公开(公告)号：EP2530786A1

公开(公告)日：2012-12-05

申请号：EP11736877.9

申请日：2011-01-18

申请人： Sumitomo Bakelite Company Limited

发明人： KAGIMOTO Tomohiro ,  CHUMA Toshiaki

IPC分类号： H01R11/01 ,  C09D7/12 ,  C09D201/00 ,  H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H01R4/02 ,  H01R43/02 ,  H05K3/32

CPC分类号： H01L24/29 ,  B32B15/08 ,  B32B2311/14 ,  B32B2311/16 ,  C09D5/24 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/11436 ,  H01L2224/11522 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83222 ,  H01L2224/83224 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2224/9201 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A conductive connecting sheet (1) of the present invention is composed of a layered body including resin composition layers (11, 13) and a metal layer (12), and each resin composition layer (11, 13) satisfies the following requirement A: in the case where at least a part of metal ball(s) made of the metal material having low melting point is provided within each resin composition layer (11, 13), the metal ball(s) is heated at a temperature which is a melting temperature thereof or higher according to "test methods for soldering resin type fluxes" defined in JIS Z 3197, and then a wet extension of the metal ball (s) is measured, the wet extension is 37% or more. If the conductive connecting sheet is used for forming connection portions electrically connecting terminals to each other, the connection portions can be formed by selectively aggregating a heated and melted metal material between the terminals and a sealing layer constituted from a resin component can be formed so as to surround the connection portions. As a result, since peripheries of the connection portions can be covered by the resin component, the connection portions are fixed. Further, since an insulating property between the adjacent terminals can be secured by the sealing layer, generation of a leak current between the adjacent terminals can be reliably prevented.

摘要翻译： 的导电连接片（1）本发明的由层积体的包含树脂组合物层（11，13）和金属层（12），和各树脂组合物层（11，13）SATIS外资企业下面要求答： 在其中至少有由具有低熔点的金属材料的金属球（一个或多个）的一部分的各树脂组合物层（11，13）中提供的情况下，金属球（一个或多个）在一定温度下加热所有这是一个 其熔化温度以上gemäß到“测试方法用于焊接树脂型通量”在JIS Z 3197所定义，然后将金属球（一个或多个）的湿延伸测定，湿延伸是37％以上。 如果导电连接片被用于形成连接部分电连接端子海誓山盟，连接部分可以通过选择性地聚集在端子和密封层之间的加热熔融金属材料来形成由树脂成分构成，可以形成为 以围绕连接部。 其结果是，由于连接部份的边缘可以通过树脂成分所覆盖，所述连接部分被固定。 此外，由于在相邻的端子之间的绝缘性可以通过密封层被固定，产生相邻端子之间的漏电流可以被可靠地防止。

公开(公告)号：EP2484739A1

公开(公告)日：2012-08-08

申请号：EP10820557.6

申请日：2010-09-29

申请人： Sumitomo Bakelite Company Limited

发明人： CHUMA Toshiaki ,  OKADA Wataru ,  KAGIMOTO Tomohiro

IPC分类号： C09J201/00 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J133/02 ,  C09J163/00 ,  C09J171/10 ,  C09J179/08 ,  H01B5/16 ,  H01L21/60 ,  H01R11/01 ,  H01R43/00 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC分类号： H05K3/3478 ,  C08G2650/56 ,  C08L33/08 ,  C08L63/00 ,  C08L71/00 ,  C08L79/08 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2463/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/111 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2224/83886 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01R13/03 ,  H05K3/305 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  Y10T428/31529 ,  Y10T428/31678 ,  C08L2666/02 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/29113 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00015

摘要： The present invention provides a conductive connecting material having a multi-layered structure comprising a resin composition and a metal foil selected from a solder foil or a tin foil, wherein the minimum ion viscosity value of the resin composition is 4-9 when measured in accordance with ASTM standard E2039 by applying a frequency of 10000Hz at the melting point of the metal foil. The present invention further provides a method for connecting terminals and a method for producing a connection terminal using the conductive connecting material. By using the conductive connecting material of the present invention, good electric connection between connection terminals as well as highly-reliable insulation between adjacent terminals can be achieved.

摘要翻译： 本发明提供了具有多层结构，其包含树脂组合物和由焊料箔或锡箔中的金属箔，worin树脂组合物的最低粘度离子值被4-9当雅舞蹈测量的导电连接材料 与通过在金属箔的熔点下施加10000Hz的频率ASTM标准E2039。 本发明还提供了连接端子的方法以及使用导电连接材料的连接端子的方法。 通过使用本发明的导电连接材料，连接端子之间的可靠性高的绝缘，相邻端子之间良好的电连接，以及可以实现的。

公开(公告)号：EP2495818A1

公开(公告)日：2012-09-05

申请号：EP10826747.7

申请日：2010-10-27

申请人： Sumitomo Bakelite Company Limited

发明人： KAGIMOTO Tomohiro ,  CHUMA Toshiaki

IPC分类号： H01R11/01 ,  H01B5/16 ,  H01L21/60 ,  H05K3/36

CPC分类号： H01L24/29 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2479/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83205 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T428/31678 ,  Y10T428/31699 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a conductive connecting material having a multilayered structure comprising a resin composition (A) and a metal foil (B) selected from a solder foil or a tin foil, wherein the volume ratio ((A)/(B)) of the resin composition (A) and the metal foil (B) selected from a solder foil or a tin foil in the conductive connecting material is 1-40 or 20-500, as well as a method for connecting terminals using the conductive connecting material. The conductive connecting material of the present invention is preferably used for electrically connecting electronic members in an electrical or electronic component.

摘要翻译： 本发明提供一种具有导电连接材料的多层结构，其包括一种树脂组合物（A）和从一个焊料箔或锡箔中的金属箔（B），worin的体积比（（A）/（B））的 从焊料箔或在连接的导电材料锡箔中树脂组合物（A）与金属箔（B）为1-40或20-500，以及用于连接用的导电连接材料端子的方法。 本发明的导电连接材料优选用于电到电气或电子部件连接的电子部件。

公开(公告)号：EP2357876A1

公开(公告)日：2011-08-17

申请号：EP09811542.1

申请日：2009-09-03

申请人： Sumitomo Bakelite Company Limited

发明人： OKADA Wataru ,  YAMAMOTO Michinori ,  CHUMA Toshiaki ,  MAEJIMA Kenzo ,  KAGIMOTO Tomohiro ,  KATSURAYAMA Satoru ,  FUJII, Tomoe

IPC分类号： H05K3/34 ,  C09J7/00 ,  C09J9/02 ,  C09J11/06 ,  C09J163/02 ,  C09J201/00 ,  H01R11/01

CPC分类号： H05K3/363 ,  C09J9/02 ,  C09J163/00 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T428/24917 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising; a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified.

摘要翻译： 本发明提供用于电子部件的电连接端子的导电连接材料，其具有层状结构，包括：包含树脂成分和具有助焊剂功能的化合物的固化性树脂组合物; 和从一个焊料箔和锡箔中的金属箔。 此外，本发明提供了一种连接端子的方法，包括; 的放置步骤，其中连接导电材料相对端子之间放置; 一个加热步骤，其中连接导电材料在的温度下加热，在所有这比所述金属箔的熔点以上，并在其中树脂组合物没有被完全固化的呼叫或树脂组合物被软化; 和固化步骤/凝固步骤，其中树脂组合物被固化或凝固。