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    LEAD-FREE SOLDER ALLOY, JOINING MEMBER AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT
    1.
    发明公开
    LEAD-FREE SOLDER ALLOY, JOINING MEMBER AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT 有权
    无铅焊料合金，连接器及其制造方法和电子组件

    公开(公告)号：EP2474383A1

    公开(公告)日：2012-07-11

    申请号：EP10813768.8

    申请日：2010-09-02

    申请人： Senju Metal Industry Co., Ltd

    发明人： YOSHIKAWA, Shunsaku ,  YAMANAKA, Yoshie ,  OHNISHI, Tsukasa ,  ISHIBASHI, Seiko ,  WATANABE, Koji ,  ISHIKAWA, Hiroki ,  CHIBA, Yutaka

    IPC分类号： B23K35/26 ,  B23K1/08 ,  B23K1/20 ,  C22C28/00 ,  H01L23/373

    CPC分类号： H01L23/495 ,  B23K35/007 ,  B23K35/0238 ,  B23K35/26 ,  C22C28/00 ,  C23C24/103 ,  H01L23/3736 ,  H01L2924/0002 ,  H01R43/0235 ,  H01L2924/00

    摘要： A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1 - 3% and/or Bi: 0.1 - 2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

    摘要翻译： 本发明提供一种无铅焊料可以减少空隙的产生及使用该焊料并具有优异的粘合性，粘接强度，和可加工性的连接部件。 的无铅焊料合金具有如下组成基本上由锡的：0.1 - 3％和/或Bi：0.1 - 2％，且在和不可避免的杂质的剩余部分，且具有在时抑制空隙的发生的效果 焊接。 连接构件通过熔化无铅焊料合金，在熔体中浸渍金属制的基板，施加超声波振动，以将熔融的无铅焊料合金和金属衬底上制备，以形成表面上的无铅焊料合金层 的金属基板。 散热器和封装通过该连接部件通过回流加热在助熔剂的存在下焊接到海誓山盟。

    DEVICE FOR COATING THIN MOLTEN SOLDER FILM, THIN SOLDER FILM-COVERED COMPONENT AND MANUFACTURING METHOD THEREFOR
    3.
    发明公开
    DEVICE FOR COATING THIN MOLTEN SOLDER FILM, THIN SOLDER FILM-COVERED COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
    DEVICE用于生产涂层的薄的熔融焊料膜，细跟熔化的焊料膜涂敷的部件和过程

    公开(公告)号：EP2859980A1

    公开(公告)日：2015-04-15

    申请号：EP13804275.9

    申请日：2013-06-10

    申请人： Senju Metal Industry Co., Ltd

    发明人： SATO, Isamu ,  WATANABE, Koji ,  KIKUCHI, Kota ,  SUZUKI, Michio ,  KAMEDA, Naoto ,  NAKAMURA, Hideki

    IPC分类号： B23K1/08 ,  B23K1/20 ,  B23K31/02 ,  C23C2/08 ,  H05K3/34 ,  B23K103/08

    CPC分类号： B23K3/0676 ,  B23K1/012 ,  B23K1/08 ,  B23K1/20 ,  B23K31/02 ,  C23C2/003 ,  C23C2/04 ,  C23C2/10 ,  C23C2/16 ,  C23C2/20 ,  C23C2/36 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K3/3468 ,  H05K2203/044 ,  H05K2203/1545 ,  Y10T428/12701 ,  H01L2924/00

    摘要： A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few µm and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1 , this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few µm.

    摘要翻译： 用于镀覆薄熔融焊料电影可以控制在基材上均匀地和在几微米的增量的熔融焊料的薄膜厚度和获得具有比常规更小的膜厚度的薄膜焊料镀敷的热浸镀装置 系统。如图所示。 如图1所示，该装置包括容纳所述熔融焊料7的焊料浴17; 为从焊料浴汲取的带状构件31的第二搬送部23; 和用于通过第二输送部23从焊料浴正在制定后立即吹热气体的条状部件31上的送风部19; 具有预定流量和预定的温度比熔融焊料7。根据该结构的熔化温度等于或高于热气体，过量的熔融焊料7可从对应于所述熔融的组合物中的条带构件31被修整 焊料7因此，涂覆的条带构件31上的熔融焊料7的膜厚度可以均匀地和在几微米的增量控制。