摘要:
An EUV pellicle is proposed in which the pellicle frame is made of a material having a linear expansion coefficient of 10 x 10 -6 (1/K) or smaller, and as such this pellicle is recommendable for use in EUV exposure technology wherein temperature is raised and lowered repeatedly and hence the expansion and contraction of the pellicle frame would harm the pellicle membrane and the pellicle flatness.
摘要:
A pellicle is proposed in which an adhesive layer which adheres a pellicle film to a pellicle frame is mixed (filled) with powder of thermally conductive material such as metallic compound so that the heat generated by the strong EUV ray is quickly passed to the pellicle frame from the pellicle film lest the latter is deformed by the heat.
摘要:
A pellicle is proposed in which an adhesive layer which adheres a pellicle film to a pellicle frame is mixed (filled) with powder of thermally conductive material such as metallic compound so that the heat generated by the strong EUV ray is quickly passed to the pellicle frame from the pellicle film lest the latter is deformed by the heat.
摘要:
A pellicle is proposed in which an adhesive layer is formed of an adhesive which undergoes a hardness change at a rate from -50 % through +50 % of its initial hardness, measured after curing, when it is let to sit in atmosphere of a temperature of 300 degrees C for 7 days on end; the rate of hardness change being defined by a following equation: Rate of hardness change % = hardness after the sitting − initial hardness before the sitting ÷ initial hardness before the sitting × 100.
摘要:
The present invention is directed to a pellicle frame of a pellicle for use in photolithography, comprising: a coating of a layer containing a paraxylylene-based polymer. The invention can inhibit release of sulfate ions, ammonium ions and so on from the pellicle frame and thereby reduce the occurrence of haze under exposure environment.
摘要:
An EUV pellicle is proposed in which the pellicle frame is made of a material having a linear expansion coefficient of 10 x 10 -6 (1/K) or smaller, and as such this pellicle is recommendable for use in EUV exposure technology wherein temperature is raised and lowered repeatedly and hence the expansion and contraction of the pellicle frame would harm the pellicle membrane and the pellicle flatness.
摘要:
There is provided a pellicle having a frame (12), a film (11) and an adhesive (13) for bonding the film (11) to the frame (12), and this adhesive (13) is a silicone compound having a low outgassing tendency and high heat resistance; in a better mode case, it can maintain its adhesive strength at temperatures 100 - 200 degrees C and it exhibits results of TML being 1.0 % or lower and CVCM being 0.1 % or lower when tested in accordance with ASTM E595-93; thus this pellicle is useful for EUV light exposure lithography.
摘要:
Provided are an adhesive comprising substantially no surface modifier and leaving a less residue behind after a pellicle is separated; a pellicle; and a method of selecting an adhesive leaving a less residue behind. More specifically, provided are an adhesive for a pellicle having a ratio of a peel strength to a tensile strength of from 0.10 to 0.33; a pellicle comprising a pellicle frame, a pellicle film provided over an upper end face of the pellicle frame, and the adhesive adhered to a lower end face of the pellicle frame; and a method of selecting an adhesive, comprising the steps of: measuring a peel strength and a tensile strength of an adhesive, and selecting an adhesive having a ratio of the former to the latter of from 0.10 to 0.33 as the adhesive for a pellicle.