公开(公告)号：EP0320601A3

公开(公告)日：1990-04-25

申请号：EP88117392.6

申请日：1988-10-19

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Foust, Donald F. ,  Philipose, George K.

IPC: C25D5/54

CPC classification number: C25D5/54 ,  H05K3/188 ,  H05K3/424 ,  H05K3/427 ,  H05K2203/0716 ,  Y10S205/92

Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

公开(公告)号：EP0320601A2

公开(公告)日：1989-06-21

申请号：EP88117392.6

申请日：1988-10-19

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Foust, Donald F. ,  Philipose, George K.

IPC: C25D5/54

CPC classification number: C25D5/54 ,  H05K3/188 ,  H05K3/424 ,  H05K3/427 ,  H05K2203/0716 ,  Y10S205/92

Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

Abstract translation: 由有机塑料形成的制品的表面进行金属电镀的方法。 该方法包括使浸入含有溶解电镀金属的电解质中的两个电极之间的电流通过的步骤。 其中一个电极是待镀的制品，并且具有与导电区域相邻并与其接触的过渡金属硫化物区域的表面。 该方法对印刷电路板的形成特别有用，并且通过涉及图案电镀的工艺能够形成印刷电路板是足够通用的。