公开(公告)号：EP3840040A1

公开(公告)日：2021-06-23

申请号：EP20214010.9

申请日：2020-12-15

Applicant: STMicroelectronics S.r.l.

Inventor： TIZIANI, Mr. Roberto ,  MAZZOLA, Mr. Mauro

IPC: H01L23/495

Abstract: A leadframe (10) for semiconductor devices, the leadframe (10) comprising a die pad portion (14) having a first planar die-mounting surface (14a) and a second planar surface (14b) opposed the first surface (14a), the first surface (14a) and the second surface (14b) having facing peripheral rims jointly defining a peripheral outline of the die pad (14), wherein:
the die pad (14) comprises at least one package molding compound receiving cavity (18) opening at the periphery of said first planar surface (14a),
the peripheral rims of said first surface (14a) and said second surface (14b) are mutually offset to provide a stepped peripheral outline of the die pad (14) with the periphery of said first planar surface (14a) having a peripheral region protruding with respect to the second planar surface (14b), wherein said at least one package molding compound receiving cavity (18) is provided at said protruding region of the first planar surface (14a), and
the at least one package molding compound receiving cavity (18) partially overlaps and goes through said stepped peripheral outline of the die pad (14).

公开(公告)号：EP4365943A1

公开(公告)日：2024-05-08

申请号：EP23207486.4

申请日：2023-11-02

Applicant: STMicroelectronics S.r.l.

Inventor： MAZZOLA, Mr. Mauro

IPC: H01L23/495

CPC classification number: H01L23/49524 ,  H01L23/49562

Abstract: A semiconductor die (14) is arranged on a die pad (12A) in leadframe (12) and electrically coupled with one or more electrically conductive leads (12B) in the leadframe (12) arranged peripherally of the leadframe (12) with an electrical coupling member (clip block, 100) applied onto the semiconductor die (14) arranged on the leadframe (12).
The electrical coupling member (100) comprises a planar body (24, 102, 104) configured to cover the semiconductor die (14) as well as the electrically conductive lead or leads (12B). The planar body of the electrical coupling member (100) comprises electrically insulating material (24) having embedded therein at least one strip-like, electrically conductive formation (102, 104) having a first end (102) configured to contact (SM) the semiconductor die (14) as well as a second end (104) configured to contact (SM) the electrically conductive lead or leads (12B).