公开(公告)号：EP3646369A1

公开(公告)日：2020-05-06

申请号：EP18824491.7

申请日：2018-06-28

Applicant: Sierra Circuits Inc.

Inventor： BAHL, Kenneth S. ,  KARAVAKIS, Konstantine

IPC: H01L21/02 ,  H01L21/48 ,  H01L23/14 ,  H01L51/00 ,  H05K1/09 ,  H05K3/46

公开(公告)号：EP3501242A1

公开(公告)日：2019-06-26

申请号：EP17842034.5

申请日：2017-08-16

Applicant: Sierra Circuits Inc.

Inventor： BAHL, Kenneth S. ,  KARAVAKIS, Konstantine

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/09

公开(公告)号：EP3146812A1

公开(公告)日：2017-03-29

申请号：EP15708363.5

申请日：2015-02-05

Applicant: Sierra Circuits Inc.

Inventor： KARAVAKIS, Konstantine ,  BAHL, Kenneth S.

IPC: H05K3/42

CPC classification number: H05K3/426 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/387 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

Abstract translation: 印刷电路板中的通孔由图案化的金属层组成，该图案金属层延伸穿过电介质层压材料中的孔，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。 催化粘合剂层将电介质层压材料的一部分涂覆在孔周围。 图案化的金属层被放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

公开(公告)号：EP3146809A1

公开(公告)日：2017-03-29

申请号：EP15709567.0

申请日：2015-02-05

Applicant: Sierra Circuits Inc.

Inventor： KARAVAKIS, Konstantine ,  BAHL, Kenneth S. ,  CARNEY, Steve

IPC: H05K3/18

CPC classification number: H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/08 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4038 ,  H05K2201/017 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：EP3146810A1

公开(公告)日：2017-03-29

申请号：EP15709568.8

申请日：2015-02-05

Applicant: Sierra Circuits Inc.

Inventor： BAHL, Kenneth S. ,  KARAVAKIS, Konstantine ,  CARNEY, Steve

IPC: H05K3/18

CPC classification number: C23C18/1608 ,  C23C18/204 ,  C23C18/38 ,  H05K3/185 ,  H05K3/4602 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107 ,  Y10T29/49165

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层压基板。 除了催化材料的表面被烧蚀之外，层压基板包括抗镀金属的催化核心材料。 金属迹线形成在层压基板内的迹线通道内。 通道延伸到催化材料表面的下方。