公开(公告)号：EP2789714B1

公开(公告)日：2018-03-28

申请号：EP12855932.5

申请日：2012-12-05

Applicant: THINK LABORATORY CO., LTD.

Inventor： SHIGETA, Tatsuo

IPC: C25D21/18 ,  B41C1/18 ,  B41N1/06 ,  C23F1/08 ,  C25D7/04 ,  C25D17/00 ,  C25D19/00 ,  C25D21/04

CPC classification number: C25D21/18 ,  B41C1/18 ,  C23F1/08 ,  C25D7/04 ,  C25D17/00 ,  C25D21/04

Abstract: Provided is a processing unit including a condenser, which is capable of condensing, during a plate-making process to be performed by the processing unit in a fully automatic gravure plate-making processing system, a processing solution vaporized into the form of mist so as to reuse the resultant as the processing solution, and to provide a fully automatic gravure plate-making processing system using the processing unit including a condenser. The processing unit includes a condenser, which is to be used for a fully automatic gravure plate-making processing system for manufacturing a plate-making roll by performing a series of processes on an unprocessed plate-making roll. The processing unit includes: a processing bath; chuck means for holding a gravure cylinder inside the processing bath; an intake port for taking in air, which is provided in a part of the processing bath; an exhaust port for exhausting gas, which is provided in another part of the processing bath; a condenser provided between the processing bath and the exhaust port; and a processing solution return pipe for returning, to the processing bath, a processing solution obtained by the condenser that liquefies a part of the gas to be exhausted.

公开(公告)号：EP2167223A2

公开(公告)日：2010-03-31

申请号：EP08826793.5

申请日：2008-06-27

Applicant: Siemens VAI Metals Technologies SAS

Inventor： BARBIERI, Philippe

IPC: B01D61/44 ,  C25D7/06 ,  C25D17/12 ,  C25D21/14 ,  C25D21/22 ,  C25D5/02 ,  C25D3/30 ,  C25D19/00

CPC classification number: C25D7/0614 ,  B01D61/44 ,  C25D3/30 ,  C25D17/002 ,  C25D17/10 ,  C25D21/14

Abstract: The invention relates to a method for the electrolytic tinning of steel bands (20), using an insoluble anode (60). The invention also relates to a unit (1) for implementing same and a module (80, 800) for recovering acid from the electrolytic bath.

公开(公告)号：EP1694885A4

公开(公告)日：2007-12-19

申请号：EP04760000

申请日：2004-04-16

Applicant: APPLIED MATERIALS INC ,  ELLWANGER RUSSELL C

Inventor： YANG MICHAEL X ,  XI MING ,  BRITCHER ERIC B ,  DONOSO BERNARDO ,  PANG LILY L ,  SHERMAN SVETLANA ,  HO HENRY ,  NGUYEN ANH N ,  LERNER ALEXANDER N ,  D AMBRA ALLEN L ,  SHANMUGASUNDRAM ARULKUMAR ,  ISHIKAWA TETSUYA ,  RABINOVICH YEVGENIY ,  LUBOMIRSKY DMITRY ,  MOK YEUK-FAI EDWIN ,  NGUYEN SON T

IPC: C25D7/12 ,  B08B3/02 ,  C25D5/00 ,  C25D17/00 ,  C25D17/02 ,  C25D19/00 ,  C25D21/00 ,  C25D21/08 ,  H01L21/00 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/67167 ,  B08B3/02 ,  C25D5/003 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/02 ,  C25D21/08 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

公开(公告)号：EP1464731A4

公开(公告)日：2007-03-21

申请号：EP01274958

申请日：2001-12-12

Applicant: SANYO ELECTRIC CO

Inventor： KAMEYAMA KOUJIRO

IPC: C25D5/10 ,  C25D7/12 ,  C25D17/28 ,  C25D21/00 ,  H01L23/495 ,  C25D7/00 ,  C25D17/00 ,  C25D17/08 ,  C25D19/00 ,  H01L23/50

CPC classification number: H01L23/49582 ,  C25D5/10 ,  C25D7/123 ,  C25D17/001 ,  C25D17/28 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2224/48

Abstract: Problem: It has been desired to form a plurality of combinations of plating films continuously on a single transfer rail and to form a plating film having a high quality and a uniform thickness on the surfaces of a lead frame and leads. Solving means: The plating apparatus is provided below the single transfer rail with a plurality of plating tanks, in which plating solution baths are disposed. By moving the plating solution between the plating tanks and the plating solution baths, it is possible to select a plating film to be formed on a conductive member (21). As a result, it is possible to form combinations of plating films on the conductive member (21) continuously by the single transfer rail.

公开(公告)号：EP1656212A2

公开(公告)日：2006-05-17

申请号：EP04786316.2

申请日：2004-08-17

Applicant: Offredy, Vincent ,  Offredy, Gérard ,  Chanussot, Jean-Marc

Inventor： CHANUSSOT, Jean-Marc ,  VASSE, Jean-Pierre ,  PITTE, Jacques

IPC: B05C9/06 ,  C25D9/02 ,  C25D19/00

CPC classification number: B05B13/00 ,  B05B12/20

Abstract: The invention relates to a method and an installation for providing a workpiece exposed to the impact of various projectiles, especially grit, with an anti-gritting protective coating covering the entire surface of the workpiece except the parts to be excluded, that is the sites of the boreholes, bolts and attachments. The inventive method is characterised by the fact that the anti-gritting coating and an anti-corrosion coating, based on epoxy resins, acrylic resins or other resins, are independently applied by electrodeposition in two distinct stages to the parts of the workpiece to be protected which are respectively concerned by the two coatings. To this end, resists are placed on the parts of the workpiece that should not receive the anti-corrosion coating, said resists being positioned before the application of the anti-gritting coating, either on a workpiece already provided with the anti-corrosion coating, or on a workpiece that has, so far, only been subjected to surface preparation.

公开(公告)号：EP1222321B8

公开(公告)日：2004-11-03

申请号：EP00975832

申请日：2000-10-05

Applicant: ATOTECH DEUTSCHLAND GMBH

Inventor： HUEBEL EGON

IPC: C25D7/06 ,  C25D5/00 ,  C25D5/18 ,  C25D17/00 ,  C25D17/28 ,  C25D19/00 ,  C25F7/00 ,  H05K3/24

CPC classification number: H05K3/241 ,  C25D7/0621 ,  C25D17/28

公开(公告)号：EP1239061A3

公开(公告)日：2004-03-03

申请号：EP02005140.5

申请日：2002-03-07

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Voss, Reinhold ,  Wittenbecher, Nils

IPC: G05B19/05 ,  C25D21/12 ,  C25D19/00

CPC classification number: C25D21/12

Abstract: Eine Galvanikanlage hat eine Vielzahl von Galvanikbädern, die in mehreren Badreihen bzw. -gruppen angeordnet sind. Ohne beim Betrieb dieser Galvanikanlage die beispielsweise bei Wartungsarbeiten, z.B. bei Flugzeugwartungen, vorgegebenen Zeitraster besser und mit einem geringeren Aufwand einhalten zu können wird vorgeschlagen, dass je Badreihe bzw. -gruppe der Galvanikanlage eine speicherprogrammierbare Steuereinheit SPS (1) vorgesehen ist, mittels der jeweils die Galvanikbäder einer Badreihe bzw. -gruppe steuerbar sind, dass die speicherprogrammierbaren Steuereinheiten SPS (1) mittels eines ersten Netzwerks (3) untereinander und mit einer Server-PC-Einrichtung (6) verbunden sind, und dass Bedien- und Beobachtungs-PC (8, 9, 10) mittels eines zweiten Netzwerks (4) an die Server-PC-Einrichrichtung (6) angeschlossen sind.

公开(公告)号：EP1243672A1

公开(公告)日：2002-09-25

申请号：EP00985819.2

申请日：2000-12-21

Applicant: SPC Electronics Corporation

Inventor： 0NOBATA, Hirotaka SPC Electronics Corporation ,  SONODA, Haruki, SPC Electronics Corporation ,  TATEHABA, Yoshihito, SPC Electronics Corporation ,  OHTSUBO, Tetsurou, SPC Electronics Corporation ,  MORITO, Yasuomi, SPC Electronics Corporation ,  SHIMADA, Kiyoshi, SPC Electronics Corporation ,  ABE, Yusuke, SPC Electronics Corporation ,  ANDO, Ei'ichi, SPC Electronics Corporation ,  ISHI, Tetsuji, SPC Electronics Corporation

IPC: C25D19/00

CPC classification number: C25D17/02 ,  C25D7/123 ,  C25D17/001 ,  C25D21/08 ,  H05K3/241

Abstract: A plating apparatus and plating method for an electronic component substrate or the like which prevent the spread of metal contamination in and out of the plating apparatus, do not dissolve a seed layer, have no defects caused by scattering of a treating liquid and wash only the perimeter of the electronic component substrate or the like are provided. The plating apparatus is a plating apparatus for plating an object to be plated such as an electronic component substrate. The plating apparatus includes appropriate numbers of plating baths and baths used for washing or other purposes therein and carries out plating, edge etching, washing and drying continuously therein.

Abstract translation: 用于防止金属污染物进出电镀装置的电子部件基板等的电镀装置和电镀方法不溶解种子层，没有由处理液的飞散引起的缺陷，仅洗涤 提供电子部件基板等的周边。 电镀装置是用于电镀诸如电子部件基板的被镀物体的电镀装置。 电镀装置包括适当数量的电镀浴和用于洗涤或其它目的的浴，并在其中连续进行电镀，边缘蚀刻，洗涤和干燥。

公开(公告)号：EP0086115B1

公开(公告)日：1987-08-12

申请号：EP83300671.1

申请日：1983-02-10

Applicant: NIPPON STEEL CORPORATION

Inventor： Sakai, Kango Process Technology R&D Lab ,  Nakano, Hirohumi Process Technology R&D Lab

IPC: C25D7/06 ,  C25D5/08 ,  C25D17/12 ,  C25D19/00

CPC classification number: C25D5/08 ,  C25D7/0621 ,  C25D17/004

公开(公告)号：EP0132719A1

公开(公告)日：1985-02-13

申请号：EP84108238.1

申请日：1984-07-12

Applicant: Instytut Mechaniki Precyzyjnej

Inventor： Wasiak, Ryszard ,  Kieszkowski, Marek ,  Cichowski, Dariusz ,  Ciecko, Pawel ,  Zubr, Maciej

IPC: C25D21/00 ,  C25D21/10 ,  C25D21/18 ,  C25D17/00 ,  C25D19/00 ,  C23G1/36

CPC classification number: C25D21/00 ,  C25D5/003 ,  C25D21/02 ,  C25D21/16

Abstract: The device for conducting a closed cycle of the electroplating bath, especially in the process of electroplating, comprising an electrolytic tank, an evaporation device connected with the electrolytic tank through a device feeding the electroplating bath, is characterized in that in the electrolytic tank or in the vicinity thereof heating devices (17) are comprised and in the evaporation chamber of the evaporation device (10) there are no heating devices, the evaporation chamber (2) of the evaporation device is horizontal and comprises a partition (3), the inlet (1) of the bath to the evaporation chamber is situated on the opposite side in relation to the partition (3), the evaporation chamber (2) comprises a perforated conduit (6) or conduits and/or conduits having porous walls, the evaporation chamber (2) is connected from the side of the partition (3) with a separator (4), the upper part of the separator (4) comprises a drop catcher (7), and the lower part of the separator (4) comprises a conduit (5) taking off the concentrated bath to the electrolytic tank (9), the heating device (17) in the tank being connected to a temperature-control system (14, 15, 16) for control of the temperature of the bath.

Abstract translation: 用于进行电镀浴的封闭循环，爱特别是在电镀过程中，包括电解槽，其中蒸发装置通过供给电镀浴中的装置中的电解容器连接的装置中，其特征在于在电解槽或在没有 其加热装置附近（17）被包括并且在所述蒸发装置的蒸发室（10）没有加热装置中，蒸发室（2）的蒸发器是水平的，并且包括一个分区（3），所述入口 浴至蒸发室（1）位于相对于所述相反侧（3），蒸发室（2）包括一个穿孔的导管（6），或具有多孔壁的导管和/或导管，蒸发该分区 室（2）被从分区（3）的一侧与分离器（4）连接时，分离器的上部（4）包括一个液滴捕集（7）和分离器（4）COMPR的下部 ISES脱下浓浴到电解槽（9），加热装置（17）在罐中的导管（5）被连接到一个温度控制系统（14，15，16），用于将温度控制 浴。