公开(公告)号：EP3919945A1

公开(公告)日：2021-12-08

申请号：EP21176460.0

申请日：2021-05-28

Applicant: STMicroelectronics S.r.l.

Inventor： MAGGI, Luca ,  SHAW, Mark Andrew

IPC: G02B3/00 ,  G02B7/00

Abstract: An apparatus (10), comprising:
an optically transparent substrate (18) having a first surface and a second surface opposed the first surface;
a piezoelectric membrane (20) arranged at the first surface of the optically transparent substrate (18), the piezoelectric membrane (20) configured to oscillate as a result of light propagated through the optically transparent substrate (18) impinging onto the piezoelectric membrane (20), wherein at least one reflective facet (40) facing the optically transparent substrate (18) is provided at the piezoelectric membrane (20) ;
an optical element (30) configured to receive a light beam at an input end and to guide the light beam towards an output end couplable to the second surface of the optically transparent substrate (18),
The optical element (30) incorporates: a light focusing path (32) configured to focus (320) a light beam at a focal point (FP) at the piezoelectric membrane (20), and at least one light collimating path (34) configured to collimate the light beam onto the at least one reflective facet (40), wherein the optical element (30) is configured to guide light reflected (R, 31) from the at least one reflective facet (40) to the input end, wherein the light reflected (R, 31) to the input end is indicative of the position of the optical element (30) with respect to the focal point (FP).

公开(公告)号：EP4361091A1

公开(公告)日：2024-05-01

申请号：EP23203161.7

申请日：2023-10-12

Applicant: STMicroelectronics S.r.l.

Inventor： SHAW, Mark Andrew ,  CORSO, Lorenzo ,  GARAVAGLIA, Matteo ,  ALLEGATO, Giorgio

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B2207/0720130101 ,  B81C2203/015420130101 ,  B81C2203/079220130101

Abstract: Device formed by a first die (210) and a second die (221). The first die is of semiconductor and integrates electronic components (202). The second die has a main surface (210A), forms patterned structures (230) and is bonded to the first die. Internal electrical coupling structures (242) electrically couple the main surface (210A) of the first die (210) to the second die (221). External connection regions (241) extend on the main surface of the first die (210). A package (246) embeds the first die (210), the second die (221) and the internal electrical coupling structures (242) and partially surrounds the external connection regions (241), the external connection regions partially protruding from the package. The second die (221) has through recesses (207, 208) accommodating external connection regions