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1.发明公开RELIABILITY EVALUATION TESTER, RELIABILITY EVALUATION TEST SYSTEM, CONTACTOR, AND RELIABILITY EVALUATION TEST METHOD 有权系统VERFAHREN ZURZUVERLÄSSIGKEITSBEWERTUNG
公开(公告)号：EP1455388A1
公开(公告)日：2004-09-08
申请号：EP02788667.0
申请日：2002-11-27
发明人： Takekoshi, Kiyoshi, TOKYO ELECTRON AT LIMITED , Hosaka, Hisatomi, TOKYO ELECTRON AT LIMITED , Hagihara, Junichi, TOKYO ELECTRON AT LIMITED , Hatsushika, Kunihiko, TOKYO ELECTRON AT LIMITED , Usui, Takamasa , Kaneko, Hisashi , Hayasaka, Nobuo , Ido, Yoshiyuki
IPC分类号： H01L21/66
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus (10) of this invention includes a wafer storage section (12) which stores a wafer (W) in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor (11) are totally in electrical contact with each other. The wafer storage section (12) transmits/receives a test signal to/from a measurement section (15) and has a hermetic and heat insulating structure. The wafer storage section (12) has a pressure mechanism (13) which presses the contactor (11) and a heating mechanism (14) which directly heats the wafer (W) totally in contact with the contactor (11) to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译： 本发明的可靠性评价试验装置（10）包括晶片储存部（12），其存储晶片（W）的状态，其中形成在晶片上的多个器件的电极焊盘和接触器（11 ）彼此完全电接触。 晶片存储部分（12）向/从测量部分（15）发送/接收测试信号，并具有密封和隔热结构。 晶片储存部分（12）具有压力接触器（11）的压力机构（13）和将与接触器（11）完全接触的晶片（W）直接加热至预定高温的加热机构（14） 。 在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。
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公开(公告)号：EP1455388B1
公开(公告)日：2008-05-07
申请号：EP02788667.0
申请日：2002-11-27
发明人： Takekoshi, Kiyoshi, TOKYO ELECTRON AT LIMITED , Hosaka, Hisatomi, TOKYO ELECTRON AT LIMITED , Hagihara, Junichi, TOKYO ELECTRON AT LIMITED , Hatsushika, Kunihiko, TOKYO ELECTRON AT LIMITED , Usui, Takamasa , Kaneko, Hisashi , Hayasaka, Nobuo , Ido, Yoshiyuki
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability tester (10) comprises a wafer containing section (12) containing a wafer (W) in the state that electrode pads of many devices formed on the wafer are all in electrical contact with bumps of a contactor (11). This wafer containing section (12) transmits/receives test signals with a measuring section (15) and has a hermetic and heat-insulating structure. The wafer containing section (12) has a pressing mechanism (13) for pressing the contactor (11) and a heating mechanism (14) for directly heating the wafer (W) in all contact with the contactor (11) to a predetermined high temperature. Thus, this tester evaluates the reliability of a wiring film and that of an insulation film formed on the semiconductor wafer under an acceleration condition.
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3.发明公开
公开(公告)号：EP1696479A1
公开(公告)日：2006-08-30
申请号：EP06009917.3
申请日：2002-11-27
发明人： Takekoshi, Kiyoshi, TOKYO ELECTRON AT LIMITED , Hosaka, Hisatomi, TOKYO ELECTRON AT LIMITED , Hagihara, Junichi, TOKYO ELECTRON AT LIMITED , Hatsushika, Kunihiko, TOKYO ELECTRON AT LIMITED , Usui, Takamasa , Kaneko, Hisashi , Hayasaka, Nobuo , Ido, Yoshiyuki
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus (10) of this invention includes a wafer storage section (12) which stores a wafer (W) in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor (11) are totally in electrical contact with each other. The wafer storage section (12) transmits/receives a test signal to/from a measurement section (15) and has a hermetic and heat insulating structure. The wafer storage section (12) has a pressure mechanism (13) which presses the contactor (11) and a heating mechanism (14) which directly heats the wafer (W) totally in contact with the contactor (11) to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译： 本发明的可靠性评价试验装置（10）包括晶片储存部（12），其存储晶片（W）的状态，其中形成在晶片上的多个器件的电极焊盘和接触器（11 ）彼此完全电接触。 晶片存储部分（12）向/从测量部分（15）发送/接收测试信号，并具有密封和隔热结构。 晶片储存部分（12）具有压力接触器（11）的压力机构（13）和将与接触器（11）完全接触的晶片（W）直接加热至预定高温的加热机构（14） 。 在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。
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