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1.发明公开GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY AND HIGH RESIN FLOW RESISTANCE 审中-公开金合金丝用作具有高粘结可靠性的压接球高圆，高的GERADEVORRÜCKEIGENSCHAFT和高树脂流阻焊线
公开(公告)号：EP1901343A4
公开(公告)日：2012-06-20
申请号：EP06766496
申请日：2006-06-08
发明人： MAKI KAZUNARI , NAKATA YUJI
CPC分类号： C22C5/02 , B23K35/3013 , H01B1/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05144 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01028 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01063 , H01L2924/01067 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01205 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/01004 , H01L2924/01026 , H01L2924/01039 , H01L2924/013 , H01L2924/00 , H01L2924/01006
摘要： There is provided a gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: 10 to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.
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2.发明公开GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH INITIAL BONDING CAPABILITY, HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY, HIGH RESIN FLOW RESISTANCE AND LOW SPECIFIC RESISTANCE 审中-公开金合金线用作具有高的初始BONDIERUNGSFÄHIGKEIT，HIGHBONDIERUNGSZUVERLÄSSIGKEIT，一个压接BALL的高圆形，HIGH STRAIGHTVORRÜCKEIGENSCHAFT，HIGH树脂流动性和比低电阻接合线
公开(公告)号：EP1909317A4
公开(公告)日：2012-06-20
申请号：EP06766498
申请日：2006-06-08
发明人： MAKI KAZUNARI , NAKATA YUJI
CPC分类号： B23K35/3013 , C22C5/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/01105 , H01L2924/01205 , H01L2924/14 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/01063 , H01L2924/01077 , H01L2924/01004 , H01L2924/01078 , H01L2924/01038 , H01L2924/01056 , H01L2924/01046 , H01L2924/01057 , H01L2924/0102 , H01L2924/01047 , H01L2924/01083 , H01L2924/013 , H01L2924/00 , H01L2924/20751 , H01L2924/01006
摘要： There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities.
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3.发明公开GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH INITIAL BONDING CAPABILITY, HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY AND HIGH RESIN FLOW RESISTANCE 审中-公开金合金丝用作具有较高的初始结合的能力高粘结可靠性的压接球高圆，高GERADEVORRÜCKEIGENSCHAFT和高树脂流阻焊线
公开(公告)号：EP1901344A4
公开(公告)日：2012-06-20
申请号：EP06766497
申请日：2006-06-08
发明人： MAKI KAZUNARI , NAKATA YUJI
CPC分类号： B23K35/3013 , C22C5/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01063 , H01L2924/01067 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01205 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/01004 , H01L2924/01202 , H01L2924/013 , H01L2924/00 , H01L2924/01006
摘要： There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.
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