摘要:
Disclosed is an oxygen-curable silicone composition that includes: (A) an organopolysiloxane having the formula (1):
(R 1 each represents an alkyl group having 1 to 10 carbon atoms, acryloyloxyalkyl group and so forth, and has per molecule at least one polymerizable double bond group such as acryloyloxyalkyl group; R 2 each represents an oxygen atom, alkylene group having 1 to 10 carbon atoms, or arylene group having 6 to 10 carbon atoms; and, m and n represents numbers that satisfy 1 ≤ m + n ≤ 1,000); (B) an organoborane complex having the formula (2):
(R 3 each represents a monovalent hydrocarbon group having 1 to 10 carbon atoms; R 4 and R 5 each represents a hydrocarbon group having 1 to 10 carbon atoms, and, R 4 and R 5 may bond to form a divalent linking group); and (C) a compound having Si-OH group.
摘要:
Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1).
(Ar is a mesogen group selected from the structure represented by the following formulae.
a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the proportion of each number of repeating units in molecules, and a + b = 1). R 1 is independently a monovalent hydrocarbon group which does not independently include a C 1-8 aliphatic unsaturated bond. R 2 is independently a hydrogen atom, -Si(CH 3 ) 3 , -Si(CH 3 ) 2 (OH), -Si(CH 3 ) 2 (CH=CH) or -Si(CH 3 ) 2 (CH 2 -CH=CH 2 )). This heat dissipation material has excellent thermal conductivity and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.
摘要翻译:本发明提供一种由通式(1)表示的数均分子量为1,000〜500,000的介晶/硅化合物(共)聚合物的散热材料。 (Ar是选自下式所示结构的介晶基团,a表示0.5-1的正数,b表示0-0.5的数(a和b各自代表每个数的比例) a + b = 1),R 1独立地为不独立地包含C 1-8脂肪族不饱和键的一价烃基,R 2独立地为氢原子,-Si(CH 3)3,-Si CH3)2(OH), - Si(CH3)2(CH = CH)或-Si(CH3)2(CH2-CH = CH2))。 该散热材料具有优异的导热性,并且还显示出良好的热塑性,并且具有优异的成型性,因此可以适当地用作散热材料和半导体器件以及电子部件的树脂材料。
摘要:
Disclosed is an oxygen-curable silicone composition that includes: (A) an organopolysiloxane having in a molecule at least one group selected from acryloyloxy group, methacryloyloxy group, acryloyloxyalkyl group, methacryloyloxyalkyl group, acryloyloxyalkyloxy group, and methacryloyloxyalkyloxy group, and having Si-OH group; and (B) an organoborane complex having the formula (2) below:
wherein R 3 each independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms, R 4 and R 5 each independently represents a hydrocarbon group having 1 to 10 carbon atoms, and, R 4 and R 5 may bond to form a divalent linking group.
摘要:
The present invention is a silicone gel composition comprising: (A) an organopolysiloxane shown by the following general formula (1) : R a R 1 b SiO (4-a-b)/2 , having one or more alkenyl groups bound to a silicon atom in one molecule, wherein the amount is 100 parts by mass; (B) an organohydrogenpolysiloxane shown by the following general formula (2) : R 2 c H d SiO (4-c-d)/2 , having two or more hydrogen atoms bound to a silicon atom in one molecule, wherein the amount is such that 0.6 to 3 hydrogen atoms bound to a silicon atom is contained relative to one alkenyl group bound to a silicon atom in the component (A); (C) a platinum-based catalyst, wherein the amount is an effective amount; and (D) a carbon nanotube, wherein the amount is 0.01 to 3 parts by mass. This provides a silicone gel composition which can be a silicone gel cured product with low elastic modulus, low stress, and excellent heat resistance at 230°C, when it is cured.
摘要翻译:本发明是一种硅凝胶组合物,其包含:(A)由以下通式(1)表示的有机聚硅氧烷:R a R 1 b SiO(4-ab)/ 2,其具有与硅原子结合的一个或多个烯基 在一个分子中,其量为100质量份; (B)由以下通式(2)表示的有机氢聚硅氧烷:R 2 c H d SiO(4-cd)/ 2,其具有在一个分子中与硅原子结合的两个或更多个氢原子,其量为 相对于与成分(A)中的硅原子结合的一个烯基,含有与硅原子键合的0.6〜3个氢原子。 (C)铂系催化剂,其量为有效量; 和(D)碳纳米管,其量为0.01〜3质量份。 这提供了一种硅凝胶组合物,其可以是固化时在230℃下具有低弹性模量,低应力和优异耐热性的硅凝胶固化产物。
摘要:
Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (A) an organopolysiloxane (1)
(R 1 represents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, R 2 represents an oxygen atom or the like, and m and n represent numbers that satisfy 1 ≤ m + n ≤ 1,000.), (B) a silicone resin including (a) a unit of formula (2), (b) an R 1 3 SiO 1/2 unit, and (c) an SiO 4/2 unit, the molar ratio of [(a) + (b)]/(c) being 0.4-1.2, and the silicone resin having 0.005 mol/100 g or more Si-OH groups
(R 1 and R 2 are the same as above. R 3 represents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (C) an organoborane complex (3)