公开(公告)号：EP1873790A1

公开(公告)日：2008-01-02

申请号：EP06728673.2

申请日：2006-03-07

申请人： TOYO ALUMINIUM KABUSHIKI KAISHA

发明人： KIKUCHI, Ken ,  NAKAHARA, Jun ,  WATSUJI, Takashi ,  LAI, Gaochao ,  YOKOE, Kazuhiko

IPC分类号： H01B1/22 ,  H01L21/28 ,  H01L21/288 ,  H01L31/04

CPC分类号： H01B1/22 ,  C03C8/04 ,  C03C8/10 ,  C03C8/18 ,  C03C14/002 ,  C03C14/006 ,  C03C2214/06 ,  C03C2214/08 ,  C03C2214/16 ,  H01L31/022425 ,  Y02E10/50

摘要： Disclosed herein are a paste composition capable of, even when the thickness of a silicon semiconductor substrate (1) is reduced, satisfactorily achieving a desired BSF effect and suppressing the deformation (bow) of the silicon semiconductor substrate (1) occurring after the firing of the paste composition without reducing the mechanical strength of an obtained electrode (8) and the adhesion of the electrode (8) to the silicon semiconductor substrate (1), an electrode (8) formed using the paste composition, and a solar cell element including the electrode (8). The paste composition is used for forming an electrode on a silicon semiconductor substrate (1), and contains aluminum powder, an organic vehicle, and whisker insoluble or hardly-soluble in the organic vehicle, the whisker being previously mixed with the aluminum powder and the organic vehicle. The solar cell element includes an electrode (8) formed by applying a paste composition having the above-described characteristics onto the silicon semiconductor substrate (1) and then firing the paste composition.

摘要翻译： 这里公开了一种即使当硅半导体衬底（1）的厚度减小时，也能够令人满意地实现所需的BSF效应并且抑制在烧制之后发生的硅半导体衬底（1）的变形（弓） 不降低所得电极（8）的机械强度和电极（8）与硅半导体基板（1）的密合性的糊剂组合物，使用该糊剂组合物形成的电极（8），以及太阳能电池元件 电极（8）。 糊状组合物用于在硅半导体基板（1）上形成电极，并且在有机载体中含有铝粉末，有机载体和不溶于或难溶的晶须，所述晶须预先与铝粉末和 有机车。 太阳能电池元件包括通过将具有上述特性的糊剂组合物施加到硅半导体衬底（1）上形成的电极（8），然后焙烧该糊剂组合物。

公开(公告)号：EP1873790B1

公开(公告)日：2011-09-14

申请号：EP06728673.2

申请日：2006-03-07

申请人： TOYO ALUMINIUM KABUSHIKI KAISHA

发明人： KIKUCHI, Ken ,  NAKAHARA, Jun ,  WATSUJI, Takashi ,  LAI, Gaochao ,  YOKOE, Kazuhiko

IPC分类号： H01B1/22 ,  H01L21/28 ,  H01L21/288 ,  H01L31/04

CPC分类号： H01B1/22 ,  C03C8/04 ,  C03C8/10 ,  C03C8/18 ,  C03C14/002 ,  C03C14/006 ,  C03C2214/06 ,  C03C2214/08 ,  C03C2214/16 ,  H01L31/022425 ,  Y02E10/50

摘要： Disclosed is a paste composition which enables to adequately obtain a desired BSF effect without lowering the mechanical strength or adhesion of an electrode (8) even when a silicon semiconductor substrate (1) is thin. This paste composition also enables to suppress deformation (warping) of the silicon semiconductor substrate (1) after firing. Also disclosed are an electrode (8) formed by using such a paste composition, and a solar cell device comprising such an electrode (8). Specifically disclosed is a paste composition for forming an electrode on a silicon semiconductor substrate (1) which contains an aluminum powder, an organic vehicle, and a whisker which is insoluble or poorly soluble in the organic vehicle. The whisker is mixed with the aluminum powder and the organic vehicle in advance. Also specifically disclosed is a solar cell device comprising an electrode (8) which is formed by applying such a paste composition on a silicon semiconductor substrate (1) and then firing the applied paste composition.