公开(公告)号：EP1760042B1

公开(公告)日：2013-05-29

申请号：EP06300836.1

申请日：2006-07-28

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： Marion, François

IPC分类号： B81C1/00 ,  H05K3/34

CPC分类号： B81C1/00269 ,  B81C2201/0153 ,  B81C2203/019 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/062 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0405 ,  H05K2203/043 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP2519088A1

公开(公告)日：2012-10-31

申请号：EP10838919.8

申请日：2010-12-17

申请人： Sumitomo Bakelite Co., Ltd.

发明人： CHUMA,Toshiaki ,  KAGIMOTO, Tomohiro

IPC分类号： H05K3/34 ,  C09J9/02 ,  H01B5/02 ,  H01L21/60 ,  H01R11/01 ,  H01R43/00

CPC分类号： H05K3/3478 ,  C08L63/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/1152 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2916 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83862 ,  H01L2224/83885 ,  H01L2224/83886 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3489 ,  H05K3/4007 ,  H05K2203/0405 ,  H05K2203/0425 ,  H05K2203/043 ,  Y10T428/25 ,  Y10T428/31678 ,  Y10T428/31688 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a conductive connecting material 30 used to form conductive portions on a plurality of terminals 11 of an electronic member having a substrate 10 and the plurality of terminals 11 provided on the substrate 10, comprising a metal layer 110 and a resin layer 120 having a resin component and a filler, in which the metal layer is aggregated on each of terminals to form the conductive portions on the plurality of terminals by bringing the conductive connecting material into contact with the plurality of terminals and heating the conductive connecting material.

摘要翻译： 公开的是用于形成在具有基板10和设置在基板10端子11的多元性的电子部件的端子11的多个导电部的导电连接材料30，其包括一个金属层110和具有120的树脂层 树脂成分和填料，其中，所述金属层被聚集在每个终端通过使导电连接材料与端子的多个接触并加热所述导电连接材料，以形成对端子的多个导电部分。

公开(公告)号：EP1901350A4

公开(公告)日：2010-03-10

申请号：EP06767882

申请日：2006-07-05

申请人： TOYOTA JIDOSHOKKI KK ,  SHOWA DENKO KK

发明人： OTOSHI KOTA ,  KONO EIJI ,  TOH KEIJI ,  TANAKA KATSUFUMI ,  FURUKAWA YUICHI ,  YAMAUCHI SHINOBU ,  HOSHINO RYOICHI ,  WAKABAYASHI NOBUHIRO ,  NAKAGAWA SHINTARO

IPC分类号： H01L23/36 ,  H01L23/367 ,  H05K1/02

CPC分类号： H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1982967A3

公开(公告)日：2009-02-18

申请号：EP08014131.0

申请日：2001-05-01

申请人： The John Hopkins University

发明人： Weihs, Timothy P. ,  Van Heerden, David ,  Reiss, Michael ,  Hufnagel, Todd ,  Knio, Omar ,  Feldmesser, Howard

IPC分类号： C06B45/12 ,  C04B37/02

CPC分类号： B32B18/00 ,  B23K1/0006 ,  B23K20/00 ,  B23K20/06 ,  B23K20/08 ,  B23K20/165 ,  B23K28/00 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/34 ,  B32B15/01 ,  B32B15/017 ,  B32B2311/24 ,  C04B37/006 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/368 ,  C04B2237/40 ,  C04B2237/402 ,  C04B2237/60 ,  C04B2237/68 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/78 ,  C06B21/0083 ,  C06B45/14 ,  C21D2211/008 ,  C23C14/14 ,  F24V30/00 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y10S72/70 ,  Y10S228/902 ,  Y10S428/94 ,  Y10T29/49925 ,  Y10T29/49929 ,  Y10T428/12028 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/1209 ,  Y10T428/12229 ,  Y10T428/12361 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12493 ,  Y10T428/1259 ,  Y10T428/12632 ,  Y10T428/1275 ,  Y10T428/12819 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/2993

摘要： Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil (14) is preferably a freestanding multilayered foil structure made up of alternating layers (16, 18) selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually an environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt the joining materials. If no joining material is used, the foil reaction supplies heat directly to at least two bulk materials, melting a portion of each bulk, which upon cooling, form a strong bond. Additionally, the foil (14) may be designed with openings that allow extrusion of the joining (or bulk) material through the foil to enhance bonding.

公开(公告)号：EP1278631B1

公开(公告)日：2008-10-15

申请号：EP01934961.2

申请日：2001-05-01

申请人： JOHNS HOPKINS UNIVERSITY

发明人： WIEHS, Timothy, P. ,  REISS, Michael

IPC分类号： B32B9/00

CPC分类号： B32B18/00 ,  B23K1/0006 ,  B23K20/00 ,  B23K20/06 ,  B23K20/08 ,  B23K20/165 ,  B23K28/00 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/34 ,  B32B15/01 ,  B32B15/017 ,  B32B2311/24 ,  C04B37/006 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/368 ,  C04B2237/40 ,  C04B2237/402 ,  C04B2237/60 ,  C04B2237/68 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/78 ,  C06B21/0083 ,  C06B45/14 ,  C21D2211/008 ,  C23C14/14 ,  F24V30/00 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y10S72/70 ,  Y10S228/902 ,  Y10S428/94 ,  Y10T29/49925 ,  Y10T29/49929 ,  Y10T428/12028 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/1209 ,  Y10T428/12229 ,  Y10T428/12361 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12493 ,  Y10T428/1259 ,  Y10T428/12632 ,  Y10T428/1275 ,  Y10T428/12819 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/2993

摘要： Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil (14) is preferably a freestanding multilayered foil structure made up of alternating layers (16, 18) selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually an environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt the joining materials. If no joining material is used, the foil reaction supplies heat directly to at least two bulk materials, melting a portion of each bulk, which upon cooling, form a strong bond. Additionally, the foil (14) may be designed with openings that allow extrusion of the joining (or bulk) material through the foil to enhance bonding.

公开(公告)号：EP0814643A2

公开(公告)日：1997-12-29

申请号：EP97109609

申请日：1997-06-12

申请人： IBIDEN CO LTD

发明人： ASAI MOTOO ,  KAWAMURA YOICHIRO

IPC分类号： H05K3/46 ,  H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/11 ,  H05K3/06 ,  H05K3/34

CPC分类号： H05K1/112 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3478 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/043 ,  H01L2924/00

摘要： A multilayer printed circuit board comprises a core substrate, multilayer wiring layers formed on the substrate by alternately laminating an interlaminar insulating layer and conductor circuit, and a group of solder pads having solder bumps planarly arranged on an outermost surface of the multilayer wiring layers, in which the solder pads located from first row to fifth row from an outer position of the solder pad group are constructed with flat pads connected to conductor pattern located on the outermost surface and solder bumps formed on the surfaces of the pads, while the solder pad group other than these solder pads are constructed with viaholes connected to flat innerlayer pad group located in an inner layer and solder bumps formed in recess portions of the viaholes, and the solder pads located from first row to fifth row from an outer position of the innerlayer pad group are constructed with flat pads connected to conductor patterns in the same layer as the innerlayer pad group, while the innerlayer pad groups other than the pads are constituted with flat pads connected to a further innerlayer flat pad group located inward the above innerlayer through viaholes.

摘要翻译： 多层印刷电路板包括芯基板，通过交替层叠层间绝缘层和导体电路而形成在基板上的多层布线层，以及一组焊料凸块，其平坦地布置在多层布线层的最外表面上， 其中焊盘从焊料焊盘组的外部位置位于第一行至第五行的焊盘被构造为连接到位于最外表面上的导体图案的平坦焊盘和形成在焊盘表面上的焊料凸块，而焊盘组 除了这些焊盘之外，构成了连接到位于内层中的平坦内层焊盘组的通孔和形成在通孔的凹部中的焊料凸块以及从内层焊盘的外部位置位于第一行至第五行的焊盘 在与内层垫组相同的层中的导体图案上连接有平垫， 而除了焊盘之外的内层焊盘组由通过通孔连接到位于上层内层的另一内层平垫组的平垫组成。

公开(公告)号：EP0081389B1

公开(公告)日：1986-09-03

申请号：EP82306555.2

申请日：1982-12-08

申请人： RAYCHEM CORPORATION (a California corporation)

发明人： Allen, Leslie John ,  Graussauer, Wille Karl ,  Robinson, William Morris

IPC分类号： H01R4/02 ,  H01R4/70

CPC分类号： H05K3/3478 ,  H01R4/723 ,  H01R9/05 ,  H01R12/51 ,  H01R12/594 ,  H01R43/02 ,  H05K2201/10424 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0405

公开(公告)号：EP0104204A4

公开(公告)日：1984-07-24

申请号：EP83901043

申请日：1983-02-18

申请人： WESTERN ELECTRIC CO

发明人： FISHER JOHN ROBB JR

IPC分类号： B23K1/00 ,  B23K3/06 ,  H01L21/00 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L21/67138 ,  B23K3/06 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3468 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/128 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00

公开(公告)号：EP3037207B1

公开(公告)日：2018-08-29

申请号：EP15199636.0

申请日：2015-12-11

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： ONITSUKA, Motohiro ,  KURASAWA, Yoko ,  KUGI, Toshihisa ,  KAWANAGO, Hiroshi ,  TSURUTA, Kaichi

IPC分类号： B23K35/36 ,  B23K35/40 ,  H05K3/34 ,  B23K35/362 ,  B23K35/02

CPC分类号： B23K35/3612 ,  B23K35/0227 ,  B23K35/0261 ,  B23K35/0266 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2203/0405

摘要： A flux for a resin flux cored solder contains 30% or more by mass but 80% or less by mass rosin ester and 5% or more by mass but 15% or less by mass activator. The total content ratio of base materials including the rosin ester is preferably equal to or more than 85% by mass but equal to or less than 95% by mass.

公开(公告)号：EP2306512B1

公开(公告)日：2014-09-03

申请号：EP11150797.6

申请日：2006-07-05

申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ,  SHOWA DENKO KABUSHIKI KAISHA

发明人： Otoshi, Kota ,  Kono, Eiji ,  Toh, Keiji ,  Tanaka, Katsufumi ,  Furukawa, Yuichi ,  Yamauchi, Shinobu ,  Hoshino, Ryoichi ,  Wakabayashi, Nobuhiro ,  Nakagawa, Shintaro

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/473 ,  H05K1/02 ,  H05K3/34 ,  H05K3/00 ,  H05K1/03

CPC分类号： H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00