公开(公告)号：EP2520331A2

公开(公告)日：2012-11-07

申请号：EP12175079.8

申请日：2007-04-12

申请人： Proteus Digital Health, Inc.

发明人： Zdeblick, Mark J. ,  Costello, Benedict ,  Frank, Jeremy ,  Jensen, Marc ,  Thompson, Todd ,  Islam, Mohammed Z.

IPC分类号： A61N1/375 ,  H05K3/40

CPC分类号： A61N1/05 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/63 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  Y10T29/49117 ,  H01L2924/00

摘要： An implantable integrated circuit structure comprising a conformal thin-film sealing layer for hermetically sealing circuitry layers is provided. Also disclosed are electrode structures, leads that include the same, implantable pulse generators that include the leads, as well as systems and kits having components thereof, other implantable devices utilizing the structures, and methods of making and using the subject structures.

摘要翻译： 提供了一种包括用于密封电路层的保形薄膜密封层的可植入集成电路结构。 还公开了电极结构，包括相同的引线，包括引线的可植入脉冲发生器，以及具有其部件的系统和套件，利用该结构的其它可植入装置，以及制造和使用对象结构的方法。

公开(公告)号：EP2030210A2

公开(公告)日：2009-03-04

申请号：EP07755518.3

申请日：2007-04-12

申请人： Proteus Biomedical, Inc.

发明人： ZDEBLICK, Mark J. ,  COSTELLO, Benedict ,  FRANK, Jeremy ,  JENSEN, Marc ,  THOMPSON, Todd ,  ISLAM, Mohammed Z.

IPC分类号： H01G4/005

CPC分类号： A61N1/05 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/63 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  Y10T29/49117 ,  H01L2924/00

摘要： An implantable integrated circuit structure comprising a conformal thin-film sealing layer for hermetically sealing circuitry layers is provided. Also disclosed are electrode structures, leads that include the same, implantable pulse generators that include the leads, as well as systems and kits having components thereof, other implantable devices utilizing the structures, and methods of making and using the subject structures.

公开(公告)号：EP4362080A1

公开(公告)日：2024-05-01

申请号：EP22204466.1

申请日：2022-10-28

申请人： Siemens Aktiengesellschaft

发明人： Strogies, Jörg ,  Heimann, Matthias ,  Müller, Bernd

IPC分类号： H01L23/40 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/49811 ,  H01L23/40 ,  H01L24/63 ,  H01L24/72

摘要： Es wird eine Schaltungsanordnung mit einer Halbleiterbaugruppe mit einer Mehrzahl von parallel zueinander angeordneten Kontaktstiften und einem Schaltungsträger mit einer Mehrzahl von den Kontaktstiften zugeordneten innenmetallisierten Kontaktöffnungen angegeben, wobei die Kontaktstifte in die Kontaktöffnungen eingesteckt sind und die Kontaktöffnungen an ihrer Innenseite ein Material aufweisen, dessen Schmelzpunkt bei einer Temperatur von höchstens 150 °C liegt.

公开(公告)号：EP2356683B1

公开(公告)日：2016-01-27

申请号：EP09764001.5

申请日：2009-11-19

申请人： Kromek Limited

发明人： RADLEY, Ian

IPC分类号： H01L27/146

CPC分类号： H01L27/14634 ,  H01L24/32 ,  H01L24/63 ,  H01L24/64 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14

公开(公告)号：EP2030210A4

公开(公告)日：2010-04-14

申请号：EP07755518

申请日：2007-04-12

申请人： PROTEUS BIOMEDICAL INC

发明人： ZDEBLICK MARK J ,  COSTELLO BENEDICT ,  FRANK JEREMY ,  JENSEN MARC ,  THOMPSON TODD ,  ISLAM MOHAMMED Z

IPC分类号： H01G4/005

CPC分类号： A61N1/05 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/63 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  Y10T29/49117 ,  H01L2924/00

公开(公告)号：EP2520331A3

公开(公告)日：2013-02-20

申请号：EP12175079.8

申请日：2007-04-12

申请人： Proteus Digital Health, Inc.

发明人： Zdeblick, Mark J. ,  Costello, Benedict ,  Frank, Jeremy ,  Jensen, Marc ,  Thompson, Todd ,  Islam, Mohammed Z.

IPC分类号： A61N1/375 ,  H05K3/40

CPC分类号： A61N1/05 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/63 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  Y10T29/49117 ,  H01L2924/00

摘要： An implantable integrated circuit structure comprising a conformal thin-film sealing layer for hermetically sealing circuitry layers is provided. Also disclosed are electrode structures, leads that include the same, implantable pulse generators that include the leads, as well as systems and kits having components thereof, other implantable devices utilizing the structures, and methods of making and using the subject structures.

公开(公告)号：EP0413542A3

公开(公告)日：1991-12-04

申请号：EP90308888.8

申请日：1990-08-13

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Chiu, Anthony ,  Test, Howard

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： G01R31/2863 ,  H01L22/32 ,  H01L23/49572 ,  H01L24/63 ,  H01L25/105 ,  H01L2224/32188 ,  H01L2224/50 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/182 ,  H01L2924/00

摘要： A semiconductor package structure allows testing and includes a fuse link (19) to indicate a short circuit in a semiconductor device (14) before it is incorporated into a circuit. The package structure allows mounting a semiconductor device (14) entire within an opening in a printed circuit board (25) and permits stacking of printed circuit board in a minimum thickness configuration.

公开(公告)号：EP0413542A2

公开(公告)日：1991-02-20

申请号：EP90308888.8

申请日：1990-08-13

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Chiu, Anthony ,  Test, Howard

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： G01R31/2863 ,  H01L22/32 ,  H01L23/49572 ,  H01L24/63 ,  H01L25/105 ,  H01L2224/32188 ,  H01L2224/50 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/182 ,  H01L2924/00

摘要： A semiconductor package structure allows testing and includes a fuse link (19) to indicate a short circuit in a semiconductor device (14) before it is incorporated into a circuit. The package structure allows mounting a semiconductor device (14) entire within an opening in a printed circuit board (25) and permits stacking of printed circuit board in a minimum thickness configuration.

摘要翻译： 半导体封装结构允许测试并且包括熔丝链路（19），以在其被并入电路之前指示半导体器件（14）中的短路。 封装结构允许将半导体器件（14）整体安装在印刷电路板（25）中的开口内，并允许以最小厚度配置堆叠印刷电路板。

公开(公告)号：EP2356683A1

公开(公告)日：2011-08-17

申请号：EP09764001.5

申请日：2009-11-19

申请人： Kromek Limited

发明人： RADLEY, Ian

IPC分类号： H01L27/146

CPC分类号： H01L27/14634 ,  H01L24/32 ,  H01L24/63 ,  H01L24/64 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14

摘要： A method of bonding a semiconductor structure to a substrate to effect both a mechanical bond and a selectively patterned conductive bond, comprising the steps of mechanically bonding a semiconductor structure to a substrate by means of a bonding layer; providing gaps in the bonding layer generally corresponding to a desired conductive bond pattern; providing vias though the substrate generally positioned at the gaps in the bonding layer; causing electrically conductive material to contact the semiconductor structure exposed through the vias. A device made in accordance with the method is also described.

公开(公告)号：EP2148367B1

公开(公告)日：2011-03-23

申请号：EP09008701.6

申请日：2009-07-03

申请人： Semikron Elektronik GmbH & Co. KG Patentabteilung

发明人： Knebel, Markus

IPC分类号： H01L25/07 ,  H01L23/367

CPC分类号： H01L25/072 ,  H01L23/041 ,  H01L23/3675 ,  H01L23/4985 ,  H01L24/63 ,  H01L2224/32188 ,  H01L2224/83205 ,  H01L2224/8384 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/16195 ,  H01L2924/00015