公开(公告)号：EP1183124B1

公开(公告)日：2008-07-02

申请号：EP00916390.8

申请日：2000-03-15

申请人： Spectre Enterprises, Inc.

发明人： MOHLER, Jonathan

IPC分类号： B23K7/00 ,  B23K7/10 ,  B23K31/10 ,  F23D21/00 ,  F23D14/54 ,  F23D14/28

CPC分类号： C06B33/00 ,  B23K7/00

公开(公告)号：EP2165346B1

公开(公告)日：2015-07-22

申请号：EP08771142.0

申请日：2008-06-16

申请人： Spectre Enterprises, Inc.

发明人： MOHLER, Jonathan

IPC分类号： H01H37/76 ,  H05K1/02 ,  H01L23/58 ,  F42B3/00 ,  F42D3/00 ,  F42B3/10

CPC分类号： F42D3/00 ,  F42B3/00 ,  F42B3/006 ,  F42B3/10 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/185 ,  H05K2203/178 ,  H01L2924/00

公开(公告)号：EP2165346A1

公开(公告)日：2010-03-24

申请号：EP08771142.0

申请日：2008-06-16

申请人： Spectre Enterprises, Inc.

发明人： MOHLER, Jonathan

IPC分类号： H01H37/76

CPC分类号： F42D3/00 ,  F42B3/00 ,  F42B3/006 ,  F42B3/10 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/185 ,  H05K2203/178 ,  H01L2924/00

摘要： A charge system for destroying chips on a circuit board is provided. The charge system has a first substrate having a number of recesses formed therein with each of the recesses having a housing disposed therein. A high density charge is disposed within the housing. A number of recesses are formed within the high density charge. A number of low density charges are disposed within each of the recesses formed within the high density charge. A second substrate is located proximate to the first substrate. The low density charge and the high density charge are structured to destroy the second substrate after ignition. A method of destroying chips is also provided.

公开(公告)号：EP1183124A1

公开(公告)日：2002-03-06

申请号：EP00916390.8

申请日：2000-03-15

申请人： Spectre Enterprises, Inc.

发明人： MOHLER, Jonathan

IPC分类号： B23K7/00

CPC分类号： C06B33/00 ,  B23K7/00

摘要： An apparatus (1) for cutting target material (11) which includes a housing (2) having an inner cavity (9) and an elongated nozzle (6) extending from the inner cavity (9) to communicate with the exterior of the housing (2). The apparatus (1) is provided with a charge (4) for generating a cutting flame and an activating device coupled to the charge (4). A method for cutting target material (11) is also provided in which the cutting apparatus (1) has an elongated nozzle (6) positioned generally adjacent to a surface of a target material (11) to be cut. The cutting apparatus (1) may be joined with one or more housings (2) to provide a ganged together or joined cutting apparatus.