公开(公告)号：EP2973671A1

公开(公告)日：2016-01-20

申请号：EP14714930.6

申请日：2014-03-12

申请人： Schweizer Electronic AG

发明人： GOTTWALD, Thomas ,  NEUMANN, Alexander

IPC分类号： H01L21/60 ,  H01L23/538 ,  H01L25/07

CPC分类号： H01L25/072 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/221 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32013 ,  H01L2224/75252 ,  H01L2224/7625 ,  H01L2224/82001 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2224/82105 ,  H01L2224/83048 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/8388 ,  H01L2224/92144 ,  H01L2924/13091 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4608 ,  H01L2924/00012 ,  H01L2224/274 ,  H01L2924/00014 ,  H01L2224/2929

摘要： The invention relates to an electronic sub-assembly (36) having at least one electronic component (14) embedded in a sequence of layers, the electronic component(14) being arranged in a recess of an electrically conducting central layer (16) and directly adjoining a resin layer (12, 20) on each side.

摘要翻译： 一种电子子组件（36）包括嵌入在层的序列的至少一个电子部件（14），worin电子部件（14）以导电的中心层（16）的凹部被布置和直接邻接的树脂 在每一侧层（12，20）。

公开(公告)号：EP2840872A1

公开(公告)日：2015-02-25

申请号：EP14180520.0

申请日：2014-08-11

申请人： FUJITSU LIMITED

发明人： Okamoto, Keishiro ,  Sakuyama, Seiki

IPC分类号： H05K3/30 ,  H01L23/00 ,  H05K3/34 ,  H05K1/02 ,  H01L23/40

CPC分类号： H05K1/181 ,  B23K1/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/171 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/81007 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92 ,  H01L2224/9221 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K3/303 ,  H05K3/305 ,  H05K3/34 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： An electronic device includes: a first electronic component 10; first members 13 that are provided on a first surface of the first electronic component and that include outside surfaces 13a configured to face diagonally upward with respect to the first surface; a second electronic component 20 provided above the first surface; second members 23 that are provided corresponding to the first members on a second surface of the second electronic component which faces the first surface and that include inside surfaces 23a configured to face diagonally downward with respect to the second surface and configured to face the outside surfaces; and solder 30 that is provided between the first surface and the second surface and that electrically connects the first electronic component and the second electronic component.

摘要翻译： 电子设备包括：第一电子部件10; 第一构件13设置在第一电子部件的第一表面上，并且包括相对于第一表面对角地面对的外表面13a; 设置在第一表面上方的第二电子部件20; 第二构件23，其对应于第二电子部件的面对第一表面的第二表面上的第一构件，并且包括被构造成相对于第二表面对角地向下面并且被配置为面向外表面的内表面23a; 以及设置在第一表面和第二表面之间并且电连接第一电子部件和第二电子部件的焊料30。

公开(公告)号：EP1830399A4

公开(公告)日：2012-07-11

申请号：EP05816822

申请日：2005-12-14

申请人： PANASONIC CORP

发明人： KITAE TAKASHI ,  KARASHIMA SEIJI ,  HIRANO KOICHI ,  KOJIMA TOSHIYUKI ,  NAKATANI SEIICHI ,  KOMATSU SHINGO ,  YAMASHITA YOSHIHISA

IPC分类号： H01L21/60 ,  H01L21/48

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP2296175A4

公开(公告)日：2012-02-01

申请号：EP09746360

申请日：2009-05-13

申请人： SUMITOMO BAKELITE CO

发明人： NIKAIDO HIROKI ,  SUGINO MITSUO

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L23/49816 ,  C09J163/00 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/3114 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68336 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13022 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/73203 ,  H01L2224/81193 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/0052 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

公开(公告)号：EP2206756A1

公开(公告)日：2010-07-14

申请号：EP08845115.8

申请日：2008-08-29

申请人： Hitachi Chemical Company, Ltd.

发明人： NAKAZAWA, Takashi ,  ARIFUKU, Motohiro ,  KOJIMA, Kazuyoshi ,  MOCHIZUKI, Nichiomi

IPC分类号： C09J4/00 ,  C09J11/06 ,  H01B1/22 ,  H01L21/60 ,  H01R43/00 ,  H05K1/14 ,  H05K3/32

CPC分类号： H05K3/323 ,  H01B1/22 ,  H01B1/24 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0558 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/8388 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/361 ,  H05K2203/122 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability.

摘要翻译： 本发明的电路连接材料是一种电路连接材料，用于在具有形成在第一板的主侧上的第一电路电极的第一电路部件与形成在第一电路板主侧的第二电路电极的第二电路部件 第二电路板，第一电路电极和第二电路电极彼此面对，电路连接材料包含产生自由基的固化剂，自由基聚合物质和含有仲硫醇基团的化合物。 本发明的电路连接材料能够进行低温快速固化，并且具有优良的储存稳定性。

公开(公告)号：EP2200074A1

公开(公告)日：2010-06-23

申请号：EP08837752.8

申请日：2008-10-07

申请人： Hitachi Chemical Company, Ltd.

发明人： HATAKEYAMA, Keiichi ,  NAKAMURA, Yuuki

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/52

CPC分类号： H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29006 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The method for producing a semiconductor chip with an adhesive film of the present invention comprises steps of: preparing a laminate in which at least a divided semiconductor wafer comprising a plurality of semiconductor chips, obtained by forming a cut which separates the semiconductor wafer into a plurality of semiconductor chips on one side of the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut, an adhesive film for a semiconductor and a dicing tape are laminated, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 µm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an adhesive film.

摘要翻译： 在本发明的粘合剂片的制造半导体芯片的方法，包括以下步骤：准备层叠，其中，至少一个分割完成的半导体晶片，其包括半导体芯片的多元化，通过形成切割将半导体晶片分成多个获得的 对厚度小于半导体晶片的半导体晶片的一侧并通过研磨其上没有切口被形成为达到上粘接膜的切断的半导体和切割半导体晶片的另一侧的半导体芯片 胶带被层叠，对于具有厚度在1至15微米的范围内，以小于5％的拉伸断裂伸长率，和在断裂时的拉伸伸长率在最大为伸长率小于110％的半导体用粘接膜 负荷; 和将所述粘合膜的半导体通过拾取的半导体芯片中的多个层叠体的层叠方向，从而制备与电影粘接剂的半导体芯片。

公开(公告)号：EP1830399A1

公开(公告)日：2007-09-05

申请号：EP05816822.0

申请日：2005-12-14

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： KITAE, Takashi c/o Matsushita Electric Industrial Co., Ltd. ,  KARASHIMA, Seiji c/o Matsushita Electric Industrial Co., Ltd. ,  HIRANO, Koichi c/o Matsushita Electric Industrial Co., Ltd. ,  KOJIMA, Toshiyuki c/o Matsushita Electric Industrial Co., Ltd. ,  NAKATANI, Seiichi c/o Matsushita Electric Industrial Co., Ltd. ,  KOMATSU, Shingo c/o Matsushita Electric Industrial Co., Ltd. ,  YAMASHITA, Yoshihisa c/o Matsushita Electric Industrial Co., Ltd.

IPC分类号： H01L21/60 ,  H01B1/22

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

摘要翻译： 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括树脂，金属颗粒和在加热树脂13时沸腾的对流添加剂12.在加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和每个电极 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：EP1796155A1

公开(公告)日：2007-06-13

申请号：EP05776918.4

申请日：2005-08-30

申请人： Matsusita Electric Industrial Co., Ltd.

发明人： KARASHIMA, Seiji c/o MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., ,  YAMASHITA, Yoshihisa c/o MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., ,  TOMEKAWA, Satoru c/o MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., ,  KITAE, Takashi c/o MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., ,  NAKATANI, Seiichi c/o MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.,

IPC分类号： H01L21/60

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00014

摘要： There is provided a process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) comprising solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls resulting from the grown molten solder powder are concurrently formed on the electrodes (11) in self-alignment manner. Finally, by moving the flat plate (14) away from the surface of the supplied resin (13), followed by removing such resin (13), there is provided the substrate (10) wherein the bumps (16) are formed on the plurality of the electrodes.

摘要翻译： 提供了一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该方法中，将包含焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将基板（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤中，允许熔融焊料粉末自组装到电极（11）上，从而以自对准的方式在电极（11）上同时形成由生长的熔融焊料粉末产生的多个焊料球。 最后，通过使平板（14）远离供给的树脂（13）的表面移动，然后除去这种树脂（13），设置有在多个基板（10）上形成凸块（16）的基板 的电极。

公开(公告)号：EP1489655A1

公开(公告)日：2004-12-22

申请号：EP04076592.7

申请日：2004-05-28

申请人： ASM Assembly Automation Ltd.

发明人： Cheung, Yiu Ming ,  Chong, Chi Ming

IPC分类号： H01L21/58 ,  H05K13/04 ,  H01L21/68

CPC分类号： H01L24/83 ,  H01L21/67132 ,  H01L21/6838 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T156/171 ,  Y10T156/1744 ,  H01L2924/00

摘要： The invention provides a pick and place assembly for transferring a film of material. The assembly comprises a collet having a substantially convex contact surface for contacting the film, the collet including a vacuum suction device operative to generate a force to hold the film. The film may comprise a thermoplastic adhesive tape or B-stage thermoset epoxy coated film.

摘要翻译： 本发明提供了用于转移材料膜的拾取和放置组件。 组件包括具有用于接触薄膜的基本上凸起的接触表面的夹头，所述夹头包括用于产生保持薄膜的力的真空抽吸装置。 该膜可以包含热塑性胶带或B级热固性环氧涂层膜。

公开(公告)号：EP1432021A2

公开(公告)日：2004-06-23

申请号：EP03257934.4

申请日：2003-12-16

申请人： Omron Corporation

发明人：

IPC分类号： H01L21/60 ,  G06K19/077

CPC分类号： H01L23/49855 ,  G06K19/07745 ,  G06K19/0775 ,  H01L21/563 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81395 ,  H01L2224/8183 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H05K3/061 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0571 ,  H05K2203/1189 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2224/0401

摘要： A semiconductor bear chip (9) having a bump (10) subjected to high temperatures is pressed, from the upper side, onto a wiring board (8) including a wiring pattern, a thermosetting resin film (4) covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film (7) covering the thermosetting resin film (4), while applying a ultrasonic wave, thereby inserting the bumps (10) of the semiconductor bear chip (9) through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump (10) with the electrode area.