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    RESIN COMPOSITION
    1.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号：EP4092065A1

    公开(公告)日：2022-11-23

    申请号：EP21741770.8

    申请日：2021-01-06

    申请人： Sumitomo Seika Chemicals Co., Ltd.

    发明人： HARISAKI, Ryota

    IPC分类号： C08G59/42 ,  C08L23/26 ,  C08L63/00 ,  C08K3/36 ,  C09J7/35 ,  H05K1/03

    摘要： Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25°C after storage for 168 hours under conditions of 85°C and 85% RH (relative humidity).

    LAMINATED BODY HAVING COPPER FOIL AND EPOXY RESIN COMPOSITION LAYER
    5.
    发明公开
    LAMINATED BODY HAVING COPPER FOIL AND EPOXY RESIN COMPOSITION LAYER 审中-公开

    公开(公告)号：EP4091811A1

    公开(公告)日：2022-11-23

    申请号：EP21741219.6

    申请日：2021-01-06

    申请人： Sumitomo Seika Chemicals Co., Ltd.

    发明人： HARISAKI, Ryota

    IPC分类号： B32B15/08 ,  B32B15/092 ,  H05K1/03

    摘要： Provided is copper foil with a resin layer, the resin layer having excellent adhesion, the copper foil exhibiting low dielectric characteristics, which is suitable for high-frequency applications, the copper foil being capable of exhibiting excellent transmission loss characteristics, i.e., exhibiting excellent characteristics of reducing transmission loss. More specifically, the present invention provides a laminate comprising copper foil and an epoxy resin composition layer, the epoxy resin composition layer being present on at least one surface of the copper foil, the epoxy resin composition containing an epoxy resin and an acid-modified polyolefin, wherein a test piece composed of the laminate and a prepreg has 90-degree peel strength between the copper foil and the prepreg of 0.6 N/mm or more as measured in accordance with JISC6481, and has a reduction rate of the 90-degree peel strength between the copper foil and the prepreg of 20% or less after immersion of the test piece in boiling water for 2 hours.

    EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION
    10.
    发明公开
    EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION 审中-公开
    环氧树脂组合物，其制备方法和所述组合物的用途

    公开(公告)号：EP3321302A1

    公开(公告)日：2018-05-16

    申请号：EP16824381.4

    申请日：2016-07-07

    申请人： Sumitomo Seika Chemicals Co., Ltd.

    发明人： FUKUDA, Noriaki ,  HARISAKI, Ryota ,  YAMAMOTO, Katsumasa ,  NEMOTO, Nobukatsu

    IPC分类号： C08G59/30 ,  C09J11/06 ,  C09J163/00 ,  H01L23/29 ,  H01L23/31

    CPC分类号： C08G59/30 ,  C09J11/06 ,  C09J163/00 ,  H01L23/29 ,  H01L23/31

    摘要： The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1):

    wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2):

    wherein Y is a bond, a C 1-6 alkylene group, etc.;
    R 1 is the same or different, and is a C 1-18 alkyl group, etc.,
    R 2 is the same or different, and is a C 1-18 alkylene group, etc.,
    R 3 is the same or different, and is a C 1-18 alkyl group, etc., and
    n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

    摘要翻译： 本发明提供可以制造保持良好的介电特性（低介电常数，低介电损耗角正切）且对金属的粘合强度高的固化物的环氧树脂组合物， 还提供了其制备方法，通过固化环氧树脂组合物获得的固化产物，以及其用途。 本发明包括含有环氧树脂，酸酐类固化剂和固化促进剂的环氧树脂组合物，所述环氧树脂由式（1）表示：其中X是通过除去两个氢原子而获得的二价基团 （2）代表的二价基团：其中Y是键，C1-6亚烷基等; R 1相同或不同，为碳原子数1〜18的烷基等，R 2相同或不同，为碳原子数1〜18的亚烷基等，R 3相同或不同，为碳原子数1〜 18烷基等，n相同或不同，为0〜3的整数。本发明还包括其制造方法，环氧树脂组合物的固化物及其用途。