公开(公告)号：EP0704106B1

公开(公告)日：2003-01-29

申请号：EP95916425.2

申请日：1995-04-17

申请人： MICRON TECHNOLOGY, INC.

发明人： FARNWORTH, Warren, M. ,  FOLARON, Jennifer, L. ,  FOLARON, Robert, J. ,  HEMBREE, David, R. ,  JACOBSON, John, O. ,  NELSON, Jay, C. ,  WARREN, Lelan, D.

IPC分类号： H01L21/00 ,  H05K13/08

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： An apparatus for automatically positioning electronic die within temporary packages to enable continuity testing and the like between the die bond pads and the temporary package electrical interconnects is provided. The apparatus includes a robot having a programmable robot arm with a gripper assembly, die and lid feeder stations, a die inverter, and a plurality of cameras or image producers. The cameras take several pictures of the die and temporary packages to precisely align the die bond pads with the temporary package electrical interconnects. A predetermined assembly position is located along a conveyor that conveys a carrier between a first position, corresponding to an inlet, and a second position, corresponding to an outlet. The die, a restraining device and temporary package are assembled at the predetermined assembly position and tested for continuity therebetween. The apparatus further includes a fifth camera which locates the die at a wafer handler. The apparatus has a control mechanism including a microprocessor and associated program routines that selectively control the robot arm (i) to move the gripper assembly to the lid feeder station to pick up a lid, (ii) to move the gripper assembly along with the lid to pick up the die following photographing by the rough die camera, (iii) to move the gripper assembly along with the lid and the die to a position to be photographed by the fine die camera, and (iv) to move the lid and the die to the predetermined assembly position located along the conveyor. The method and apparatus may also be used for disassembly.

公开(公告)号：EP3276655A1

公开(公告)日：2018-01-31

申请号：EP16181184.9

申请日：2016-07-26

申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

发明人： ARUTINOV, Gari ,  SMITS, Edsger Constant Pieter ,  VAN DEN BRAND, Jeroen

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K1/005 ,  H05K3/34

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K1/005 ,  H01L24/74 ,  H01L24/80 ,  H05K2201/10674 ,  H05K2203/1545

摘要： A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

摘要翻译： 一种通过设置在其间的热粘合材料将芯片热粘合到衬底的方法和系统。 至少将衬底从初始温度预热至低于衬底损伤温度的升高温度。 施加到芯片上的光脉冲瞬间将芯片温度增加到低于芯片的峰值损伤温度的脉冲峰值温度。 瞬时增加的芯片的脉冲峰值温度引起从芯片到结合材料的传导热量的流动，导致结合材料形成结合。

公开(公告)号：EP4385066A1

公开(公告)日：2024-06-19

申请号：EP21755982.2

申请日：2021-08-09

申请人： X-Celeprint Limited ,  LEONHARD KURZ Stiftung & Co. KG

发明人： COK, Ronald S. ,  TRINDADE, António José ,  SCHARFENBERG, Michael ,  SCHULZ, Christian ,  ROITHMEIER, Gabriele

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L23/00 ,  H01L33/00 ,  H01L27/15

CPC分类号： H01L33/0095 ,  H01L27/153 ,  H01L21/67144 ,  H01L21/6835 ,  H01L2221/6835420130101 ,  H01L2221/6836820130101 ,  H01L2221/6838120130101 ,  H01L2221/683520130101 ,  H01L2221/6831820130101 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/3222520130101 ,  H01L2224/2422620130101 ,  H01L2224/3214520130101 ,  H01L2224/2414620130101 ,  H01L2224/9520130101 ,  H01L2224/95120130101 ,  H01L2224/9513320130101 ,  H01L2224/8319220130101 ,  H01L2224/2731220130101 ,  H01L2224/2762220130101 ,  H01L2224/8386220130101 ,  H01L2224/8387420130101 ,  H01L2224/7525120130101 ,  H01L23/544 ,  H01L2224/8312120130101 ,  H01L2224/8314320130101 ,  H01L2224/8320820130101 ,  H01L2224/8398620130101 ,  H01L24/33 ,  H01L2224/3318120130101 ,  H01L2224/7326720130101 ,  H01L2224/7321720130101 ,  H01L2224/922220130101 ,  H01L24/92 ,  H01L24/32 ,  H01L24/27 ,  H01L24/24 ,  H01L2224/7420130101 ,  H01L24/74 ,  H01L24/75 ,  H01L2224/756520130101 ,  H01L25/50 ,  H01L25/0655 ,  H01L25/16

公开(公告)号：EP2457250A4

公开(公告)日：2012-11-28

申请号：EP10802608

申请日：2010-06-22

申请人： SEMPRIUS INC

发明人： MENARD ETIENNE

IPC分类号： H01L21/28 ,  B05C1/02 ,  B05D1/18 ,  B82Y10/00 ,  G03F7/00 ,  H01L21/67

CPC分类号： H01L21/67092 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/187 ,  H01L21/67282 ,  H01L24/74 ,  H01L2224/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/00

公开(公告)号：EP0737935B1

公开(公告)日：2006-01-11

申请号：EP96105737.9

申请日：1996-04-11

申请人： SONY CHEMICALS CORPORATION

发明人： Orihara, Katsuhisa ,  Fujimoto, Masahiro ,  Monkawa, Haruo ,  Kurita, Hideyuki

IPC分类号： G06K19/077

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L24/74 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2224/48465 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29075

公开(公告)号：EP0737935A2

公开(公告)日：1996-10-16

申请号：EP96105737.9

申请日：1996-04-11

申请人： SONY CHEMICALS CORP.

发明人： Orihara, Katsuhisa ,  Fujimoto, Masahiro ,  Monkawa, Haruo ,  Kurita, Hideyuki

IPC分类号： G06K19/077

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L24/74 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2224/48465 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29075

摘要： In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.

摘要翻译： 在包括基板并且设置在其上的至少一个IC芯片和通过蚀刻形成的天线线圈的非接触式IC卡中，天线线圈的连接端子和IC芯片的连接凸块以面朝下的方式经由 各向异性导电粘合剂层，或通过引线键合互连。

公开(公告)号：EP2457250B1

公开(公告)日：2015-10-28

申请号：EP10802608.9

申请日：2010-06-22

申请人： Semprius, Inc.

发明人： MENARD, Etienne

IPC分类号： H01L21/28 ,  H01L21/67 ,  B05C1/02 ,  B05D1/18 ,  G03F7/00 ,  B82Y10/00

CPC分类号： H01L21/67092 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/187 ,  H01L21/67282 ,  H01L24/74 ,  H01L2224/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/00

公开(公告)号：EP2863420A1

公开(公告)日：2015-04-22

申请号：EP14187420.6

申请日：2014-10-02

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  STMicroelectronics (Crolles 2) SAS

发明人： Di Cioccio, Léa ,  Beilliard, Yann

IPC分类号： H01L21/60 ,  H01L25/065

CPC分类号： B23K20/002 ,  B23K20/24 ,  B23K31/02 ,  B23K2101/36 ,  H01L21/187 ,  H01L24/05 ,  H01L24/06 ,  H01L24/74 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05009 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05693 ,  H01L2224/06505 ,  H01L2224/06517 ,  H01L2224/08145 ,  H01L2224/75754 ,  H01L2224/80097 ,  H01L2224/80136 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80906 ,  H01L2224/80948 ,  H01L2224/80986 ,  H01L2224/95 ,  H01L2225/06513 ,  H05K3/4611 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/80001

摘要： Procédé d'assemblage par collage direct d'un premier (I) et deuxième (II) éléments munis chacun d'une surface d'assemblage, l'une au moins des surfaces d'assemblage comprenant des portions métalliques (6, 106) en retrait entourées de matériaux diélectriques (4, 104) comportant :
A) une étape de mise en contact des deux surfaces d'assemblage sans application de pression de sorte qu'un collage direct soit obtenu entre les surfaces d'assemblage, lesdits premier et deuxième ensembles (I, II) formant un empilement présentant une épaisseur donnée (e),
B) une étape de traitement thermique dudit empilement, pendant lequel, les faces arrière (10, 110) des premier (I) et deuxième (II) éléments sont immobilisées de sorte qu'elles soient maintenues à distance fixe (E) comprise entre l'épaisseur donnée de l'empilement +/- 2 nm.

公开(公告)号：EP2299486B1

公开(公告)日：2015-02-18

申请号：EP09011911.6

申请日：2009-09-18

申请人： EV Group E. Thallner GmbH

发明人： Wimplinger, Markus

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L25/00 ,  H01L23/00

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/74 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/74 ,  H01L2224/7598 ,  H01L2224/80006 ,  H01L2224/80065 ,  H01L2224/80075 ,  H01L2224/80205 ,  H01L2224/80805 ,  H01L2224/80815 ,  H01L2224/8082 ,  H01L2224/80907 ,  H01L2224/81 ,  H01L2224/81005 ,  H01L2224/81065 ,  H01L2224/81075 ,  H01L2224/81205 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2224/81907 ,  H01L2224/83005 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/83205 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2224/83907 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2224/80 ,  H01L2224/83 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05552

公开(公告)号：EP2180505A3

公开(公告)日：2013-02-27

申请号：EP09252154.1

申请日：2009-09-10

申请人： Carsem (M) Sdn. Bhd.

发明人： Khor, Lily ,  Yong, Lam Wai ,  Lau, Choong Keong

IPC分类号： H01L21/60 ,  H01L23/485

CPC分类号： H01L21/561 ,  H01L23/291 ,  H01L23/293 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/74 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/742 ,  H01L2224/78267 ,  H01L2224/78303 ,  H01L2224/78611 ,  H01L2224/85 ,  H01L2224/85207 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/13099 ,  H01L2924/00

摘要： A method of fabricating a wafer-level package is described. The method includes providing an active device on a semiconductor wafer (300) that has not been singulated, the active device having a plurality of bonding pads (104) exposed at an upper surface of the wafer (300). Prior to singulating the semiconductor wafer (300), a plurality of stud bumps (106,610) are formed with a wire bonding tool on the plurality of bonding pads (104,612). Thereafter, a moulding encapsulation layer (108) is applied over the semiconductor wafer (300), leaving an upper portion of each of the plurality of stud bumps (106) exposed.