METHOD AND DEVICE FOR PROCESSING COOLING HOLE ON WORKPIECE WITH LASER
    5.
    发明公开
    METHOD AND DEVICE FOR PROCESSING COOLING HOLE ON WORKPIECE WITH LASER 审中-公开
    用激光加工工件上冷却孔的方法和装置

    公开(公告)号:EP3219431A1

    公开(公告)日:2017-09-20

    申请号:EP14905737.4

    申请日:2014-11-10

    IPC分类号: B23K26/384

    摘要: A method for processing a cooling hole on a workpiece with laser. The cooling hole (10) includes a shaped hole section (11). The method comprises the following steps: emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece (20) according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece on the rough machining part (11A) and finish the rough processing of the shaped hole section; emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part (11B) and finish the finish processing of the shaped hole section. The energy of the first laser pulse is larger than that of the second laser pulse. Also disclosed are a device for processing a cooling hole on a workpiece with laser, a system for processing a cooling hole on a workpiece and a machine readable storage medium.

    摘要翻译: 用激光加工工件上的冷却孔的方法。 冷却孔(10)包括成形孔部分(11)。 该方法包括以下步骤:根据成型孔部分的几何参数,在待加工的成型孔部分的位置上向粗加工部分发射第一激光脉冲,以去除材料 在所述粗加工部(11A)上对所述工件进行加工,完成所述成形孔部的粗加工; 根据成形孔部分的几何参数向要处理的成形孔部分的粗加工部分之外的加工余量部分发射第二激光脉冲,以去除加工余量部分(11B)上的工件的材料余量 )并完成成形孔部分的精加工。 第一激光脉冲的能量大于第二激光脉冲的能量。 还公开了一种用激光加工工件上的冷却孔的装置,一种用于加工工件上的冷却孔的系统和一种机器可读存储介质。

    VERFAHREN ZUM HERSTELLEN VON DURCHGANGSBOHRUNGEN MITTELS LASERSTRAHLUNG IN EINER WANDUNG EINES BAUTEILS
    6.
    发明公开
    VERFAHREN ZUM HERSTELLEN VON DURCHGANGSBOHRUNGEN MITTELS LASERSTRAHLUNG IN EINER WANDUNG EINES BAUTEILS 审中-公开
    的生产方法贯通孔以激光辐射在部件的壁

    公开(公告)号:EP3180154A1

    公开(公告)日:2017-06-21

    申请号:EP15774596.9

    申请日:2015-10-01

    摘要: The invention relates to a method for producing through-holes (7) in a wall (3) of a component (1), by means of laser radiation, said wall delimiting a cavity (2) in which a protection agent (5) is provided that can be liquefied when heated. According to said method, through-holes (7) are successively produced in the wall (3) of the component (1) in a plurality of defined points, two directly subsequent through-holes (7) being produced such that a through-hole (7) is produced in a predetermined point and the next through-hole (7) is produced in an additional point which is further away from the predetermined point than at least two, in particular three or more omitted points that are closer to the predetermined point, and/or are produced such that a through-hole (7) is produced in a predetermined point and the next through-hole (7) is produced an additional point. At least one point which lies between the predetermined and the additional point is omitted, in particular two or more points which lie between the predetermined point and the additional point are omitted.

    摘要翻译: 本发明涉及一种用于通孔(7)的壁制造(3)的组分(1)通过激光辐射的手段,所述壁限定的腔体(2),其中保护剂(5)是 提供确实可液化当加热时。 。根据所述方法,通孔(7)在所述壁连续地生产(3)中所定义点上的多个,组分(1)的两个直接随后的通孔(7)中产生搜索做了一个通孔 (7)中的预定点产生,也更接近预定的下一个通孔(7)在附加点产生在所有这furtheraway从比所述至少两个预定点,特别是三个或更多省略分 点,和/或产生搜索做了一个通孔(7)中的预定点产生与下一个通孔(7)在附加点被产生。 的至少一个点的位于预定的和附加的点之间被省略,特别是两个或更多个点的预定点和附加的点之间的位于被省略。