公开(公告)号：EP0285669A4

公开(公告)日：1990-12-12

申请号：EP87906602

申请日：1987-10-08

申请人： TAKIRON CO. LTD.

发明人： IIDA, KOSUKE TAKIRON CO., LTD. ,  YAMATO, HIROSHI TAKIRON CO., LTD. ,  KADONO, YOJI TAKIRON CO., LTD.

IPC分类号： B32B27/00 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  C08J7/04 ,  H05K1/00 ,  H05K1/03

CPC分类号： H05K1/036 ,  C08J7/047 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2203/0759 ,  Y10T428/24967 ,  Y10T428/269 ,  Y10T428/31507 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31935 ,  Y10T428/31942

摘要： A functional film comprising a thermoplastic resin substrate having formed thereon a coating layer and a process for its production. The functional film has various improved properties such as heat resistance and is inexpensive and of general-purpose use. This film is produced by baking a thin film of phenol resin, epoxy resin, silicone resin or the like on a thermoplastic resin substrate, and can be utilized as flexible printed wiring board, insulating tape, etc.