公开(公告)号：EP1866959A4

公开(公告)日：2010-09-15

申请号：EP06739524

申请日：2006-03-23

申请人： TEXAS INSTRUMENTS INC

发明人： WATANABE MASAKO ,  AMAGAI MASAZUMI

IPC分类号： H01L21/76 ,  H01L23/02 ,  H01L23/04

CPC分类号： H05K3/3478 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

摘要翻译： 一种半导体器件（1700），其包括具有轮廓（1711）的工件（1201）和多个接触焊盘（1205），并且还包括具有多个端子焊盘（1702）的外部部分（1701）。 该部分与工件间隔开，端子焊盘分别与工件接触焊盘对准。 回流元件（1203）将每个接触焊盘与其相应的端子焊盘互连。 热塑性材料（1204）填充工件与零件之间的空间; 该材料粘附到工件，部件和回流元件上。 此外，材料具有基本上与工件的轮廓一致的轮廓（1711），并且基本上没有空隙填充空间（1707）。 由于填充材料的热塑性特征，当达到回流元件的温度范围时，成品装置可以进行再加工。

公开(公告)号：EP1982353A4

公开(公告)日：2009-04-29

申请号：EP07710247

申请日：2007-01-22

申请人： TEXAS INSTRUMENTS INC

发明人： AMAGAI MASAZUMI ,  WATANABE MASAKO

IPC分类号： H01L23/29

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/11334 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/8388 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0191 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A tape for use as a carrier in semiconductor assembly, which has one or more base sheets (101) of polymeric, preferably thermoplastic, material having first (101a) and second (101b) surfaces. A polymeric adhesive film (102, 104) and a foil (103, 105) of different, preferably inert, material are attached to the base sheet on both the first and second surface sides; they thus provide a thickness (120) to the tape. A plurality of holes is formed through the thickness of the tape; the holes are preferably tapered with an angle between about 70° and 80° with the second tape surface. A reflow metal element (301), with a preferred diameter (302) about equal to the tape thickness, is held in each of the holes.