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公开(公告)号：EP0737935A3
公开(公告)日：1999-12-01
申请号：EP96105737.9
申请日：1996-04-11
申请人： SONY CHEMICALS CORP.
IPC分类号： G06K19/077
CPC分类号： G06K19/0775 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01L24/74 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2224/48465 , H01L2224/81903 , H01L2224/83851 , H01L2924/00011 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2224/29075
摘要： In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.
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2.发明公开Non-contact IC card and process for its production 失效Kontaktlose Chipkarte und Herstellungsverfahren
公开(公告)号：EP0737935A2
公开(公告)日：1996-10-16
申请号：EP96105737.9
申请日：1996-04-11
申请人： SONY CHEMICALS CORP.
IPC分类号： G06K19/077
CPC分类号： G06K19/0775 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01L24/74 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2224/48465 , H01L2224/81903 , H01L2224/83851 , H01L2924/00011 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2224/29075
摘要： In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.
摘要翻译： 在包括基板并且设置在其上的至少一个IC芯片和通过蚀刻形成的天线线圈的非接触式IC卡中，天线线圈的连接端子和IC芯片的连接凸块以面朝下的方式经由 各向异性导电粘合剂层，或通过引线键合互连。
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