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公开(公告)号：EP1886759B1
公开(公告)日：2016-10-05
申请号：EP06746755.5
申请日：2006-05-23
IPC分类号： B23K35/363 , C23C22/52 , H05K3/28 , H05K3/34 , B23K35/36 , H01L21/56 , B23K35/362 , C08G18/10 , C08L75/00 , C23F11/14
CPC分类号： B23K35/362 , B23K35/3613 , C23F11/149 , H05K3/282 , H05K2203/0786 , Y10T428/31678
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2.发明授权
公开(公告)号：EP2714962B1
公开(公告)日：2015-07-08
申请号：EP12727173.2
申请日：2012-05-23
CPC分类号： H05K1/09 , B23K35/365 , B23K2201/42 , B23K2203/12 , C07D233/56 , C07D235/08 , C07D409/04 , C07D409/06 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/0346 , H05K3/282 , H05K13/00
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3.发明公开
公开(公告)号：EP2714962A1
公开(公告)日：2014-04-09
申请号：EP12727173.2
申请日：2012-05-23
CPC分类号： H05K1/09 , B23K35/365 , B23K2201/42 , B23K2203/12 , C07D233/56 , C07D235/08 , C07D409/04 , C07D409/06 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/0346 , H05K3/282 , H05K13/00
摘要： A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
摘要翻译： 公开了一种包含咪唑化合物的铜或铜合金的表面处理组合物和用于将电子部件焊接到印刷线路板上的组合物的装置。
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公开(公告)号：EP4026931A1
公开(公告)日：2022-07-13
申请号：EP20861657.3
申请日：2020-09-01
发明人： YAMAJI, Noriaki , KOGA, Tatsuya , HIRAO, Hirohiko
摘要： The present invention provides a surface treatment liquid for metal having a sufficiently high film-forming property. The present invention relates to a surface treatment liquid for metal comprising an azole silane coupling agent, the surface treatment liquid further comprises (A) an organic acid ion having one to three acidic groups in one molecule; (B) an inorganic acid (or mineral acid) ion; (C) an alkali metal ion and/or an ammonium ion; and (D) a copper ion.
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5.发明授权SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF 有权铜及铜合金表面处理组合物及其应用
公开(公告)号：EP2721195B1
公开(公告)日：2015-07-08
申请号：EP12727174.0
申请日：2012-05-23
CPC分类号： B23K1/20 , B01D2252/20473 , B23K1/0016 , B23K1/203 , B23K35/36 , B23K35/3615 , B23K2201/42 , C07D233/64 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/09 , H05K3/282
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6.发明公开
公开(公告)号：EP2721195A1
公开(公告)日：2014-04-23
申请号：EP12727174.0
申请日：2012-05-23
CPC分类号： B23K1/20 , B01D2252/20473 , B23K1/0016 , B23K1/203 , B23K35/36 , B23K35/3615 , B23K2201/42 , C07D233/64 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/09 , H05K3/282
摘要： A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
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