公开(公告)号：EP2739396B1

公开(公告)日：2020-01-01

申请号：EP12741104.9

申请日：2012-06-29

申请人： Sony Corporation

发明人： AKIYAMA, Yuji ,  AKIYAMA, Shoji ,  YAMASAKI, Takeshi

IPC分类号： B01L3/02 ,  G01N15/14

公开(公告)号：EP2734361A1

公开(公告)日：2014-05-28

申请号：EP12731185.0

申请日：2012-06-15

申请人： Sony Corporation

发明人： YUKUMOTO, Tomomi ,  YAMASAKI, Takeshi ,  AKIYAMA, Shoji ,  AKIYAMA, Yuji

IPC分类号： B32B5/14

CPC分类号： B32B3/30 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/0636 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0654 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0877 ,  B01L2300/0887 ,  B32B3/08 ,  B32B3/266 ,  B32B27/08 ,  B32B2307/412 ,  G01N21/51 ,  G01N21/645 ,  G01N2021/513 ,  G01N2021/6482 ,  G01N2201/06113 ,  Y10T428/24612

摘要： There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.

摘要翻译： 提供了一种复合结构，包括：由热塑性树脂制成并通过热压粘合的至少两个基材; 以及至少一个由热变形温度高于热塑性树脂的热变形温度并插入形成在至少一个基板中的空间中的材料制成的构件。 插入空间中的构件被形成基板的空间的壁面固定并保持，并且通过热压而热变形。

公开(公告)号：EP2734361B1

公开(公告)日：2017-08-09

申请号：EP12731185.0

申请日：2012-06-15

申请人： Sony Corporation

发明人： YUKUMOTO, Tomomi ,  YAMASAKI, Takeshi ,  AKIYAMA, Shoji ,  AKIYAMA, Yuji

IPC分类号： B32B5/14

CPC分类号： B32B3/30 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/0636 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0654 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0877 ,  B01L2300/0887 ,  B32B3/08 ,  B32B3/266 ,  B32B27/08 ,  B32B2307/412 ,  G01N21/51 ,  G01N21/645 ,  G01N2021/513 ,  G01N2021/6482 ,  G01N2201/06113 ,  Y10T428/24612

摘要： There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.

摘要翻译： 提供一种微芯片，其包括至少两个基板，每个基板均包含热塑性树脂，并且至少一个构件包括热变形温度高于热塑性树脂的热变形温度的材料，所述至少一个构件包括至少一个接合 所述端部包括在所述至少两个基板之间延伸的突起，其中所述至少一个构件通过至少一个通过热压缩而热变形的壁表面被所述至少两个基板之间保持的突起固定到所述至少两个基板。

公开(公告)号：EP2739396A1

公开(公告)日：2014-06-11

申请号：EP12741104.9

申请日：2012-06-29

申请人： Sony Corporation

发明人： AKIYAMA, Yuji ,  AKIYAMA, Shoji ,  YAMASAKI, Takeshi

IPC分类号： B01L3/02 ,  G01N15/14

摘要： There is provided a microchip including a flow channel, an ejection portion, and a cutout portion. The flow channel is configured to convey a fluid therein. The ejection portion includes an opening directed toward an end face of a substrate layer, and the ejection portion is configured to eject the fluid flowing through the flow channel to outside. The substrate layer is laminated to each other. The cutout portion is formed between the opening of the ejection portion and the end face of the substrate layer. The cutout portion has a larger diameter than that of the opening.

摘要翻译： 提供了一种包括流动通道，喷射部分和切口部分的微芯片。 流动通道构造成在其中输送流体。 喷射部分包括朝向基底层的端面的开口，并且喷射部分构造成将流过流动通道的流体喷射到外部。 基板层彼此层叠。 切口部形成在喷射部的开口部与基板层的端面之间。 切口部的直径比开口部的直径大。