公开(公告)号：EP3086411A4

公开(公告)日：2017-12-20

申请号：EP14871737

申请日：2014-12-10

Applicant: DEXERIALS CORP

Inventor： YAMADA YASUNOBU ,  SEKIGUCHI MORIO ,  KUMAKURA SUSUMU

IPC: H01R11/01 ,  H01R43/00

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf / mm 2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6 ‰¦ B / A ‰¦ 1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100°C; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

公开(公告)号：EP3121237A1

公开(公告)日：2017-01-25

申请号：EP15764663.9

申请日：2015-02-13

Applicant: Dexerials Corporation

Inventor： NAMIKI, Hidetsugu ,  KANISAWA, Shiyuki ,  ISHIGAMI, Akira ,  AOKI, Masaharu

IPC: C09J201/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles (31) each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles (32) having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles (31) solder particles (32) and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles (32) during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

Abstract translation: 提供可获得优异的光学特性和散热特性的各向异性导电粘合剂。 各向异性导电粘合剂含有导电粒子（31），每个导电粒子包含在树脂粒子的最表面上形成的Ag作为主要成分的金属层，平均粒径小于导电粒子的焊料粒子（32），反射绝缘粒子 具有比焊料颗粒更小的平均粒径和分散导电粒子（31）焊料颗粒（32）和反射绝缘颗粒的粘合剂。 导电颗粒和反射绝缘颗粒有效地反射光，从而提高LED安装体的光提取效率。 此外，焊接粒子（32）在压接期间的端子间焊接增加了相对端子之间的接触面积，从而能够实现高的散热特性。

公开(公告)号：EP3086411A1

公开(公告)日：2016-10-26

申请号：EP14871737.4

申请日：2014-12-10

Applicant: Dexerials Corporation

Inventor： YAMADA, Yasunobu ,  SEKIGUCHI, Morio ,  KUMAKURA, Susumu

IPC: H01R11/01 ,  H01R43/00

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf / mm 2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6 ≦ B / A ≦ 1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100°C; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Abstract translation: 一种安装体的制造方法，包括：安装步骤，通过包含具有环氧树脂作为主要成分的粘合剂的各向异性导电膜和压缩硬度（K）为500kgf的导电颗粒将电子部件安装到布线板上 压缩变形10％以上时，粘合剂的厚度（A）与平均粒径（B）之间的关系为0.6‰| B / A‰| 1.5，粘合剂的弹性模量为 在100℃下固化为50MPa或更高; 以及在安装安装步骤时发生问题的情况下机械剥离以拆卸电子部件和布线板的重新安装步骤，并重新使用布线板以进行安装步骤。

公开(公告)号：EP2792721A1

公开(公告)日：2014-10-22

申请号：EP12857139.5

申请日：2012-12-10

Applicant: Dexerials Corporation

Inventor： ODAKA, Ryosuke ,  SATO, Daisuke

IPC: C09J4/02 ,  C09J5/06 ,  C09J163/10 ,  H05K1/14 ,  H01R11/01 ,  H01R43/00

CPC classification number: C09J4/00 ,  C08F220/32 ,  C09J4/06 ,  C09J163/10 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221

Abstract: Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent comprising a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

Abstract translation: 提供一种能够对已经施加了前路处理的基板提供足够的电连续性的粘合剂和用于连接电子部件的方法。 使用包含一分子中具有环氧基的（甲基）丙烯酸酯和1分钟半衰期为110℃以上的自由基聚合引发剂的粘合剂。 端子之间的剩余粘合剂组分流动，由此从外表面除去预流中的咪唑组分，与含环氧基丙烯酸酯的环氧基结合的组分。

公开(公告)号：EP2057006B1

公开(公告)日：2014-02-12

申请号：EP06844998.2

申请日：2006-12-08

Applicant: Trillion Science, Inc.

Inventor： LIANG, Rong-chang ,  HO, Shih-wei ,  LIU, Eric, H. ,  XU, Qianfei

IPC: H05K3/32 ,  B32B27/00 ,  H01B1/22 ,  H01B1/24 ,  H01R13/24

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01R13/2414 ,  H05K2201/0221 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y10T428/24612 ,  Y10T428/2462 ,  H01L2924/00

公开(公告)号：EP2495732A2

公开(公告)日：2012-09-05

申请号：EP12003885.6

申请日：2001-04-27

Applicant: Sekisui Chemical Co., Ltd.

Inventor： Kuroda, Hiroshi ,  Okinaga, Nobuyuki

IPC: H01B5/00 ,  H01B5/16 ,  C08J7/06 ,  H01R11/01 ,  H05K1/09 ,  H05K3/32 ,  H01L21/60 ,  H01L21/311 ,  C25D7/12 ,  H05K3/34

CPC classification number: H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/035 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/068 ,  H05K2203/0425 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: This invention provides a conductive fine particle for soldering two or more electrodes of an electric circuit, the conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like.
A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3 × 10 -5 to 7 × 10 -5 (1/K).

Abstract translation: 本发明提供一种用于焊接电路的两个或更多个电极的导电细颗粒，导电细颗粒具有放松施加到基板的电路等的力的能力。 一种导电性细颗粒，其包含由表面被至少一个金属层覆盖的树脂制成的核心微粒，其中所述树脂的线性膨胀系数为3×10 -5至7×10 -5（1 / K ）。

公开(公告)号：EP2242065A1

公开(公告)日：2010-10-20

申请号：EP09707515.4

申请日：2009-02-05

Applicant: Hitachi Chemical Company, Ltd.

Inventor： TAKAI, Kenji ,  MATSUZAWA, Mitsuharu ,  NAGAHARA, Yuuko ,  AKAI, Kunihiko

IPC: H01B5/00 ,  B22F1/02 ,  H01B13/00 ,  H01R11/01

CPC classification number: H01R4/04 ,  B22F1/02 ,  B22F2998/00 ,  C23C18/1635 ,  C23C18/1651 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  B22F1/025

Abstract: A conductive particle 8a comprising a core particle 11, a palladium layer 12 coating the core particle 11 and having a thickness of 200 Å or larger, and an insulating particle 1 arranged on the surface of the palladium layer 12 and having a particle diameter larger than the thickness of the palladium layer 12.

Abstract translation: 导电粒子8a，其包含核心粒子11，涂覆核心粒子11并具有200以上的厚度的钯层12以及配置在钯层12的表面上并具有大于 钯层12的厚度。

公开(公告)号：EP2040296A2

公开(公告)日：2009-03-25

申请号：EP08164294.4

申请日：2008-09-12

Applicant: Delphi Technologies, Inc.

Inventor： Webster, Mark E. ,  Parker, Richard D.

IPC: H01L23/498

CPC classification number: H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19104 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming a Ball Grid Array (BGA) package having an increased standoff height after solder reflow is described. A substrate containing a plurality of first solder bond pads and a component containing a plurality of second solder bond pads are arranged in parallel spaced relationship to form an arrangement, each first and second bond pad being in contact with a solder ball therebetween. Solder balls are formed of a core, which remains solid at solder reflow temperatures, encapsulated with a reflowable solder layer. First standoff height of the arrangement is largely determined by the diameter of the solder ball. Upon heating to solder reflow temperatures, the solder coalesces between the core and the bond pads. Upon cooling of the arrangement, the second standoff height of the BGA package is greater than the first standoff height of the arrangement.

Abstract translation: 描述了在焊料回流之后形成具有增加的间隔高度的球栅阵列（BGA）封装的方法。 包含多个第一焊料接合焊盘的衬底和包含多个第二焊料接合焊盘的部件以平行间隔的关系布置以形成布置，每个第一和第二接合焊盘与它们之间的焊球接触。 焊球由芯体形成，芯体在焊料回流温度下保持固体，用可回流焊料层封装。 该布置的第一间隔高度在很大程度上取决于焊球的直径。 当加热到回流焊温度时，焊料在芯和焊盘之间聚结。 在布置冷却时，BGA封装的第二间隔高度大于布置的第一间隔高度。

公开(公告)号：EP0996321B1

公开(公告)日：2007-05-16

申请号：EP99306548.1

申请日：1999-08-19

Applicant: SONY CHEMICALS CORPORATION

Inventor： Yamada, Yukio, Sony Chemicals Corporation ,  Saito, Masao, Sony Chemicals Corporation ,  Shinozaki, Junji, Sony Chemicals Corporation ,  Takeichi, Motohide, c/o Sony Chemicals Corporation

IPC: H05K3/32 ,  H01L21/60 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP1335389A4

公开(公告)日：2006-08-02

申请号：EP01934417

申请日：2001-05-30

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： WAKIYA TAKESHI ,  MORITA TAKEHARU ,  HIRAIKE HIROSHI ,  NAGAI KATSUTOSHI ,  TANIGUCHI TATSUO

IPC: C08F2/44 ,  C08F292/00 ,  C08L51/08 ,  C09C3/10 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  H01B5/00

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08F2/44 ,  C08F292/00 ,  C08L51/08 ,  C09C3/10 ,  C09D5/24 ,  H01B1/02 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: Coated particles having excellent connection reliability. The coated particles each comprises a core particle having a surface layer made of a metal, wherein the core surface has been partly modified with an organic compound through a functional group (A) having bondability to the metal.