PROCESSOR
    1.
    发明公开
    PROCESSOR 失效
    电解液处理器

    公开(公告)号:EP1008674A1

    公开(公告)日:2000-06-14

    申请号:EP98912715.4

    申请日:1998-04-08

    摘要: A processing system is provided with insulating members capable of easily fitted in, removed from and positioned in gas discharge holes, respectively.
    An etching system (100) is provided with an upper electrode (128) provided with gas discharge holes (128a) of a shape corresponding to the external shape of insulating members (144). The insulating members (144) are formed of a poly(ether ether ketone) resin, a polyimide resin, a poly(ether imide) resin or the like. Each insulating member 144 is provided in its outer surface with a step (144a). The length of the insulating members (144) is shorter than that of the gas discharge holes (128a). Each insulating member (144) is provided with a longitudinal through hole (144d), and an end part of the through hole (144d) on the side of a processing chamber (102) is tapered so as to expand toward the processing chamber (102). The insulating members (144) are pressed in the gas discharge holes (128a) from the side of the outlet ends of the gas discharge holes (128a) so as to bring the steps (144a) into contact with shoulders (128b) formed in the sidewalls of the gas discharge holes (128a). A part of each insulating member (144) as fitted in the gas discharge hole (128a) project from a surface of the upper electrode (128) facing a susceptor (110).

    摘要翻译: 处理系统设置有能够分别容易地装配在气体排放孔中并定位在排气孔中的绝缘构件。 蚀刻系统(100)设置有设置有与绝缘构件(144)的外部形状对应的形状的气体排出孔(128a)的上部电极(128)。 绝缘构件(144)由聚(醚醚酮)树脂,聚酰亚胺树脂,聚(醚酰亚胺)树脂等形成。 每个绝缘构件144在其外表面上设置有台阶(144a)。 绝缘构件(144)的长度比气体排出孔(128a)的长度短。 每个绝缘构件(144)设置有纵向通孔(144d),并且在处理室(102)侧的通孔(144d)的端部是锥形的,以朝向处理室(102) )。 绝缘构件(144)从气体排出孔(128a)的出口端的一侧被压在排气孔(128a)中,以使步骤(144a)与形成在气体排出孔(128a)中的肩部(128b)接触 气体排出孔(128a)的侧壁。 安装在气体排出孔(128a)中的每个绝缘构件(144)的一部分从面向基座(110)的上部电极(128)的表面突出。

    VACUUM PROCESSING SYSTEM
    3.
    发明公开
    VACUUM PROCESSING SYSTEM 审中-公开
    VAKUUMPROZESSSYSTEM

    公开(公告)号:EP1146548A1

    公开(公告)日:2001-10-17

    申请号:EP99972368.7

    申请日:1999-11-17

    IPC分类号: H01L21/00 H01L21/68

    摘要: A vacuum process system comprises: a load port on which an object to be processed is set; a common transfer chamber disposed adjacent to the load port, having an internal space set at an atmospheric pressure level, and including a first transfer device that is movable and transfers the object into/from the load port, the first transfer device being disposed within the internal space; and a process unit having one process chamber for subjecting the object to a predetermined process, and a vacuum transfer chamber connected to the process chamber, having an internal space set at a vacuum pressure level, and including a second transfer device for transferring the object into/from the process chamber, the second transfer device being disposed within the internal space. The process units are individually connected to the common transfer chamber such that the process units are substantially parallel to each other. The vacuum chamber of each process unit is connected to the common transfer chamber. Each process unit extends linearly in a direction substantially perpendicular to the common transfer chamber. The object is transferred into/from the vacuum transfer chamber by means of the first transfer device.

    摘要翻译: 真空处理系统包括:设置有待处理物体的装载口; 设置在负载端口附近的公共传送室,其具有设定在大气压力水平的内部空间,并且包括第一传送装置,其可移动并将物体传送到/从装载端口传送,第一传送装置设置在 内部空间; 以及处理单元,其具有用于使物体进行预定处理的一个处理室和连接到处理室的真空传送室,其具有设置在真空压力水平的内部空间,并且包括用于将物体转移到第二传送装置 /从处理室,第二传送装置设置在内部空间内。 处理单元分别连接到公共传送室,使得处理单元基本上彼此平行。 每个处理单元的真空室连接到公共传送室。 每个处理单元在基本上垂直于公共传送室的方向上线性地延伸。 物体通过第一传送装置传送到/从真空传送室传送。