公开(公告)号：EP1035760A2

公开(公告)日：2000-09-13

申请号：EP00104843.8

申请日：2000-03-07

申请人： SUMITOMO BAKELITE COMPANY LIMITED

发明人： Komiyatani, Toshio, c/o Sumitomo Bakelite Co. Ltd. ,  Uesaka, Masao, c/o Sumitomo Bakelite Co. Ltd. ,  Arai, Masataka, c/o Sumitomo Bakelite Co. Ltd. ,  Kawaguchi, Hitoshi, c/o Sumitomo Bakelite Co. Ltd.

IPC分类号： H05K3/46 ,  H05K3/38 ,  C09J181/00 ,  C09J163/00

CPC分类号： H05K3/4655 ,  H05K1/0333 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0358 ,  Y10S525/936 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31533

摘要： In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers. That is, the present invention lies in an interlaminar insulating adhesive for multilayer printed circuit board containing the following components as essential components:

(a) a sulfur-containing thermoplastic resin having a weight-average molecular weight of 10 3 to 10 5 ,
(b) a sulfur-containing epoxy or phenoxy resin having a weight-average molecular weight of 10 3 to 10 5 ,
(c) a multifunctional epoxy resin having an epoxy equivalent of 500 or less, and
(d) an epoxy-curing agent.

摘要翻译： 为了提供具有细间距电路的多层印刷电路板，其中使用的层间绝缘粘合剂必须具有耐热性和低热膨胀系数，使得在电路形成和部件安装期间可以获得所需的精度。 因此，本发明的目的在于提供一种使用耐热性优异，热膨胀系数低的层间绝缘胶的多层印刷电路板，其中绝缘粘合剂层在电路层之间的厚度变化小。 也就是说，本发明在于用于多层印刷电路板的层间绝缘粘合剂，其包含以下组分作为必要组分：（a）重均分子量为10 3至10 5的含硫热塑性树脂 >，（b）重均分子量为10 3〜10 5的含硫环氧树脂或苯氧基树脂，（c）环氧当量为500以下的多官能环氧树脂，（d ）环氧固化剂

公开(公告)号：EP1035760B1

公开(公告)日：2004-12-22

申请号：EP00104843.8

申请日：2000-03-07

申请人： SUMITOMO BAKELITE COMPANY LIMITED

发明人： Komiyatani, Toshio, c/o Sumitomo Bakelite Co. Ltd. ,  Uesaka, Masao, c/o Sumitomo Bakelite Co. Ltd. ,  Arai, Masataka, c/o Sumitomo Bakelite Co. Ltd. ,  Kawaguchi, Hitoshi, c/o Sumitomo Bakelite Co. Ltd.

IPC分类号： H05K3/46 ,  H05K3/38 ,  C09J181/00 ,  C09J163/00

CPC分类号： H05K3/4655 ,  H05K1/0333 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0358 ,  Y10S525/936 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31533