公开(公告)号：EP2734361A1

公开(公告)日：2014-05-28

申请号：EP12731185.0

申请日：2012-06-15

申请人： Sony Corporation

发明人： YUKUMOTO, Tomomi ,  YAMASAKI, Takeshi ,  AKIYAMA, Shoji ,  AKIYAMA, Yuji

IPC分类号： B32B5/14

CPC分类号： B32B3/30 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/0636 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0654 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0877 ,  B01L2300/0887 ,  B32B3/08 ,  B32B3/266 ,  B32B27/08 ,  B32B2307/412 ,  G01N21/51 ,  G01N21/645 ,  G01N2021/513 ,  G01N2021/6482 ,  G01N2201/06113 ,  Y10T428/24612

摘要： There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.

摘要翻译： 提供了一种复合结构，包括：由热塑性树脂制成并通过热压粘合的至少两个基材; 以及至少一个由热变形温度高于热塑性树脂的热变形温度并插入形成在至少一个基板中的空间中的材料制成的构件。 插入空间中的构件被形成基板的空间的壁面固定并保持，并且通过热压而热变形。

公开(公告)号：EP1100081B1

公开(公告)日：2006-03-22

申请号：EP00900433.4

申请日：2000-01-18

申请人： SONY CORPORATION

发明人： KASHIWAGI, Toshiyuki ,  YAMASAKI, Takeshi ,  FURUKI, Motohiro ,  YUKUMOTO, Tomomi

IPC分类号： G11B7/26 ,  G11B7/24

CPC分类号： B29C59/026 ,  B29C59/04 ,  B29C2035/0827 ,  B29L2017/003 ,  G11B7/24 ,  G11B7/26 ,  Y10S428/90

摘要： A disk-like, multilayer-structure, information recording medium having a plurality of signal recording layers recording information signals, the medium being formed by pasting together a first substrate, onto which signal recording patterns formed on a first stamper are transferred and which is formed by stamping a sheet on the signal surface of which a semi-transparent film is formed, and a second substrate, which is formed by injection-molding a synthetic resin material, onto which signal recording patterns formed on a second stamper provided in an injection molding machine are transferred, and which is formed with a reflection film on a signal surface thereof onto which signal recording patterns are transferred.

摘要翻译： 一种具有记录信息信号的多个信号记录层的盘状多层结构信息记录介质，所述介质通过将第一基板粘贴在一起而形成，在第一基板上形成在第一压模上的信号记录图案被转印到该第一基板上并形成 通过在信号表面上形成半透明膜的片材和通过注塑合成树脂材料形成的第二基板进行冲压，在该第二基板上形成信号记录图案，该信号记录图案形成在注射成型中设置的第二压模上 机器被转移，并且在信号表面上形成有反射膜，信号记录图案被转印到信号表面上。

公开(公告)号：EP1100081A1

公开(公告)日：2001-05-16

申请号：EP00900433.4

申请日：2000-01-18

申请人： Sony Corporation

发明人： KASHIWAGI, Toshiyuki ,  YAMASAKI, Takeshi ,  FURUKI, Motohiro ,  YUKUMOTO, Tomomi

IPC分类号： G11B7/26 ,  G11B7/24

CPC分类号： B29C59/026 ,  B29C59/04 ,  B29C2035/0827 ,  B29L2017/003 ,  G11B7/24 ,  G11B7/26 ,  Y10S428/90

摘要： The present invention relates to a multi-layered disc-shaped information recording medium having a plurality of signal recording layers each carrying information signals. In preparing the recording medium, a first substrate obtained on punching a sheet obtained in turn by having a signal recording pattern transcribed on it from a first stamper and by forming a semi-transparent film on a signal surface is bonded to a second substrate obtained on injection molding a synthetic resin material. The second substrate is prepared by having transcribed to it a signal recording pattern formed on a second stamper provided on an injection molding device. A reflective film is formed on a signal surface having the transcribed second substrate. The first and second substrates are bonded together on their signal recording layers by a transparent adherent layer.

摘要翻译： 本发明涉及具有多个信号记录层的多层盘状信息记录介质，每个信号记录层承载信息信号。 在制备记录介质时，将通过在第一压模上转印有信号记录图案并在信号表面上形成半透明膜而依次获得的片材依次冲压获得的第一基板粘合到在 注塑合成树脂材料。 第二基板通过将形成在设置在注塑装置上的第二压模上的信号记录图案转录到其上而制备。 反射膜形成在具有转录的第二基板的信号表面上。 第一和第二基板通过透明粘合层在其信号记录层上粘合在一起。

公开(公告)号：EP2734361B1

公开(公告)日：2017-08-09

申请号：EP12731185.0

申请日：2012-06-15

申请人： Sony Corporation

发明人： YUKUMOTO, Tomomi ,  YAMASAKI, Takeshi ,  AKIYAMA, Shoji ,  AKIYAMA, Yuji

IPC分类号： B32B5/14

CPC分类号： B32B3/30 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/0636 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0654 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0877 ,  B01L2300/0887 ,  B32B3/08 ,  B32B3/266 ,  B32B27/08 ,  B32B2307/412 ,  G01N21/51 ,  G01N21/645 ,  G01N2021/513 ,  G01N2021/6482 ,  G01N2201/06113 ,  Y10T428/24612

摘要： There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.

摘要翻译： 提供一种微芯片，其包括至少两个基板，每个基板均包含热塑性树脂，并且至少一个构件包括热变形温度高于热塑性树脂的热变形温度的材料，所述至少一个构件包括至少一个接合 所述端部包括在所述至少两个基板之间延伸的突起，其中所述至少一个构件通过至少一个通过热压缩而热变形的壁表面被所述至少两个基板之间保持的突起固定到所述至少两个基板。