摘要:
A semiconductor device includes: a semiconductor substrate made of a hexagonal Group III nitride semiconductor and having a semi-polar plane; and an epitaxial layer formed on the semi-polar plane of the semiconductor substrate and including a first cladding layer of a first conductive type, a second cladding layer of a second conductive type, and a light-emitting layer formed between the first cladding layer and the second cladding layer, the first cladding layer being made of In x1 Al y1 Ga 1-x1-y1 N, where x1>0 and yl>0, the second cladding layer being made of In x2 Al y2 Ga 1-x2-y2 N, where 0≤x2≤about 0.02 and about 0.03≤y2≤about 0.07.
摘要:
A nitride semiconductor light emitting device having a structure capable of reducing a lateral spread of carriers flowing from a semiconductor ridge is provided. In the semiconductor laser on the {20-21} plane, two-dimensional hole gas is created at the heterojunction in a hole band. When the heterojunction that generates two-dimensional hole gas is located outside the semiconductor ridge, the two-dimensional hole gas causes carriers in the lateral direction to spread in the p-side semiconductor region. On the other hand, two-dimensional hole gas cannot be generated at the heterojunction in the hole band in the semiconductor laser on the c-plane. When the heterojunction HJ is contained in the semiconductor ridge, two-dimensional hole gas does not cause carriers flowing out of the semiconductor ridge to spread in the lateral direction.
摘要:
A laser diode device includes: a semiconductor substrate including a semi-polar surface, the semiconductor substrate being formed of a hexagonal III-nitride semiconductor; an epitaxial layer (2) including a light emitting layer, the epitaxial layer (2) being formed on the semi-polar surface of the semiconductor substrate, and including a ridge section (18); a first electrode (14) formed on a top surface of the ridge section; an insulating layer (12) covering the epitaxial layer in an adjacent region (18a) of the ridge section and a side surface (18b) of the ridge section, the insulating layer (12) covering part or all of side surfaces of the first electrode continuously from the epitaxial layer; a pad electrode (13) formed to cover a top surface of the first electrode and the insulating layer and being electrically connected to the first electrode; and a second electrode (15) formed on a surface, of the semiconductor substrate, opposite to the surface where the epitaxial layer is formed.