公开(公告)号：EP4187588A9

公开(公告)日：2023-07-26

申请号：EP22206585.6

申请日：2022-11-10

Applicant: STMicroelectronics S.r.l.

Inventor： MAGGI, Luca ,  DEL SARTO, Marco ,  GRITTI, Alex ,  MAIERNA, Amedeo

IPC: H01L23/13 ,  H01L23/538 ,  H05K3/46

Abstract: The electronic module (10) has a three-dimensional frame (12), a printed circuit board (15) and a plurality of electronic devices (17). The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions (37A-37F) which extend transversely to each other in space. The electronic devices (17) are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

公开(公告)号：EP3919945A1

公开(公告)日：2021-12-08

申请号：EP21176460.0

申请日：2021-05-28

Applicant: STMicroelectronics S.r.l.

Inventor： MAGGI, Luca ,  SHAW, Mark Andrew

IPC: G02B3/00 ,  G02B7/00

Abstract: An apparatus (10), comprising:
an optically transparent substrate (18) having a first surface and a second surface opposed the first surface;
a piezoelectric membrane (20) arranged at the first surface of the optically transparent substrate (18), the piezoelectric membrane (20) configured to oscillate as a result of light propagated through the optically transparent substrate (18) impinging onto the piezoelectric membrane (20), wherein at least one reflective facet (40) facing the optically transparent substrate (18) is provided at the piezoelectric membrane (20) ;
an optical element (30) configured to receive a light beam at an input end and to guide the light beam towards an output end couplable to the second surface of the optically transparent substrate (18),
The optical element (30) incorporates: a light focusing path (32) configured to focus (320) a light beam at a focal point (FP) at the piezoelectric membrane (20), and at least one light collimating path (34) configured to collimate the light beam onto the at least one reflective facet (40), wherein the optical element (30) is configured to guide light reflected (R, 31) from the at least one reflective facet (40) to the input end, wherein the light reflected (R, 31) to the input end is indicative of the position of the optical element (30) with respect to the focal point (FP).

公开(公告)号：EP3715925A1

公开(公告)日：2020-09-30

申请号：EP20163751.9

申请日：2020-03-17

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics S.r.l.

Inventor： BOEUF, Frederic ,  MAGGI, Luca

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/30 ,  G02B6/34 ,  H01L33/58 ,  H01L33/62 ,  G02B6/12 ,  G02B6/42

Abstract: La présente description concerne une puce (1000) de circuit intégré photonique comprenant : une pluralité de coupleurs (18) à réseau de diffraction verticale définis dans une première couche semiconductrice (10) ou isolante surmontée d'une structure d'interconnexion (24) comprenant plusieurs niveaux de métal (M1, M2, M3, M4) noyés dans des deuxièmes couches isolantes (28A, 28B) ; et une cavité (200) s'étendant en profondeur à travers les deuxièmes couches isolantes (28A, 28B) jusqu'à un niveau intermédiaire entre les coupleurs (18) et le niveau de métal (M1) le plus proche des coupleurs (18), la cavité ayant des dimensions latérales telles que la cavité est adaptée à recevoir un bloc de maintien (302) d'un réseau de fibres optiques (304) destinées à être couplées optiquement avec les coupleurs (18).

公开(公告)号：EP4187588A1

公开(公告)日：2023-05-31

申请号：EP22206585.6

申请日：2022-11-10

Applicant: STMicroelectronics S.r.l.

Inventor： MAGGI, Luca ,  DEL SARTO, Marco ,  GRITTI, Alex ,  MAIERNA, Amedeo

IPC: H01L23/13 ,  H01L23/538 ,  H05K3/46

Abstract: The electronic module (10) has a three-dimensional frame (12), a printed circuit board (15) and a plurality of electronic devices (17). The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions (37A-37F) which extend transversely to each other in space. The electronic devices (17) are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

公开(公告)号：EP3974889A1

公开(公告)日：2022-03-30

申请号：EP21198930.6

申请日：2021-09-24

Applicant: STMicroelectronics S.r.l.

Inventor： DEL SARTO, Marco ,  GRITTI, Alex ,  MAIERNA, Amedeo ,  MAGGI, Luca

IPC: G02B26/08 ,  G02B26/10

Abstract: An electronic module (30) comprising: a first die (35) of semiconductor material including a first reflector (10); a second die (36) of semiconductor material including a second reflector (20); and a frame (31) including a first supporting portion and a second supporting portion (32, 33) parallel to one another. The first and second dies (35, 36) are carried, respectively, by the first and second supporting portions (32, 33) and are respectively arranged so that the first reflector (10) faces the second supporting portion and the second reflector (20) faces the first supporting portion (32). An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.