公开(公告)号：EP2571049A1

公开(公告)日：2013-03-20

申请号：EP11780575.4

申请日：2011-05-09

申请人： TDK Corporation ,  Noritake Co., Limited

发明人： SATOH, Minoru ,  YAMASHITA Takehiro ,  NAGAI Atsushi ,  ADACHI Yasuo

IPC分类号： H01L23/12 ,  H01B1/22 ,  H01L21/60

摘要： This electronic component (10) is provided with an inorganic substrate (20), a conductor film (30) formed on a surface of the substrate, and bonding wires (50, 55) bonded to a part of said conductor film, and wire bonding sections (40, 45) are formed on at least a part of the electronic component. The part of the conductor film at least forming the aforementioned wire bonding sections contains an Ag-based metal formed of Ag or an alloy having Ag as the main constituent and a metal oxide which coats said Ag-based metal and which has, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating quantity of the metal oxide is a quantity corresponding to 0.02 to 0.1 parts by mass relative to 100 parts by mass of the aforementioned Ag-based metal.

公开(公告)号：EP2571049B1

公开(公告)日：2020-03-25

申请号：EP11780575.4

申请日：2011-05-09

申请人： TDK Corporation ,  Noritake Co., Limited

发明人： SATOH, Minoru ,  YAMASHITA Takehiro ,  NAGAI Atsushi ,  ADACHI Yasuo

IPC分类号： H01L23/12 ,  H01B1/22 ,  H01L21/60 ,  H01B1/16 ,  H01L23/15 ,  H01L23/498 ,  H01L23/49