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    Catalytic converters - metal foil material for use therein, and a method of making the material
    5.
    发明公开
    Catalytic converters - metal foil material for use therein, and a method of making the material 无效
    的催化转化器 - 金属箔和其应用，并且处理其制备。

    公开(公告)号：EP0640390A2

    公开(公告)日：1995-03-01

    申请号：EP94305638.2

    申请日：1994-07-29

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Jha, Sunil C. ,  Forster, James A.

    IPC: B01J35/04 ,  B01D53/94 ,  F01N3/28 ,  B23K20/227

    CPC classification number: B01D53/945 ,  B01J35/02 ,  B23K20/04 ,  B23K2203/05 ,  B23K2203/10 ,  F01N3/2807 ,  Y02T10/22 ,  Y10S428/941 ,  Y10T29/49345 ,  Y10T428/12431

    Abstract: A metal foil substrate material 50 for catalytic converters 54 and method of making the material in which layers (10, 12, 14) of ferritic stainless steel and aluminum are solid state metallurgically bonded together forming a composite material 24. Such composite material 24 is further rolled to the final foil gauge with no heat treatment and then subjected to a thermal in situ reaction to form a resulting uniform solid solution foil material 50 with superior high temperature corrosion resistance.

    Abstract translation: 甲箔衬底材料为在催化转换器的使用prepd。 通过：（a）提供选自Cr-contg选择的第一材料的层。 黑色金属和Al及其合金; （B）不同的夹持铬contg的层之间的第一层。 铁合金或Al及其合金; （C）通过减小厚度，以形成第一和第二材料的多层复合材料层冶金结合在一起; （D）降低了复合材料的最终厚度和加热在900-1200 0℃足够的时间以实现所述层的金属成分的扩散在整个复合材料，得到了均质的固体SOLN。 材料为箔衬底。 厚度红T1。 由压力轧制未经热处理实现。

    Heat exchanger assemblies - material for use therein, and a method of making the material
    6.
    发明公开
    Heat exchanger assemblies - material for use therein, and a method of making the material 失效
    热交换结构，从而施加的材料和制备该材料的方法。

    公开(公告)号：EP0671240A1

    公开(公告)日：1995-09-13

    申请号：EP95301404.0

    申请日：1995-03-03

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Jha, Sunil C. ,  Forster, James A.

    IPC: B23K35/02

    CPC classification number: B23K35/0238 ,  B23K35/3033 ,  B23K35/304 ,  F28F19/06

    Abstract: A self-brazing material 10 for use in a heat exchanger 50 using a corrosive heat exchanger fluid is manufactured by providing a first substrate layer 10 and a second layer 12 metallurgically bonding the two layers together to form a composite material 22. This second layer 12 is made of a material chosen from a group consisting of materials capable of having good high temperature and corrosive properties, and melting at a temperature well below that of the first material 10. The bonded material 22 is then reacted so as to render the second layer 12 a brazing layer for the first substitute layer 10 with excellent high temperature and corrosive properties.

    Abstract translation: 使用腐蚀性流体的热交换器的自钎焊材料10在热交换器50的使用受到提供第一层的衬底10和第二层12中的两个层冶金结合在一起。制造，以形成复合材料22该第二层12 由从以下一组的能够具有良好的高温和腐蚀特性，并且在远低于做的第一材料10的粘结材料的温度下熔融的材料中选择的材料22随后反应以使该第二层 12，用于具有优良的高温和腐蚀特性的第一替代层10钎焊层。

    A heat-transferring circuit substrate with limited thermal expansion and method for making same
    7.
    发明公开
    A heat-transferring circuit substrate with limited thermal expansion and method for making same 失效
    用其生产有限的热膨胀和方法传热电路基板。

    公开(公告)号：EP0550999A1

    公开(公告)日：1993-07-14

    申请号：EP92311673.5

    申请日：1992-12-21

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Jha, Sunil C. ,  Forster, James A.

    IPC: H01L23/373 ,  H01L21/48 ,  H05K1/05 ,  B23K20/04

    CPC classification number: B32B15/015 ,  B23K20/02 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/068 ,  H05K2203/0323 ,  Y10T428/12486 ,  Y10T428/12632 ,  H01L2924/00

    Abstract: Layers of copper (10) and Invar (12) are cold pressure rolled with reduction in thickness to be metallurgically bonded together in interleaved relation, and strips (20) of the bonded materials are cold pressure rolled together a plurality of times with reduction in thickness to be metallurgically bonded together to form a metal composite (208) and to break up the layers of Invar in the composite, thereby to distribute portions of the Invar material (12.1) in a copper matrix (10.1) to limit thermal expansion of the composite while permitting the matrix to extend in continuous phase along three mutually perpendicular axes through the composite substantially free of diffusion between the copper and Invar materials.

    Abstract translation: 铜（10）和因瓦合金（12）的层具有厚度减小轧制冷压力，以在交错关系来冶金结合在一起，并且结合材料的条带（20）的冷压力卷在一起的次多个与厚度减小 被冶金结合到一起以形成金属复合物（208）和以破碎殷钢的各层中复合，从而在铜基质（10.1）分发殷钢材料（12.1）的部分，以限制该复合材料的热膨胀 同时允许基质在连续相中沿三个相互垂直的轴线穿过复合基本上不含铜和殷钢材料之间的扩散的延伸。

    A substrate for an electrical circuit system and a circuit system using that substrate
    8.
    发明公开
    A substrate for an electrical circuit system and a circuit system using that substrate 失效
    用于电路系统的基板和使用该基板的电路系统

    公开(公告)号：EP0366338A3

    公开(公告)日：1990-11-22

    申请号：EP89310692.2

    申请日：1989-10-18

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Sukonnik Israil M. ,  Forster, James A. ,  Breit, Henry F. ,  Raphanella, Gary A.

    IPC: H01L23/14 ,  H01L21/48

    CPC classification number: H01L23/142 ,  H01L21/4846 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/07802 ,  H05K1/053 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

    Abstract: An electrical circuit system having a semiconductor device (14) electrically and thermally connected to an electrically conductive circuit layer (16) of a substrate (12) and having a heat-dissipating base layer (18) of an aluminum metal material in the substrate has an electrically insulating hard coating dielectric layer (20) of aluminum oxide directly adherent to the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer while providing improved heat-transfer to the base layer, the aluminum metal material of the base layer being substantially free of iron and copper constituents and the electrically insulating hard coating of aluminum oxide being substantially free of iron and copper inclusions for achieving the selected electrically insulated relationship with a very thin dielectric layer to provide improved heat-transfer between the electrically conductive circuit layer and the base layer. Preferably the electrically insulating hard coating layer of aluminum oxide comprises a multiplicity of sections of the aluminum oxide hard coating material which are individually adherent to the base layer and are separated by an electrically insulating adhesive material which is disposed on and between the sections of the hard coating layer for cooperating with the sections of the hard coating layer in securely bonding and mounting the electrically conductive circuit layer in the desired electrically insulated relation to the base layer with improved heat-transfer to the base layer.

    A substrate for an electrical circuit system and a circuit system using that substrate
    9.
    发明公开
    A substrate for an electrical circuit system and a circuit system using that substrate 失效
    基板的电子电路系统，并与该基板的电路系统。

    公开(公告)号：EP0366338A2

    公开(公告)日：1990-05-02

    申请号：EP89310692.2

    申请日：1989-10-18

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Sukonnik Israil M. ,  Forster, James A. ,  Breit, Henry F. ,  Raphanella, Gary A.

    IPC: H01L23/14 ,  H01L21/48

    CPC classification number: H01L23/142 ,  H01L21/4846 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/07802 ,  H05K1/053 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

    Abstract: An electrical circuit system having a semiconductor device (14) electrically and thermally connected to an electrically conductive circuit layer (16) of a substrate (12) and having a heat-dissipating base layer (18) of an aluminum metal material in the substrate has an electrically insulating hard coating dielectric layer (20) of aluminum oxide directly adherent to the base layer mounting the electrically conductive circuit layer thereon in selected electrically insulated relation to the base layer while providing improved heat-transfer to the base layer, the aluminum metal material of the base layer being substantially free of iron and copper constituents and the electrically insulating hard coating of aluminum oxide being substantially free of iron and copper inclusions for achieving the selected electrically insulated relationship with a very thin dielectric layer to provide improved heat-transfer between the electrically conductive circuit layer and the base layer. Preferably the electrically insulating hard coating layer of aluminum oxide comprises a multiplicity of sections of the aluminum oxide hard coating material which are individually adherent to the base layer and are separated by an electrically insulating adhesive material which is disposed on and between the sections of the hard coating layer for cooperating with the sections of the hard coating layer in securely bonding and mounting the electrically conductive circuit layer in the desired electrically insulated relation to the base layer with improved heat-transfer to the base layer.

    Abstract translation: 底物，具有半导体装置（14）在一个（12）导电电路层（16）电连接和热连接到具有在基片的铝金属材料制成的散热基底层（18）的电路系统，并具有 的电绝缘性硬质涂层的氧化铝的介电层（20）直接粘附到基底层中选择的电绝缘相对于基体层在其上的导电电路层安装，同时提供改进的热传递到基体层中，铝的金属材料 的基极层基本上不含铁和铜成分和电绝缘的氧化铝基本上不含铁和铜的夹杂物的用于实现与非常薄的介电层所选择的电绝缘的关系，以提供之间的改进的热传递硬涂层 导电电路层和基极层。 优选地，所述电绝缘性硬质涂层的氧化铝的层包括单独粘附到所述基层和由在电绝缘粘合剂材料的所有其上和硬的部分之间设置分离氧化铝硬涂层材料的部分的多个 用于牢固地接合和安装在所期望的电绝缘关于与改善的热传递到所述基本层中的基本层中的导电电路层与硬涂层的部分配合的涂层。

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