公开(公告)号：EP1243672A4

公开(公告)日：2003-04-09

申请号：EP00985819

申请日：2000-12-21

申请人： SHIMADA RIKA KOGYO KK

发明人： NOBATA HIROTAKA ,  SONODA HARUKI ,  TATEHABA YOSHIHITO ,  OHTSUBO TETSUROU ,  MORITO YASUOMI ,  SHIMADA KIYOSHI ,  ABE YUSUKE ,  ANDO EI ICHI ,  ISHI TETSUJI

IPC分类号： C23G3/00 ,  C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  C25D19/00 ,  C25D21/00 ,  C25D21/08 ,  H01L21/288 ,  H01L23/12 ,  H05K3/18 ,  H05K3/24 ,  H01L21/00

CPC分类号： C25D17/02 ,  C25D7/123 ,  C25D17/001 ,  C25D21/08 ,  H05K3/241

摘要： A plating device and a plating method, for plating electronic parts boards, etc., while preventing metal pollution from spreading inside and outside the plating device, preventing the seed layer from dissolving, and preventing the washing liquid from dispersing to cause defects, the outer periphery alone being washed. The plating device, which applies plating treatment or the like to a subject of treatment, such as an electronic parts board, includes a suitable number of plating tanks and a suitable number of treating tanks for washing or the like, installed therein, and the plating treatment, end etching treatment, washing treatment, and drying treatment are continuously effected inside the device.

公开(公告)号：EP0975015A4

公开(公告)日：2000-10-11

申请号：EP98941729

申请日：1998-09-04

申请人： SHIMADA RIKA KOGYO KK

发明人： SONODA HARUKI ,  NISHIZAKI KAZUTO ,  OISHI TETSUJI ,  HIROKAWA MASATOSHI ,  ANDO EI ICHI ,  ABE YUSUKE ,  OMORI MASASHI

IPC分类号： H01L21/00 ,  H01L21/304 ,  H01L21/677

CPC分类号： H01L21/67057 ,  H01L21/67781

摘要： Wafer cleaning equipment capable of preventing wafer contamination and allowing effective wafer cleaning and a tray for use in the wafer cleaning equipment. The equipment is provided with a belt-like tray (12) having grooves (12a) to grasp both edges of wafers (1) and surrounding the wafers (1) so that the upper and lower parts of the wafers are exposed and a cleaning bath (20) to clean the wafers (1) held in this tray (12) and transferred by a transfer robot (2). The cleaning bath (20) has guides (22) to place the tray (12) in the bath, a nearly V-shaped bottom (26) fit to the shape of the bottoms of the wafers (1), and outlets (24) to supply a cleaning fluid into the bath. In addition, the cleaning bath (20) has overflow baths (30) on both its sides to receive the cleaning fluid spilling from the cleaning bath (20). The overflow baths (30) have a circulation line (32) to return the cleaning fluid to the cleaning bath (20), and a pump (34) and a valve (36) fitted to the circulation line (32).