公开(公告)号：EP2357876A1

公开(公告)日：2011-08-17

申请号：EP09811542.1

申请日：2009-09-03

申请人： Sumitomo Bakelite Company Limited

发明人： OKADA Wataru ,  YAMAMOTO Michinori ,  CHUMA Toshiaki ,  MAEJIMA Kenzo ,  KAGIMOTO Tomohiro ,  KATSURAYAMA Satoru ,  FUJII, Tomoe

IPC分类号： H05K3/34 ,  C09J7/00 ,  C09J9/02 ,  C09J11/06 ,  C09J163/02 ,  C09J201/00 ,  H01R11/01

CPC分类号： H05K3/363 ,  C09J9/02 ,  C09J163/00 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T428/24917 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising; a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified.

摘要翻译： 本发明提供用于电子部件的电连接端子的导电连接材料，其具有层状结构，包括：包含树脂成分和具有助焊剂功能的化合物的固化性树脂组合物; 和从一个焊料箔和锡箔中的金属箔。 此外，本发明提供了一种连接端子的方法，包括; 的放置步骤，其中连接导电材料相对端子之间放置; 一个加热步骤，其中连接导电材料在的温度下加热，在所有这比所述金属箔的熔点以上，并在其中树脂组合物没有被完全固化的呼叫或树脂组合物被软化; 和固化步骤/凝固步骤，其中树脂组合物被固化或凝固。