 ,  H05K3/241

摘要： A plating device and a plating method, for plating electronic parts boards, etc., while preventing metal pollution from spreading inside and outside the plating device, preventing the seed layer from dissolving, and preventing the washing liquid from dispersing to cause defects, the outer periphery alone being washed. The plating device, which applies plating treatment or the like to a subject of treatment, such as an electronic parts board, includes a suitable number of plating tanks and a suitable number of treating tanks for washing or the like, installed therein, and the plating treatment, end etching treatment, washing treatment, and drying treatment are continuously effected inside the device.