DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION USING SILICON CONTROLLED RECTIFIER

    公开(公告)号:EP4404262A1

    公开(公告)日:2024-07-24

    申请号:EP23220525.2

    申请日:2023-12-28

    IPC分类号: H01L27/02 H01L29/74

    CPC分类号: H01L27/0262 H01L29/74

    摘要: Provided is a device including a first clamp circuit electrically connected between a first node and a second node, and a second clamp circuit electrically connected between the second node and a third node, wherein the first clamp circuit includes a first silicon controlled rectifier (SCR) including a first region of a first conductivity type electrically connected to the first node, a second region of a second conductivity type, a third region of the first conductivity type, and a fourth region of the second conductivity type electrically connected to the second node, and a first gate electrode disposed over a channel region including a junction of the second region and the third region between the first region and the fourth region.

    ELECTROSTATIC DISCHARGE PROTECTION DEVICE
    5.
    发明公开

    公开(公告)号:EP4432356A1

    公开(公告)日:2024-09-18

    申请号:EP24151090.8

    申请日:2024-01-10

    摘要: Disclosed is an electrostatic discharge protection device which includes a substrate including a first well having a first conductivity type and a second well surrounding the first well, first to fifth diffusion regions formed on the first well, and sixth and seventh diffusion regions formed on the second well. The second diffusion region surrounds the first diffusion region, the fourth diffusion region surrounds the fifth diffusion region, and the fifth diffusion region surrounds the second diffusion region and the fourth diffusion region. The sixth diffusion region surrounds the fifth diffusion region, and the seventh diffusion region surrounds the sixth diffusion region. The sixth and seventh diffusion regions are connected to an anode electrode, and the first to fifth diffusion regions are connected a cathode electrode.

    SEMICONDUCTOR DEVICE
    6.
    发明公开

    公开(公告)号:EP4411818A1

    公开(公告)日:2024-08-07

    申请号:EP23205440.3

    申请日:2023-10-24

    IPC分类号: H01L27/02 H03K19/003

    摘要: A semiconductor device (200) is provided. The semiconductor device (200) includes: a first power pad (201); a second power pad (202); a signal pad (203); a clamping circuit (230) connected between the first power pad (201) and the second power pad (202); a driving circuit (210) connected to the signal pad (203) and including a pull-up circuit and a pull-down circuit; and a first gate-off circuit (220) connected to the pull-down circuit. The first gate-off circuit (220) is configured to connect a gate of at least one pull-down element (PD) included in the pull-down circuit and a source of the at least one pull-down element (PD) to each other during an electrostatic discharge, ESD, event in which a high voltage is applied to the signal pad (203), and control a current generated by the high voltage to flow to the clamping circuit (230).

    ELECTRO-STATIC DISCHARGE PROTECTION DEVICE
    9.
    发明公开

    公开(公告)号:EP4345899A1

    公开(公告)日:2024-04-03

    申请号:EP23192386.3

    申请日:2023-08-21

    IPC分类号: H01L27/02 H01L29/74 H01L29/87

    摘要: An electro-static discharge protection device includes a substrate that includes a first well that has a first conductive type and a second well that has a second conductive type, and first to eighth diffusion regions formed on the first well and the second well. At least a portion of the diffusion regions formed in the first well are connected to a first electrode, and at least a portion of diffusion regions formed in a second well are connected to a second electrode. The contact between one of diffusion regions formed in the first well and an N well forms a trigger diode. A junction between one of diffusion regions formed in a second well and a P well forms a trigger diode. The trigger diodes are electrically connected to each other.